List of Qualcomm Snapdragon systems on chips

This is alist ofQualcomm Snapdragonsystems on chips(SoC) made byQualcommfor use insmartphones,tablets,laptops,2-in-1 PCs,smartwatches,andsmartbooksdevices.

Qualcomm Snapdragon

General information
Launched	November 2007(November 2007)
Designed by	Qualcomm
Architecture and classification
Application	MobileSoCand2-in-1 PC
Microarchitecture	ARM9,ARM11,ARM Cortex-A,Cortex-X1,Cortex-X2,Cortex-X3,Cortex-X4,Scorpion,Krait,Kryo,Oryon
Instruction set	ARMv6,ARMv7-A,ARMv8-A,ARMv9-A
Physical specifications
Cores	1, 2, 4, 6, 8 or 12

Before Snapdragon

SoC made byQualcommbefore it was renamed toSnapdragon.

• MSM (Mobile Station Modem)
• QSC (Qualcomm Single Chip)

Model number	Fab	CPU	GPU(or Gfx Core)	Connectivity	Sampling availability
QSC1xxx
QSC1100	65nm	ARM926EJ-S @ 96/128 MHz		CDMA	Q4 2007
QSC1110
QSC1105		ARM926EJ-S @ 211 MHz		CDMA	2010
QSC1215					Q3 2012
QSC6xxx
QSC6010		ARMv5TEJ ARM926EJ-S	No 3D, ARM 2D	CDMA	2006
QSC6020
QSC6030
QSC6055	65nm	ARM926EJ-S @ 192 MHz		HSDPA, 1xEV-DO	Q1 2007
QSC6065				HSDPA, 1xEV-DO	Q2 2007
QSC6075				1xEV-DO Rev.0
QSC6085				1xEV-DO Rev.A	Q4 2007
QSC6155	45nm	ARM1136JF-S @ 480 MHz w/ L2	HVGA @30fps	GSM, EDGE, HSPA+ EV-DO Rev.0/A/B	2008
QSC6165
QSC6175
QSC6185
QSC6195
QSC6240 (ESC6240)	65nm	ARM926EJ-S @ 184/230 MHz	No 3D, ARM 2D	HSDPA	Q3 2007
QSC6245-1
QSC6260-1				GSM, GPRS, EDGE, HSDPA
QSC6270 (ESC6270)
QSC6290	45nm	ARM926EJ-S @ 300 MHz	WQVGA @15fps	HSUPA, UMTS	2009
QSC6285	45nm	ARM1136JF-S @ 480 MHz w/ L2	aDSP @ 160 MHz	CDMA2000, GSM, GPRS, EDGE, EV-DO Rel.0, BT 3.0	2009
QSC6295 (ESC6295)
QSC6695
MSM3xxx
MSM3000	350 nm	ARM7TDMI		CDMA	Feb 1998
MSM3100					Feb 1999
MSM3300					2000
MSM5xxx
MSM5000		ARM7TDMI		CDMA2000	2000
MSM5100		ARM7TDMI @ 50 MHz		CDMA, AMPS, PCS	2002
MSM5105		ARM7TDMI @ 27 MHz
MSM5500		ARM7TDMI @ 50 MHz
MSM6xxx
MSM6000		ARM7TDMI @ 20 MHz		CDMA	2005
MSM6025
MSM6050		ARM7TDMI @ 40 MHz
MSM6100		ARM926EJ-S @ 146 MHz	ARM-DSP 3D, ARM 2D	CDMA	2006
MSM6125
MSM6150			Defender2 3D,ARM 2D
MSM6175
MSM6225			No 3D, ARM 2D	HSDPA
MSM6250		ARM926EJ-S @ 180 MHz	ARM-DSP 3D, ARM 2D	WCDMA	2006
MSM6250A			No 3D, ARM 2D
MSM6245		ARM926EJ-S @ 180 MHz		WEDGE
MSM6255A
MSM6260		ARMv5TEJ ARM926EJ-S @ 225 MHz	ARM-DSP 3D, ARM 2D	HSUPA
MSM6275			Defender2 3D,ARM 2D
MSM6280
MSM6280A			Stargate 3D,ARM 2D		2007
MSM6500	130 nm	ARMv5TEJ ARM926EJ-S @ 150 MHz	ARM-DSP 3D, ARM 2D	1xEV-DO Rev.0	2006
MSM6575			Defender3 3D,ARM 2D	1xEV-DO Rev.0	2006
MSM6550		ARMv5TEJ ARM926EJ-S @ 225 MHz	Defender2 3D,ARM 2D
MSM6550A
MSM6800		ARM926EJ-S @ 270 MHz	Defender3 3D,ARM 2D	1xEV-DO Rev.A	2007
MSM6800A
MSM7xxx
MSM7200	90 nm	ARM1136J-S@ 400 MHz	Imageon2D, 3D	HSUPA	2006
MSM7200A		ARM1136J-S@ 528 MHz			Q1 2007
MSM7201	90 nm	ARM1136JF-S @ 528 MHz	GPU Adreno 130	HSDPA, HSUPA	2008
MSM7201A	65 nm
MSM7500	90 nm	ARM1136JF-S @ 528 MHz	Imageon2D, 3D Q3Dimension	1xEV-DO Rev.A	2006
MSM7500A	65 nm				Q4 2007
MSM7600	90 nm	ARM1136J-S @ 528 MHz		HSUPA, 1xEV-DO Rev.A	Q1 2007
MSM7600A	65 nm
MSM7850			LT 3D, LT 2D	1xEV-DO Rev.B	2008

Snapdragon S series

Snapdragon S1

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S1

Features of the Snapdragon S1 series

Snapdragon S1notable features over its predecessor (MSM7xxx): CPUfeatures 1 core up to 1 GHzScorpionorCortex-A5orARM11 Up to 256KL2 cache Up to 32K+32KL1 cache GPUfeatures Adreno200 (from Software rendered orAdreno130) OpenGL ES1.1 OpenVG1.0 Direct3D Mobile Unified shader model5-wayVLIW DSPfeatures HexagonQDSP5 at 350 MHz or Hexagon QDSP6 600 MHz ISPfeatures Up to 12 MP camera Modemandwirelessfeatures ExternalBluetooth4.0 or external Bluetooth 2.0/2.1 on some models 45 or 65 nm manufacturing technology

Model number	Fab	CPU(Core/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7225	65nm	1 core up to 528MHzARM11(ARMv6): 16K+16KL1,noL2 cache	Software- rendered 2D support (HVGA)	HexagonQDSP5 320MHz	Up to 5MP camera	LPDDRSingle-channel 166MHz (1.33 GB/s)	UMTS(HSPA);GSM(GPRS,EDGE)	Bluetooth2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen7; USB2.0	2007
MSM7625							CDMA(1×Rev.A, 1×EV-DORev.A);UMTS;GSM
MSM7227		1 core up to 800MHzARM11(ARMv6): 16K+16KL1,256KL2 cache	Adreno200 226 MHz (FWVGA)		Up to 8 MP camera	LPDDRSingle-channel 166 MHz (1.33 GB/s)	UMTS;GSM	Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0	2008
MSM7627							CDMA,UMTS;GSM
MSM7225A	45 nm	1 core up to 800MHzCortex-A5(ARMv7): 32K+32KL1,256KL2 cache	Adreno200 245 MHz (HVGA)	HexagonQDSP5 350 MHz	Up to 5 MP camera	LPDDRSingle-channel 200 MHz (1.6 GB/s)	UMTS(HSDPA,HSUPA,W-CDMA),MBMS;GSM	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0	Q4 2011
MSM7625A							CDMA2000(1×RTT, 1×EV-DORel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A		1 core up to 1.0GHzCortex-A5(ARMv7): 32K+32KL1,256KL2 cache	Adreno200 245 MHz (FWVGA)		Up to 8 MP camera		UMTS,MBMS;GSM
MSM7627A							CDMA2000,UMTS, MBMS; GSM
MSM7225AB							UMTS:up to 7.2 Mbit/s,MBMS;GSM
QSD8250	65 nm	1 core up to 1.0GHzScorpion(ARMv7): 32K+32KL1,256KL2 cache	Adreno200 226 MHz (WXGA)	HexagonQDSP6 600 MHz	Up to 12 MP camera	LPDDRSingle-channel 400 MHz	UMTS,MBMS;GSM	Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0	Q4 2008
QSD8650							CDMA2000,UMTS, MBMS; GSM

Snapdragon S2

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S2

Features of the Snapdragon S2 series

Snapdragon S2notable features over its predecessor (Snapdragon S1): CPUfeature 1 core up to 1.5 GHzScorpion ARMv7(from ARMv6 on some model) Up to 384KL2 GPUfeatures Adreno205 (from Software rendered or Adreno 200) Up to 266 MHz Up to 2 times faster thanAdreno200 up to ×2 relative performance onOpenGL ES 2.0fromAdreno200 Up toXGA OpenGL ES2.0 SVGT 1.2 OpenVG 1.1 Direct Draw GDI Concurrent CPU, DSP, graphics and MDP Memory features Up toLPDDR232-bit dual-channel 333 MHz (5.3 GB/s) DSPfeatures HexagonQDSP5 at 256 MHz 45 nm manufacturing technology 904 pins

Model number	Fab	CPU(ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7230	45nm	1 core up to 800MHzScorpion:32K+32K L1, 256K L2	Adreno205 266MHz (XGA)	HexagonQDSP5 256MHz	Up to 12MP camera	LPDDR232-bit dual-channel 333 MHz(5.3 GB/s)	GSM,GPRS, W-CDMA, UMTS,EDGE,MBMS, HSDPA,HSUPA,HSPA+	Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0	Q2 2010
MSM7630							CDMA2000 (1×Adv,1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055		1 core up to 1.4GHzScorpion:32K+32K L1, 384K L2					—
MSM8255		1 core up to 1.0GHzScorpion:32K+32K L1, 384K L2					UMTS, MBMS;GSM
MSM8655							CDMA2000,UMTS, MBMS;GSM
MSM8255T		1 core up to 1.5GHzScorpion:32K+32K L1, 384K L2					UMTS, MBMS;GSM
MSM8655T							CDMA2000,UMTS, MBMS;GSM

Snapdragon S3

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S3

Features of the Snapdragon S3 series

Snapdragon S3notable features over its predecessor (Snapdragon S2): CPUfeature 2 cores up to 1.7 GHzScorpion 512 KB L2 GPUfeatures Adreno220 Up to 4 times faster thanAdreno200 up to ×5 relative performance onOpenGL ES 2.0fromAdreno200 EGL 1.3 (from 1.2) 2× larger L2 cache (512 KB from 256 KB) Up to WXGA+ DSPfeatures HexagonQDSP6 at 400 MHz (fromHexagonQDSP5 at 256 MHz) ISPfeatures Up to 16 MP camera (from 12 MP) 45 nm manufacturing technology

Modelnumber	Fab	CPU(ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
APQ8060	45nm	2 cores up to 1.7GHzScorpion:512KBL2	Adreno220 266MHz (WXGA+)	HexagonQDSP6 400MHz	Up to 16MP camera	LPDDR2Single- channel 333MHz (2.67GB/s)	—	Bluetooth4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOneGen8 withGlonass; USB 2.0	2011
MSM8260							GSM,GPRS,W-CDMA,UMTS,HSDPA,HSUPA, HSPA+,EDGE,MBMS		Q3 2010
MSM8660							CDMA2000(1×Adv,1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A);UMTS,MBMS;GSM

Snapdragon S4

Snapdragon S4is offered in three models:

• S4 Playfor budget and entry-level devices,
• S4 Plusfor mid-range devices and
• S4 Profor high-end devices.

It was launched in 2012.

The Snapdragon S4 were succeeded by the Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro).

Snapdragon S4 Play

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S4 Play

Model number	Fab	CPU(ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8225	45nm	2 cores up to 1.2GHzCortex-A5:2x 32K+32K L1, 512K L2	Adreno203 320MHz (FWVGA)	Hexagon	Up to 8MP camera	LPDDR2Single-channel 300MHz	UMTS(HSPA);GSM(GPRS,EDGE)	Bluetooth3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0	1H 2012
MSM8625							CDMA(1×Rev.A, 1×EV-DO Rev.A/B);UMTS;GSM

Snapdragon S4 Plus

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S4 Plus

Features of the Snapdragon S4 Plus series

Snapdragon S4 Plusnotable features over its predecessor (Snapdragon S3): CPUfeatures 2x cores up to 1.7 GHzKrait200 4+4 KB L0, 16+16 KB L1, 1 MB L2 Out of Order Execution (from Partial Out of Order Execution onScorpion) GPUfeatures Adreno225 Up to1080pscreen Up to 6 times faster thanAdreno200 Up to 32 ALU Direct3D feature level 9.0 (from 9.0) up to ×7.5 relative performance on OpenGL ES 2.0 fromAdreno200 Adreno305 Up to 1080p screen (on 400 MHz) Up to 720p screen (on 320 MHz) Up to 24 ALU (from 32 on S3) Unified shader modelScalar instruction set (from unified shader model 5-wayVLIW) up to ×8 relative performance onOpenGL ES 2.0fromAdreno200 DSPfeatures Up to 20 MP or 13.5 MP camera ISPfeatures HexagonQDSP6 Modemandwirelessfeatures IntegratedBluetooth4.0 IZat Gen8A (from IZat Gen 7) 28 nm manufacturing technology

Modelnumber	Fab	CPU(ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8227	28nm	2 cores up to 1.0GHzKrait:4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno305 320 MHz (FWVGA / 720p)	HexagonQDSP6		LPDDR2Single-channel 400MHz	GSM(GPRS,EDGE), UMTS (DC-HSPA+, TD-SCDMA)	Bluetooth4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0	2H 2012
MSM8627							CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB);UMTS;GSM
APQ8030		2 cores up to 1.2GHzKrait:4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno305 400MHz (qHD / 1080p)		Up to 13.5MP camera	LPDDR2Single-channel 533MHz	—.		3Q 2012
MSM8230							UMTS; GSM.
MSM8630							CDMA, UMTS; GSM
MSM8930							World Mode (LTEFDD/TDDCat3, SVLTE-DB, EGAL; CDMA, UMTS; GSM)
APQ8060A		2 cores up to 1.5GHzKrait:4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno225 400MHz (WUXGA / 1080p)		Up to 20MP camera	LPDDR2Dual-channel 500MHz	—.		2H 2012
MSM8260A							UMTS; GSM.		Q1 2012
MSM8660A							CDMA, UMTS; GSM
MSM8960							World Mode (LTE Cat 3)

Snapdragon S4 Pro and S4 Prime (2012)

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S4 Pro

Features of the Snapdragon S4 Pro series

Snapdragon S4 Pronotable features over its predecessor (Snapdragon S4 Play): CPUfeatures up to 2 cores up to 1.7 GHzKrait300 on to Snapdragon S4 Pro up to 4 cores up to 1.5 GHzKrait300 on to Snapdragon S4 Prime 4+4 KB L0, 16+16 KB L1, 1 MB L2 GPUfeatures Adreno320 SupportOpenGL ES3.0 Up to 1080p screen Up to 64 ALU (from 32 on S4 plus) up to ×23 relative performance onOpenGL ES 2.0fromAdreno200 DSPfeatures HexagonQDSP6 ISPfeatures Up to 20 MP camera Modemandwirelessfeatures LTE FDD/TDD Cat 3 or external on some models 28 nm LP manufacturing technology Up toeMMC4.4/4.4.1

Modelnumber	Fab	CPU(ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8260A Pro	28nm (TSMC 28LP)	2 cores up to 1.7GHzKrait300: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno320 400MHz (WUXGA / 1080p)	HexagonQDSP6	Up to 20MP camera	LPDDR2Dual-channel 500MHz	GSM (GPRS, EDGE), UMTS (DC-HSPA+,TD-SCDMA)	Bluetooth4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB2.0
MSM8960T							World Mode (LTEFDD/TDDCat3, SVLTE-DB, EGAL; CDMA: 1×Adv., 1× EV-DO Rev.A/B; UMTS; GSM)		Q2 2012.
MSM8960T Pro(MSM8960AB)
MSM8960DT		2 cores up to 1.7GHzKrait300:4+4 KB L0, 16+16 KB L1, 1 MB L2							Q3 2013
APQ8064		4 cores up to 1.5GHzKrait:4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno320 400 MHz (QXGA / 1080p)			LPDDR2Dual-channel 533 MHz	External		2012

Snapdragon 2 series

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 2 series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 series (2013–2019)

The Snapdragon 200 was announced in 2013.
The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.
The Snapdragon 212 was announced on July 28, 2015.
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.
The Qualcomm 215 was announced on July 9, 2019.It is a toned-down variant of the Snapdragon 425 and primarily optimized forAndroid Go Editiondevices.

Model number	Product name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8225Q	Snapdragon 200	45 nm (TSMC 45LP)	4 cores up to 1.4 GHzCortex-A5	Adreno203 400 MHz (12.8 GFLOPS in FP32)	HexagonQDSP5	Up to 8 MP single camera	LPDDR2Single-channel 333 MHz	Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE)	Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0	—	2013
MSM8625Q								Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210		28 nm (TSMC 28LP)	2 cores up to 1.2 GHzCortex-A7	Adreno302 400 MHz (12.8 GFLOPS in FP32)	HexagonQDSP6			Gobi 3G (UMTS; GSM)
MSM8610								Gobi 3G (CDMA/UMTS; GSM)
MSM8212			4 cores up to 1.2 GHzCortex-A7					Gobi 3G (UMTS; GSM)
MSM8612								Gobi 3G (CDMA/UMTS; GSM)
MSM8905	Qualcomm 205		2 cores up to 1.1 GHzCortex-A7	Adreno304 400 MHz (19.2 GFLOPS in FP32)	Hexagon536	Up to 3 MP single camera	LPDDR2/3Single-channel 384 MHz	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.1 + BLE, 802.11n (2.4 GHz)	4.0	2017
MSM8208	Snapdragon 208					Up to 5 MP single camera	LPDDR2/3Single-channel 400 MHz	Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM)		2.0	2014
MSM8909	Snapdragon 210		4 cores up to 1.1 GHzCortex-A7			Up to 8 MP single camera	LPDDR2/3Single-channel 533 MHz	X5 LTE
MSM8909AA	Snapdragon 212		4 cores up to 1.3 GHzCortex-A7								2015
QM215	Qualcomm 215		4 cores up to 1.3 GHzCortex-A53	Adreno308 485 MHz (23.3 GFLOPS in FP32)	Hexagon	Up to 13 MP single camera / 8 MP dual camera	LPDDR3Single-channel 672 MHz 3 GB	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0	1.0	Q3 2019

Snapdragon 4 series

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 4 series

The Snapdragon 4 series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 series, which were aimed at ultra-budget segment. Similar to the 2 series, it is the successor of the S4 Play.

Snapdragon 400 series (2013–2021)

The Snapdragon 400 was announced in 2013.
The Snapdragon 410 was announced on December 9, 2013.It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China bySMIC.
The Snapdragon 412 was announced on July 28, 2015.
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.
Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.
The Snapdragon 427 was announced on October 18, 2016.
The Snapdragon 450 was announced on June 28, 2017.Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018.Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.
The Snapdragon 460 was announced on 20 January 2020, withNavICsupport. It is the first Snapdragon 400 model to incorporate theKryoarchitecture.
The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.
The Snapdragon 480+ was announced on October 26, 2021.

Model number	Product name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8026	Snapdragon 400	28 nm (TSMC 28LP)	4 cores up to 1.2 GHzCortex-A7:32 KB L1, 512 KB L2	Adreno305 400 MHz (19.2 GFLOPS in FP32)	HexagonQDSP6	Up to 13.5 MP single camera	LPDDR2/3Single-channel 533 MHz	—	Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS	1.0	2013
MSM8226								Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626								Gobi 3G (CDMA/UMTS)
MSM8926								Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028			4 cores up to 1.6 GHzCortex-A7:32 KB L1, 512 KB L2	Adreno305 450 MHz (21.6 GFLOPS in FP32)				—
MSM8228								Gobi 3G (UMTS)
MSM8628								Gobi 3G (CDMA/UMTS)
MSM8928								Gobi 4G (LTE Cat 4)
MSM8230			2 cores up to 1.2 GHzKrait200: 32 KB L1, 1 MB L2	Adreno305 400 MHz (19.2 GFLOPS in FP32)			LPDDR2Single-channel 533 MHz	Gobi 3G (UMTS)
MSM8630								Gobi 3G (CDMA/UMTS)
MSM8930								Gobi 4G (LTE Cat 4)
MSM8930AA			2 cores up to 1.4 GHzKrait300: 32 KB L1, 1 MB L2					Gobi 4G (LTE Cat 4)
APQ8030AB			2 cores up to 1.7 GHzKrait300: 32 KB L1, 1 MB L2	Adreno305 450 MHz (21.6 GFLOPS in FP32)				—
MSM8230AB								Gobi 3G (UMTS)
MSM8630AB								Gobi 3G (CDMA/UMTS)
MSM8930AB								Gobi 4G (LTE Cat 4)
APQ8016	Snapdragon 410	28 nm (TSMC 28LP) / 28 nm (SMIC)	4 cores up to 1.2 GHzCortex-A53	Adreno306 400/450 MHz (19.2/21.6 GFLOPS in FP32)	HexagonQDSP6 V5		LPDDR2/3Single-channel 32-bit 533 MHz (4.2 GB/s)	—	Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou	2.0	H1 2014
MSM8916								X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2	Snapdragon 412	28 nm (TSMC 28LP)	4 cores up to 1.4 GHzCortex-A53	Adreno306 450 MHz (21.6 GFLOPS in FP32)			LPDDR2/3Single-channel 32-bit 600 MHz (4.8 GB/s)				H2 2015
MSM8929	Snapdragon 415		4 + 4 cores (1.4 GHz + 1.0 GHzCortex-A53)	Adreno405 465 MHz (44.6 GFLOPS in FP32)	HexagonV50	Up to 13 MP single camera	LPDDR3Single-channel 32-bit 667 MHz (5.3 GB/s)		Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS		H1 2015
MSM8917	Snapdragon 425		4 cores up to 1.4 GHzCortex-A53	Adreno308 598 MHz (28.7 GFLOPS in FP32)	Hexagon536	Up to 16 MP single camera		X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C		Q3 2016
MSM8920	Snapdragon 427							X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		3.0	Q1 2017
MSM8937	Snapdragon 430		4 + 4 cores (1.4 GHz + 1.1 GHzCortex-A53)	Adreno505 450 MHz (43.2 GFLOPS in FP32)		Up to 21 MP single camera	LPDDR3Single-channel 32-bit 800 MHz (6.4 GB/s)	X6 LTE			Q2 2016
MSM8940	Snapdragon 435							X9 LTE			Q4 2016
SDM429	Snapdragon 429	12 nm (TSMC 12FFC)	4 cores up to 2.0 GHzCortex-A53	Adreno504 320 MHz (30.7 GFLOPS in FP32)	Hexagon536	Up to 16 MP single camera / 8 MP dual camera		X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0		Q3 2018
SDM439	Snapdragon 439		4 + 4 cores (2.0 GHz + 1.45 GHzCortex-A53)	Adreno505 650 MHz (62.4 GFLOPS in FP32)		Up to 21 MP single camera / 8 MP dual camera
SDM450	Snapdragon 450	14 nm (Samsung 14LPP)	8 cores up to 1.8 GHzCortex-A53	Adreno505 600 MHz (57.6 GFLOPS in FP32)	Hexagon546	Up to 24 MP single camera / 13 MP dual camera	LPDDR3Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0		Q3 2017
SM4250-AA	Snapdragon 460	11 nm (Samsung 11LPP)	4 + 4 cores (1.8 GHzKryo 240 Gold–Cortex-A73+ 1.6 GHzKryo 240 Silver–Cortex-A53)	Adreno610 600 MHz (153.6 GFLOPS in FP32)	Hexagon683	Spectra 340 (48 MP single camera / 16 MP dual camera)	LPDDR3up to 933 MHz or LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1,NFC,Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready,NavIC,USB C		Q1 2020
SM4350	Snapdragon 480	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHzKryo 460 Gold–Cortex-A76+ 1.8 GHzKryo 460 Silver–Cortex-A55)	Adreno619 650 MHz (332.8 GFLOPS in FP32)	Hexagon686 (3.3 TOPS)	Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4XDual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)	InternalX51 5G(5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1,NFC,802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C	4+	H1 2021
SM4350-AC	Snapdragon 480+		2 + 6 cores (2.2 GHzKryo 460 Gold–Cortex-A76+ 1.9 GHzKryo 460 Silver–Cortex-A55)						FastConnect 6200, Bluetooth 5.2,NFC,802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C		Q4 2021

Snapdragon 4 (2022–2024)

The Snapdragon 4 Gen 1 was announced on September 6, 2022.
The Snapdragon 4 Gen 2 was announced on June 26, 2023.
The Snapdragon 4 Gen 2 Leading Version was launched on Redmi Note 13R on May 17, 2024.
The Snapdragon 4s Gen 2 was announced on July 30, 2024.

Model number	Product name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM4375	Snapdragon 4 Gen 1	6 nm (TSMC N6)	2 + 6 cores (2.0 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55)	Adreno619 700 MHz (358.4 GFLOPS in FP32)	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	InternalX51 5G(5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1	4+	Q3 2022
SM4450	Snapdragon 4 Gen 2	4 nm (Samsung 4LPX)	2 + 6 cores (2.2 GHzKryo Gold–Cortex-A78+ 1.95 GHzKryo Silver–Cortex-A55)	Adreno613 955 MHz (244.5 GFLOPS in FP32)	—	Spectra (108 MP single camera / 16 MP dual camera with ZSL)	LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	InternalX61 5G(5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)	Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1		Q2 2023
	Snapdragon 4 Gen 2 Accelerated Edition	4 nm (TSMC N4)	2 + 6 cores (2.3 GHzKryo Gold–Cortex-A78+ 1.95 GHzKryo Silver–Cortex-A55)								Q2 2024
SM4635	Snapdragon 4s Gen 2	4 nm (Samsung)	2 + 6 cores (2.0 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55)	Adreno611		Spectra (84 MP single camera / 16 MP dual camera with ZSL)	LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal (5G NR Sub-6: download up to 1 Gbit/s)			Q3 2024

Snapdragon 6 series

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 6 series

The Snapdragon 6 series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon line-up, appearing in mainstream devices of various manufacturers.

Snapdragon 600 series (2013–2023)

The Snapdragon 600 was announced on January 8, 2013.Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.
The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014.The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.
The Snapdragon 616 was announced on July 31, 2015.
The Snapdragon 617 was announced on September 15, 2015.
The Snapdragon 625 was announced on February 11, 2016.
The Snapdragon 626 was announced on October 18, 2016.Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015.They have been since renamed as Snapdragon 650 and Snapdragon 652, respectively.
The Snapdragon 653 was announced on October 18, 2016.
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017.
The Snapdragon 636 was announced on October 17, 2017.Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 632 was announced on June 26, 2018.Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018.Pin and software compatible with Snapdragon 710.
The Snapdragon 675 was announced on October 22, 2018.
The Snapdragon 665 was announced on April 9, 2019.
The Snapdragon 662 was announced on January 20, 2020, withNavICsupport.
The Snapdragon 678 was announced on December 15, 2020.
The Snapdragon 690 was announced on June 16, 2020, and is the first mid-range SoC by Qualcomm to support 5G connectivity.
The Snapdragon 680 and 695 were announced on October 26, 2021.
The Snapdragon 685 was announced on March 23, 2023.

Product name (Model number)	Fab	CPU(Cores / Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Snapdragon 600 APQ8064-1AA (DEB/FLO) Advertised as S4 Pro	28 nm (TSMC 28LP)	4 cores up to 1.5 GHz Krait300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno320 400 MHz (76.8 GFLOPS in FP32)	HexagonQDSP6 V4 500 MHz	Up to 21 MP single camera; Video Capture: 1080p@30fps	DDR3L- 1600 (12.8 GB/s)	External	Bluetooth 4.0, Wi-Fi 802.11ac (2.4/5 GHz), IZat Gen8A	1.0	Q1 2013
Snapdragon 600 APQ8064M		4 cores up to 1.7 GHzKrait300: 4+4 KB L0, 16+16 KB L1, 2 MB L2				LPDDR3Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s)
Snapdragon 600 APQ8064T						LPDDR3Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s)
Snapdragon 600 APQ8064AB		4 cores up to 1.9 GHzKrait300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno320 450 MHz (86.4 GFLOPS in FP32)
Snapdragon 610 MSM8936		4 cores up to 1.7 GHzCortex-A53	Adreno405 550 MHz (52.8 GFLOPS in FP32)	HexagonV50 700 MHz		LPDDR3Single-channel 32-bit 800 MHz (6.4 GB/s)	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.0, Qualcomm VIVE, Wi-Fi 802.11ac, NFC, GPS, Glonass, BeiDou	2.0	Q3 2014
Snapdragon 615 MSM8939		4 + 4 cores (1.7 GHz + 1.1 GHz)Cortex-A53
Snapdragon 616 MSM8939 v2		4 + 4 cores (1.7 GHz + 1.2 GHz)Cortex-A53								Q3 2015
Snapdragon 617 MSM8952		4 + 4 cores (1.5 GHz + 1.2 GHz)Cortex-A53		Hexagon546		LPDDR3Single-channel 32-bit 933 MHz (7.5 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C; USB 2.0	3.0	Q4 2015
Snapdragon 625 MSM8953	14 nm (Samsung 14LPP)	8 cores up to 2.0 GHzCortex-A53	Adreno506 650 MHz (62.4 GFLOPS in FP32)		Up to 24 MP single camera; Video Capture: 4K@30fps		X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, NFC, VIVE 1-stream Wi-Fi 802.11ac MU-MIMO, IZat Gen8C; USB 3.0		Q2 2016
Snapdragon 626 MSM8953 Pro		8 cores up to 2.2 GHzCortex-A53								Q4 2016
Snapdragon 630 SDM630		4 + 4 cores (2.2 GHz + 1.8 GHz)Cortex-A53)	Adreno508 650 MHz (124.8 GFLOPS in FP32)	Hexagon642	Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps)	LPDDR4Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi 1x1,NFC,USB 3.1	4.0	Q2 2017
Snapdragon 632 SDM632		4 + 4 cores (1.8 GHzKryo 250 Gold–Cortex-A73+ 1.8 GHzKryo 250 Silver–Cortex-A53)	Adreno506 725 MHz (69.6 GFLOPS in FP32)	Hexagon546	Up to 40 MP single camera, 13 MP dual camera; Video Capture: 4K@30fps	LPDDR3Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		3.0	Q3 2018
Snapdragon 636 SDM636		4 + 4 cores (1.8 GHzKryo 260 Gold–Cortex-A73+ 1.6 GHzKryo 260 Silver–Cortex-A53)	Adreno509 430 MHz (110.1 GFLOPS in FP32)	Hexagon680	Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		4.0	Q4 2017
Snapdragon 650 MSM8956	28 nm (TSMC 28HPM)	2 + 4 cores (1.8 GHzCortex-A72+ 1.4 GHzCortex-A53)	Adreno510 600 MHz (153.6 GFLOPS in FP32)	HexagonV56	Up to 21 MP single camera; Video Capture: 4K@30fps	LPDDR3Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0	3.0	Q1 2016
Snapdragon 652 MSM8976		4 + 4 cores (1.8 GHzCortex-A72+ 1.4 GHzCortex-A53)
Snapdragon 653 MSM8976 Pro		4 + 4 cores (1.95 GHzCortex-A72+ 1.4 GHzCortex-A53)	Adreno510 621 MHz (159 GFLOPS in FP32)				X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)			Q4 2016
Snapdragon 660 SDM660	14 nm (Samsung 14LPP)	4 + 4 cores (2.2 GHzKryo 260 Gold–Cortex-A73+ 1.84 GHzKryo 260 Silver–Cortex-A53)	Adreno512 647 MHz (165.6 GFLOPS in FP32)	Hexagon680	Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi,NFC,USB 3.1	4.0	Q2 2017
Snapdragon 660 SDA660							Internal: no
Snapdragon 662 SM6115	11 nm (Samsung 11LPP)	4 + 4 cores (2.0 GHzKryo 260 Gold–Cortex-A73+ 1.8 GHzKryo 260 Silver–Cortex-A53)	Adreno610 950 MHz (243.2 GFLOPS in FP32)	Hexagon683	Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps)	LPDDR3933 MHzLPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1,NFC,Wi-Fi 802.11ac Wave 2, 802.11ax-ready,NavIC,USB C	3.0	Q1 2020
Snapdragon 665 SM6125				Hexagon686 (3.3 TOPS)	Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)		X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.1, Wi-Fi 802.11ac,NFC,USB 3.1		Q2 2019
Snapdragon 670 SDM670	10 nm (Samsung 10LPP)	2 + 6 cores (2.0 GHzKryo 360 Gold–Cortex-A75+ 1.7 GHzKryo 360 Silver–Cortex-A55)	Adreno615 430 MHz (220.2 GFLOPS in FP32)	Hexagon685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)		Bluetooth 5, 802.11ac Wi-Fi,NFC,USB 3.1	4+	Q3 2018
Snapdragon 675 SM6150	11 nm (Samsung 11LPP)	2 + 6 cores (2.0 GHzKryo 460 Gold–Cortex-A76+ 1.7 GHzKryo 460 Silver–Cortex-A55)	Adreno612 845 MHz (216.3 GFLOPS in FP32)		Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)					Q1 2019
Snapdragon 678 SM6150-AC		2 + 6 cores (2.2 GHzKryo 460 Gold–Cortex-A76+ 1.7 GHzKryo 460 Silver–Cortex-A55)	Adreno612 895 MHz (229.1 GFLOPS in FP32)							Q4 2020
Snapdragon 680 SM6225	6 nm (TSMC N6)	4 + 4 cores (2.4 GHzKryo 265 Gold–Cortex-A73+ 1.9 GHzKryo 265 Silver–Cortex-A53)	Adreno610 1114 MHz (285.2 GFLOPS in FP32)	Hexagon686 (3.3 TOPS)	Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11ac Wave 2,NFC,NavIC,USB C	3.0	Q4 2021
Snapdragon 685 SM6225-AD		4 + 4 cores (2.8 GHzKryo 265 Gold–Cortex-A73+ 1.9 GHzKryo 265 Silver–Cortex-A53)	Adreno610 1260 MHz (322.6 GFLOPS in FP32)		Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)			FastConnect 6200, Bluetooth 5.2, Wi-Fi 802.1ac 1x1, USB 3.1		Q1 2023
Snapdragon 690 SM6350	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHzKryo 560 Gold–Cortex-A77+ 1.7 GHzKryo 560 Silver–Cortex-A55)	Adreno619L 565 MHz (289.3 GFLOPS in FP32)	Hexagon692 (5 TOPS)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	InternalX51 5G(5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, 802.11ac/ax 2x2 (MU-MIMO),NFC,USB 3.1	4+	H2 2020
Snapdragon 695 SM6375	6 nm (TSMC N6)	2 + 6 cores (2.2 GHzKryo 660 Gold–Cortex-A78+ 1.8 GHzKryo 660 Silver–Cortex-A55)	Adreno619 840 MHz (430.1 GFLOPS in FP32)	Hexagon686 (3.3 TOPS)	Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	InternalX51 5G(5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11ac 2x2 (MU-MIMO),NFC,USB C		Q4 2021

Snapdragon 6 (2022–2024)

The Snapdragon 6 Gen 1 was announced on September 6, 2022.
The Snapdragon 6s Gen 3 was announced on June 6, 2024.
The Snapdragon 6s Gen 1 was launched on Oppo A3x on August 9, 2024.
The Snapdragon 6 Gen 3 was announced on August 31, 2024.

Model number	Product name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM6450	Snapdragon 6 Gen 1	4 nm (Samsung 4LPX)	4 + 4 cores (2.2 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55)	Adreno710 676 MHz (346.1 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s)	Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	4+	Q1 2023
SM6115-AC	Snapdragon 6s Gen 1	11 nm (Samsung 11LPP)	4 + 4 cores (2.1 GHzKryo Gold–Cortex-A73+ 2.0 GHzKryo Silver–Cortex-A53)	Adreno610 1050 MHz (268.8 GFLOPS in FP32)	Hexagon	Spectra (48 MP single camera / 13 MP dual camera with ZSL; Video Capture: 1080p@60fps)	LPDDR3up to 933 MHz /LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, USB C	3.0	Q3 2024
SM6475-AB	Snapdragon 6 Gen 3	4 nm (Samsung 4LPX)	4 + 4 cores (2.4 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55)	Adreno710	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	4+	Q3 2024
SM6375-AC	Snapdragon 6s Gen 3	6 nm (TSMC N6)	2 + 6 cores (2.3 GHzKryo Gold–Cortex-A78+ 2.0 GHzKryo Silver–Cortex-A55)	Adreno619 900 MHz (460.8 GFLOPS in FP32)	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	InternalX51 5G(5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C		Q2 2024

Snapdragon 7 series

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 7 series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.

Snapdragon 700 series (2018–2022)

The Snapdragon 710 was announced on May 23, 2018.It is pin and software compatible with the Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.
The Snapdragon 730 and 730G were announced on April 9, 2019.
The Snapdragon 720G was announced on January 20, 2020.
The Snapdragon 732G was announced on August 31, 2020.
The Snapdragon 765 and 765G were announced on December 4, 2019as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via thePlay Store.
The Snapdragon 768G was announced on May 10, 2020.
The Snapdragon 750G was announced on September 22, 2020.
The Snapdragon 780G was announced on March 25, 2021.
The Snapdragon 778G was announced on May 19, 2021.
The Snapdragon 778G+ was announced on October 26, 2021.
The Snapdragon 782G was announced on November 23, 2022.

Modelnumber	Productname	Fab	CPU(ARMv8.2)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM710	Snapdragon 710	10 nm (Samsung 10LPP)	2 + 6 cores (2.2 GHzKryo 360 Gold–Cortex-A75+ 1.7 GHzKryo 360 Silver–Cortex-A55)	Adreno616 504 MHz (258 GFLOPS in FP32)	Hexagon685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; NFC;802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	4	Q2 2018
SDM712	Snapdragon 712		2 + 6 cores (2.3 GHzKryo 360 Gold–Cortex-A75+ 1.7 GHzKryo 360 Silver–Cortex-A55)	Adreno616 610 MHz (312.3 GFLOPS in FP32)						4+	Q1 2019
SM7125	Snapdragon 720G	8 nm (Samsung 8LPP)	2 + 6 cores (2.3 GHzKryo 465 Gold–Cortex-A76+ 1.8 GHzKryo 465 Silver–Cortex-A55)	Adreno618 750 MHz (384 GFLOPS in FP32)	Hexagon692 (5 TOPS)	Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)			FastConnect 6200; Bluetooth 5.1;NFC;802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS,NavIC;USB 3.1		Q1 2020
SM7150-AA	Snapdragon 730		2 + 6 cores (2.2 GHzKryo 470 Gold–Cortex-A76+ 1.8 GHzKryo 470 Silver–Cortex-A55)	Adreno618 610 MHz (312.3 GFLOPS in FP32)	Hexagon688 (3.6 TOPs)	Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)			FastConnect 6200; Bluetooth 5.0;NFC;802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q2 2019
SM7150-AB	Snapdragon 730G			Adreno618 700 MHz (358.4 GFLOPS in FP32)
SM7150-AC	Snapdragon 732G		2 + 6 cores (2.3 GHzKryo 470 Gold–Cortex-A76+ 1.8 GHzKryo 470 Silver–Cortex-A55)	Adreno618 800 MHz (409.6 GFLOPS in FP32)					FastConnect 6200; Bluetooth 5.1;NFC;802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q3 2020
SM7225	Snapdragon 750G		2 + 6 cores (2.2 GHzKryo 570 Gold–Cortex-A77+ 1.8 GHzKryo 570 Silver–Cortex-A55)	Adreno619 800 MHz (409.6 GFLOPS in FP32)	Hexagon694 (4.7 TOPs)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4XDual-channel 16-bit (32-bit), 2133 MHz (17 GB/s)	InternalX52 5G(5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200; Bluetooth 5.1;NFC;802.11ac/ax-ready 2x2 (MU-MIMO);GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1		Q4 2020
SM7250-AA	Snapdragon 765	7 nm (Samsung 7LPP)	1x 2.3 GHz {765}Kryo 475 Prime(Cortex-A76) + 1x 2.2 GHzKryo 475 Gold(Cortex-A76) + 6x 1.8 GHzKryo 475 Silver(Cortex-A55)	Adreno620 540 MHz (414.7 GFLOPS in FP32)	Hexagon696 (5.4 TOPs)	Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)			FastConnect 6200; Bluetooth5.0;NFC;802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1		Q1 2020
SM7250-AB	Snapdragon 765G		1x 2.4 GHzKryo 475 Prime(Cortex-A76) + 1x 2.2 GHzKryo 475 Gold(Cortex-A76) + 6x 1.8 GHzKryo 475 Silver(Cortex-A55)	Adreno620 625 MHz (480 GFLOPS in FP32)
SM7250-AC	Snapdragon 768G		1x 2.8 GHzKryo 475 Prime(Cortex-A76) + 1x 2.4 GHzKryo 475 Gold(Cortex-A76) + 6x 1.8 GHzKryo 475 Silver(Cortex-A55)	Adreno620 750 MHz (576 GFLOPS in FP32)					FastConnect 6200;Bluetooth5.2;NFC;802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1		Q2 2020
SM7325	Snapdragon 778G	6 nm (TSMC N6)	1x 2.4 GHzKryo 670 Prime(Cortex-A78) + 3x 2.4 GHzKryo 670 Gold(Cortex-A78) + 4x 1.8 GHzKryo 670 Silver(Cortex-A55)	Adreno642L 550 MHz (563.2 GFLOPS in FP32)	Hexagon770 (12 TOPs)	Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X53 5G(5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1		Q2 2021
SM7325-AE	Snapdragon 778G+		1x 2.5 GHzKryo 670 Prime(Cortex-A78) + 3x 2.4 GHzKryo 670 Gold(Cortex-A78) + 4x 1.8 GHzKryo 670 Silver(Cortex-A55)	Adreno642L 608 MHz (622.6 GFLOPS in FP32)							Q4 2021
SM7350-AB	Snapdragon 780G	5 nm (Samsung 5LPE)	1x 2.4 GHzKryo 670 Prime(Cortex-A78) + 3x 2.2 GHzKryo 670 Gold(Cortex-A78) + 4x 1.9 GHzKryo 670 Silver(Cortex-A55)	Adreno642 490 MHz (752.6 GFLOPS in FP32)		Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal:X53 5G(5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6900; Bluetooth5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1		Q1 2021
SM7325-AF	Snapdragon 782G	6 nm (TSMC N6)	1x 2.7 GHzKryo 670 Prime(Cortex-A78) + 3x 2.4 GHzKryo 670 Gold(Cortex-A78) + 4x 1.8 GHzKryo 670 Silver(Cortex-A55)	Adreno642L 719 MHz (736.3 GFLOPS in FP32)		Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X53 5G(5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth5.2; 802.11ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1		Q4 2022

Snapdragon 7 (2022–2024)

The Snapdragon 7 Gen 1 was announced on May 20, 2022.
The Snapdragon 7+ Gen 2 was announced on March 17, 2023.
The Snapdragon 7s Gen 2 was announced on September 15, 2023.
The Snapdragon 7 Gen 3 was announced on November 17, 2023.
The Snapdragon 7+ Gen 3 was announced on March 21, 2024.
The Snapdragon 7s Gen 3 was announced on August 20, 2024.

Model number	Product name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM7450-AB	Snapdragon 7 Gen 1	4 nm (Samsung 4LPX)	1x 2.4 GHz {2.5 GHz Accelerated Edition} Kryo Prime (Cortex-A710) + 3x 2.36 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno644 443 MHz (680.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	4+	Q2 2022
SM7475-AB	Snapdragon 7+ Gen 2	4 nm (TSMC N4)	1x 2.91 GHz Kryo Prime (Cortex-X2) + 3x 2.49 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno725 580 MHz (1187.8 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)			FastConnect 6900;Bluetooth5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	5	Q1 2023
SM7435-AB	Snapdragon 7s Gen 2	4 nm (Samsung 4LPX)	4 + 4 cores (2.4 GHzKryo Gold–Cortex-A78+ 1.95 GHzKryo Silver–Cortex-A55)	Adreno710 940 MHz (481.3 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	4+	Q3 2023
SM7550-AB	Snapdragon 7 Gen 3	4 nm (TSMC N4P)	1x 2.63 GHz Kryo Prime (Cortex-A715) + 3x 2.4 GHz Kryo Gold (Cortex-A715) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno720 975 MHz (998.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)		Internal:X63 5G(5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 6700;Bluetooth5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	5	Q4 2023
SM7675-AB	Snapdragon 7+ Gen 3		1× 2.8 GHz Kryo Prime (Cortex-X4) + 4× 2.6 GHz Kryo Gold (Cortex-A720) + 3× 1.9 GHz Kryo Silver (Cortex-A520)	Adreno732 950 MHz (1459.2 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)	LPDDR5Xquad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)		FastConnect 7800;Bluetooth5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1		Q1 2024
SM7635	Snapdragon 7s Gen 3		1× 2.5 GHz Kryo Prime (Cortex-A720) + 3× 2.4 GHz Kryo Gold (Cortex-A720) + 4× 1.8 GHz Kryo Silver (Cortex-A520)	Adreno810 1050 MHz (537.6 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700;Bluetooth5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	4+	Q3 2024

Snapdragon 8 series

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 8 series

The Snapdragon 8 series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800 series (2013–2021)

Features of the Snapdragon 800 series

TheSnapdragon 800was announced on January 8, 2013. CPUfeatures 4 cores up to 2.36 GHzKrait400 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache GPUfeatures Adreno 330GPU Up to 128 ALU (from 96 onAdreno320) Up to 1024 KB On-chip graphics memory (from 512 KB onAdreno320) up to ×30 relative performance onOpenGL ES 2.0fromAdreno200 SupportOpenGL ES3.0 (Over 2.0 AdrenoAdreno225) Unified shader modelScalar instruction set (fromUnified shader model5-wayVLIWon 2xx Adreno series) DSPfeatures H.264,VP8 UHD/30fps encoding/decoding (from 1080p60) ISPfeatures Up to 21 megapixel, stereoscopic 3D 24dual image signal processor (supportsHDRI) Throughput: 0.64 GP/sec Up to 320 MHz Modemandwirelessfeatures Wi-Fi802.11acwave 1 support Gobi 4G (LTECat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s), on some models SOCfeatures eMMC4.5 support USB 2.0 and 3.0 Qualcomm Quick Charge 2.0 28 nm HPm (from 28 nm HP) Up to 1 billiontransistors Die size: 118 mm2 TheSnapdragon 801was announced on February 24, 2014. CPUfeatures 4 cores up to 2.45 GHzKrait400 DSPfeatures H.265HD/30fps software decoding ISPfeatures Throughput: 1.0 GP/sec (from 0.64 GP/sec on S800) Up to 465 MHz (from 320 MHz on S800) eMMC5.0 support (Up to 400 MB/s) DSDA TheSnapdragon 805was announced on November 20, 2013. CPUfeatures 4 cores up to 2.7 GHzKrait450 Up to 128-bit wide LPDDR3 memory interface GPUfeatures Adreno 420GPU Up to 128 ALU Hardware dynamictessellationsupport Support for hull, domain and geometry shaders Update with new dedicated connection to the memory controller(from shared bus with the video decoder and ISP) Up to 40% increase performance in shader hardware 1.5× larger L2 cache (1536 KB from 1024 KB) Betteranisotropic filteringsupport Larger texture cache Full supportDirect3D Feature Level 11_2andOpenCL 1.2 DSPfeatures ImproveH.265support: UHD/30fps hardware decoding 1080p 120fps encoding and decoding ISPfeatures Up to 55 megapixel Throughput: 1.0 GP/sec (from 0.64 GP/sec on SD800) Modemandwirelessfeatures External modem The Snapdragon 808 and 810 were announced on April 7, 2014. Snapdragon 808notable features over its predecessor (805): CPUfeatures ARM architecture#ARMv8-A64-bit architecture (withGlobal Task Scheduling) 2 + 4 cores (1.82 GHzCortex-A57+ 1.44 GHzCortex-A53) Up to 48 KB Data + 32 KB Instr. L1 cache (from 16 KB + 16 KB) GPUfeatures Up to 128 ALU Adreno418GPUwith support forVulkan 1.0 SupportOpenGL ES3.1 Full supportDirect3DFeature Level 11_2 and OpenCL 1.2 DSPfeatures HexagonV56DSP ISPfeatures 12-bitdual-ISP up to 21 MP SOCfeatures 2 billion transistor Snapdragon 810notable features over its lower-end version (808): CPUfeatures 4 + 4 cores (2.0 GHzCortex-A57+ 1.5 GHzCortex-A53) GPUfeatures Adreno430GPUwith support forVulkan 1.0 Full supportDirect3DFeature Level 11_2 andOpenCL1.2 4Kmain display support Up to 192 ALU (from 128 onAdreno330) ISPfeatures 14-bit dual-ISP up to 55 MP Throughput: 1.2 GP/sec (from 1.0 GP/sec on SD805) ISP is clocked at 600 MHz DSPfeatures H.264,H.265UHD/30fpsencoding and decoding Modemandwirelessfeatures Snapdragon X10LTEmodem Cat 9:download up to 450 Mbit/s Upload up to 50 Mbit/s Bluetooth 4.1 SOCfeatures 20 nm manufacturing technology 2.5 billion transistor TheSnapdragon 820was announced at theMobile World Congressin March 2015,with the first phones featuring the SoC released in early 2016. Notable features over its predecessors (808 and 810): CPUfeatures CustomKryoquad-coreCPU Per Core: L1: 32+32 KB, L2: 2 MB + 1 MB L3 cache shared between CPU cluster GPUfeatures Adreno530GPUwith support forVulkan 1.0 Less L2 GPU cache (1024 KB from 1536 KB) DirectX 12,OpenCL2.0,OpenGL ES3.2 DSPfeatures Hexagon680DSP1st generation "AI engine" Down to 2-3 time power consumption (from SD808) New low power island (LPI) for sensor aware apps Hexagon Vector eXtensions All-Ways Aware Hub low power island Neural Processing Engine (NPE) HalideandTensorFlowsupport H.264, H.265 UHD/30fpsencoding H.264,H.26510-bit,VP9UHD/60fpsdecoding ISPfeatures Qualcomm Spectra ISP with Dual 14-bit ISPs 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS Throughput: 1.2GP/sec (Same as 810) Modemandwirelessfeatures Snapdragon X12LTEmodem Download: Cat 12 (up to 600 Mbit/s), 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C Upload: Cat 13 (up to 150 Mbit/s), 2x20 MHz CA; 64-QAM Support MIMO 4×4 802.11a/b/g/n/acWi-Ficonnectivity Wi-Fiad support with external chip SOCfeatures 14 nmFinFETprocess eMMC5.1/UFS2.0 Quick Charge3.0 2.0 billion transistors Max 8 GBLPDDR4Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) TheSnapdragon 821was announced in July 2016.The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820. Notable features over its predecessor (820): CPUfeatures Faster CPU (+10%) GPUfeatures Faster GPU 650 MHz from 624 (+5%) Snapdragon VR-SDK. ISPfeatures Support Dual PD (PDAF). Extended laser Auto-focus. TheSnapdragon 835was announced on November 17, 2016. Notable features over its predecessor (821): CPUfeatures Samsung10nmFinFET Low-Power Early fabrication, 3 billion transistors 4Kryo 280 Gold(ARMCortex-A73) L1 cache: 64 KB + 64 KB L2 cache: 2 MB 4Kryo 280 Silver(ARMCortex-A53) LPDDR4Xin dual-channel mode, up to 1866 MHz GPUfeatures Adreno540 graphics with support forVulkan1.1,DirectX12 (Feature level 12_1),OpenCL2.0 andOpenGL ES3.2 Quad-Core GPU @ 710/670 MHz with 256 ALUs, 16 TMUs and 12 ROPs @ 710 MHz: 727.04 GFLOPs, 11.36 GTexels/s and 8.52 GPixels/s @ 670 MHz: 686.08 GFLOPs, 10.72 GTexels/s and 8.04 GPixels/s QualcommQ-Sync (Variable Refresh Rate)andAdreno Foveation (Foveated Rendering) DSPfeatures Hexagon682DSP2nd-generation "AI engine" Hexagon Vector eXtensions All-Ways Aware Hub low power island Neural Processing Engine (NPE) HalideandTensorFlowsupport H.264,H.265,VP9UHD/30fpsencoding andUHD/60fps10-bit decoding High-dynamic-range videosupport (HDR10)/Ultra HD Premium (only Decoding) DSD and 32-bit/384 kHz PCM audio support with WCD9341 codec ISP features: Qualcomm Spectra180 ISP with Dual 14-bit ISPs Single Camera, 30fps: Up to 32 MP 32 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 16 MP Dual Camera with ZSL Video Capture: Up to4KUltra HD video capture @ 30FPS Video Playback: Up to 4K Ultra HD video playback Codec Support: H.265 (HEVC), H.264 (AVC),VP9 Modemandwirelessfeatures Snapdragon X16LTEmodem Downlink: LTE Cat 16 up to 1 Gbit/s, 4x20 MHz carrier aggregation, up to 256-QAM Uplink: LTE Cat 13 up to 150 Mbit/s, Qualcomm Snapdragon Upload+ (2x20 MHz carrier aggregation, up to 64-QAM, uplink data compression) 802.11a/b/g/n/ac/adWi-Ficonnectivity Bluetooth5.0 (from Bluetooth 4.1) SOCfeatures 10 nmFinFET(Samsung 10LPE) Die size: 72.3 mm2 3 billion Transistors UFS2.1,SD3.0 (UHS-I) DisplayPort,HDMI2.0,USB Type-C3.1 with USB Power Delivery Qualcomm Quick Charge4 Up to 8 GBLPDDR4XDual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) TheSnapdragon 845was announced on December 7, 2017. Notable features over its predecessor (835): CPUfeatures Samsung10nmFinFET Low-Power Plus fabrication 4Kryo 385 Gold(ARMCortex-A75) L1 cache: 64 KB + 64 KB L2 cache: 256 KB 4Kryo 385 Silver(ARMCortex-A55) DynamIQwith 2 MiB L3 cache 3 MiB system-level cache for CPU, GPU, DSP... GPUfeatures Adreno630 graphics with support forVulkan1.1,DirectX12 (Feature level 12_1),OpenCL2.0,OpenGL ES3.2 and DxNext eXtended Reality (XR) Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs(up from 256 ALUs, 16 TMUs and 12 ROPs) 727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s Inside-outRoom-Scale6DoFwithsimultaneous localization and mapping(SLAM) Advanced visual inertial odometry (VIO) And AdrenoFoveation Support forHDR10andhybrid log–gamma(HLG) DisplayPort,HDMI2.0,USB Type-C3.1 with USB Power Delivery DSPfeatures Hexagon685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS) Hexagon Vector eXtensions All-Ways Aware Hub low power island Neural Processing Engine (NPE) Caffe,Caffe2,HalideandTensorFlowsupport Up to4KUltra HD @ 60 FPS (from 4K30 Encode), 2x 2400x2400 @ 120 FPS (VR) Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion) 10-bit color depth (encoding and decoding) onH.264,H.265and (decode only)VP9 BT.2020support on DSP and GPU ISP features: Qualcomm Spectra 280 ISP with Dual 14-bit ISPs 192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL Modemandwirelessfeatures Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers Uplink: 2x20 MHz carrier aggregation, up to 64-QAM Bluetoothenhancements Ultra-low power wireless earbuds Direct audio andaptXHD quality stereo broadcast to multiple wireless speakers Wi-Fiad 60 GHz with external Module ImproveGPSsupport:Glonass,Beidou,Galileo,QZSSand SBAS System on a chipfeatures 10 nm FinFET (Samsung 10LPP) Die size: 94 mm2 (5.3) billion Transistors Secure Vault (SPU) Native DSD support, PCM up to 384 kHz/32bit Qualcomm Quick Charge4+ Up to 8 GBLPDDR4XQuad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) TheSnapdragon 855was announced on December 5, 2018.The Snapdragon 855 is Qualcomm's first 7 nmFinFETchipset. Notable features over its predecessor (845): 7 nm(TSMCN7) process Die size: 73 mm2(8.48 mm × 8.64 mm) 6.7 billion transistors Support up to 16 GBLPDDR4X2133 MHz support 4x 16-bit memory bus, (34.13 GB/s) up to 16 GB NVM Express2x 3.0 (1x for external 5G modem) CPUfeatures 1Kryo 485 Prime(Cortex-A76), up to 2.84 GHz. Prime core with 512 KB pL2 3Kryo 485 Gold(Cortex-A76), up 2.42 GHz. Performance cores with 256 KB pL2 each 4Kryo 485 Silver(Cortex-A55), up 1.8 GHz. Efficiency cores with 128 KB pL2 each DynamIQwith 2 MB sL3 cache 3 MB system-level cache GPU features Adreno640 GPU with support forVulkan 1.1 Up to 768 ALU (from 512 onAdreno630) Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs (up from 512 ALUs, 24 TMUs and 16 ROPs) 954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth HDRgaming (10-bit color depth, Rec. 2020) 120 fps gaming Improvement on hardware-acceleratedH.265andVP9decoder HDR playback codec support forHDR10+,HDR10,HLGandDolby Vision Volumetric VR video playback 8K 360 VR video playback Quarterly GPU driver updates viaGoogle Play Store Android GPU Inspector Tool DSPfeatures Hexagon690 4th generation "AI engine" with greater than 7 trillion operations per second (TOPS) Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions Qualcomm Hexagon Tensor Accelerator (HTA) Qualcomm Hexagon Voice Assistant All-Ways Aware Hub Caffe,Caffe2,HalideandTensorFlowsupport Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance ISP features: Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision Multi-frame noise reduction Hybrid AF 192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL HEIFphoto capture support Tri-core hardware CV functions including object detection & tracking, and stereo depth processing Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array (QCFA) HDR 4K 60 FPS HDR video with real-time object segmentation (portrait mode, background swap) features HDR10, HDR10+ and HLG with Portrait Mode (bokeh), 10-bit color depth and Rec. 2020 color gamut Up to 1.32 Gpixel/s Video Capture Formats: HDR10,HLG Video Codec Support: H.265 (HEVC), H.264 (AVC), HLG,HDR10,HDR10+,VP8,VP9 Modem and wireless features: InternalX24 LTE Modem Download: 2000 Mbit/s DL (Cat. 20), 7x20 MHz CA, 256-QAM, 4x4 MIMO Upload: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM ExternalSnapdragon X50 (5G Modem):5000 Mbit/s DL QualcommWi-Fi 6-readymobile platform: Wi-Fi Standards:802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz MIMOConfiguration: 2x2 (2-stream) • MU-MIMO• Dual-band simultaneous (DBS) Key Features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3 Qualcomm 60 GHz Wi-Fi mobile platform Wi-Fi Standards:802.11ad, 802.11ay Wi-Fi Spectral Band: 60 GHz Peak speed: 10 Gbit/s TheSnapdragon 855+was announced on July 15, 2019.It is an overclocked version of the Snapdragon 855 providing 10% higher CPU and GPU performance. TheSnapdragon 860was announced on March 22, 2021. It is a pure rebranding of the Snapdragon 855+. TheSnapdragon 865was announced on December 4, 2019. Notable features over its predecessor (855): 2nd-generation 7 nm(N7P TSMC)process 10.3 billion transistors 83.54 mm2 (8.49 mm x 9.84 mm) Support up to 16 GBLPDDR52750 MHz orLPDDR4X2133 MHz support 4x 16-bit memory bus, (or 34.13 GB/s) up to 16 GB NVM Express2x 3.0 (1x for external5Gmodem) SupportQuick Charge 4+ CPUfeatures 1Kryo 585 Prime(Cortex-A77), 2.84 GHz (3.1 GHz for 865+, 3.2 GHz for 870). Primecorewith 512 KB pL2 3Kryo 585 Gold(Cortex-A77), 2.42 GHz. Performance cores with 256 KB pL2 each 4Kryo 585 Silver(Cortex-A55), 1.8 GHz. Efficiency cores with 128 KB pL2 each DynamIQwith 4 MB sL3, 25% performance uplift and 25% power efficiency improvement 3 MB system-level cache GPU features Adreno650 GPU with support forVulkan 1.1 25% faster graphics rendering and 35% more power efficient Quarterly GPU driver updates viaGoogle Play Store Android GPU Inspector Tool Desktop Forward Rendering Up to 1029.1 GFLOPs FP32 (from 898.5 GFLOPs on SD855) DSPfeatures Hexagon698 5th generation "AI engine" capable of 15 trillion operations per second (TOPS) Quad-core Qualcomm Hexagon Tensor Accelerator (HTA) Deep learningbandwidth compression ISP features: Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision Multi-frame noise reduction Hybrid AF 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL 8K30 FPS and 4K 120 FPS HDR video Up to 2 Gpixel/s Video capture formats:Dolby Vision,HDR10,HDR10+,HEVC Video codec support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10,H.264 (AVC),VP8,VP9 New functionalities to improve noise reduction and local contrast enhancements Modem and wireless features: ExternalX55 5G Modem Modes: NSA, SA, TDD, FDD 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL LTEdownload: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO LTEupload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM Dynamic Spectrum Sharing (DSS) QualcommWi-Fi 6-readymobile platform: QualcommFastConnect 6800 (for 865 and 870), 6900 (for 865+) Wi-Fi standards:802.11ax-ready (Wi-Fi 6Efor 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi spectral bands: 2.4 GHz, 5 GHz (for 865 and 870), 2.4 GHz, 5 GHz, 6 GHz (for 865+) • channel utilization: 20/40/80 MHz (for 865 & 870), 20/40/80/160 MHz (for 865+) MIMOconfiguration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security withWPA3 Qualcomm 60 GHz Wi-Fi mobile platform Wi-Fi Standards:802.11ad, 802.11ay Wi-Fi spectral band: 60 GHz Peak speed: 10 Gbit/s Other features: Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support TheSnapdragon 865+was announced on July 8, 2020. TheSnapdragon 870was announced on January 19, 2021.The only difference between it and the Snapdragon 865+ is a minor 0.1 GHz increase in clock frequency on the prime core. TheSnapdragon 888was announced on December 1, 2020. Notable features over its predecessor (865): 5 nm(Samsung5LPE) process ~10 billion transistors Support up to 16 GBLPDDR53200 MHz (51.2 GB/s) 4x 16-bit memory bus Quick Charge 5(100 W+) SupportUFS 3.1 CPUfeatures 1Kryo 680 Prime(ARM Cortex-X1), up to 2.84 GHz. Primecorewith 1 MB pL2 and 64 KB pL1 3Kryo 680 Gold(ARM Cortex-A78), up 2.42 GHz. Performance cores with 512 KB pL2 each 4Kryo 680 Silver(ARM Cortex-A55), up 1.8 GHz. Efficiency cores with 128 KB pL2 each Move to instruction setARMv8.4-A(fromARMv8.2-A) DynamIQwith 4 MB sL3, 25% performance uplift and 25% power efficiency improvement 3 MB system-level cache GPU features Adreno660 GPU with API Support:OpenGL ES3.2, OpenCL 2.0 FP,Vulkan 1.1 Up to 840 MHz (from 670 MHz on 865+ and 870) 35% faster graphics rendering and 20% more power efficient 73% AI performance boost (from 15 TOPS to 26 TOPS) Variable rate shading(VRS) Demura and subpixel rendering for OLED uniformity Up to 1720.3 GFLOPs FP32 (from 1202.1 GFLOPs on SD865) HDRvideo playback formats:HDR10,HDR10+,Dolby Vision,HLG HDRgaming (including 10-bit color depth,Rec. 2020color gamut) On-device display: 4K@60 Hz, QHD+@144 Hz External display: 4K@60 Hz, 10-bit,Rec. 2020,HDR10,HDR10+ DSPfeatures Hexagon780 with Fused AI Accelerator architecture 6th-generation "AI engine" capable of 26 trillion operations per second (TOPS), From 15 TOPS on 865. Hexagon Tensor Accelerator Hexagon Vector eXtensions Hexagon Scalar Accelerator Qualcomm Sensing Hub (2nd generation) New dedicated AI processor 80% task reduction offload from Hexagon DSP 5× moreprocessing power 16× larger shared memory 1,000× hand-off time improvement in certain use cases 50% faster scalar accelerator, 2x faster tensor accelerator Video codec playback support:H.264 (AVC),H.265 (HEVC),VP8,VP9 ISP features: Qualcomm Spectra 580 with triple 14-bit CV-ISPs and hardware accelerator for computer vision Single camera: 1x 200 MP or 84 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag) Dual camera: 64+25 MP at 30 fps with MFNR/ZSL Triple camera: 3x 28 MP at 30 fps with MFNR/ZSL 8K30 FPS and 4K 120 FPSHDR video+ 64 MP Photo Slo-mo video capture at 720p @ 960 FPS, 1080p @ 480 FPS HDRvideo capture formats:HEVCwithHDR10,HDR10+,Dolby Vision,HLG HDRphoto capture: 10-bitHDRHEIF Computational HDRphoto and video capture, support for Multi-Frame and Staggered HDR sensors Real-time object classification, segmentation, and replacement AI-based auto-focus, auto-exposure and auto-white-balance Advanced HW-based face detection with deep learning filter New low-light architecture (capture photos in 0.1 lux) 2.7 Gigapixel per second ISP (+35% speed increase over S865) 120 photos at 12MP/s Modem and wireless features: InternalX60 5G Modem Modes: NSA, SA, TDD, FDD 5GmmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO 5G NR Sub-6 + mmWave download: 7500 Mbit/s DL 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL LTEdownload: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO LTEupload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM Dynamic Spectrum Sharing(DSS) Bluetooth5.2 Dual antennas Premium audio QualcommWi-Fi 6-readymobile platform: QualcommFastConnect 6900 Wi-Fi standards:802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz MIMOconfiguration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2) Key features: 8x8 sounding (up to 2× improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security withWPA3 Other features: Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support Adds compatibility withContent Authenticity Initiative TheSnapdragon 888+was announced on June 28, 2021.

Tables

Product name (Model number)	Fab	Die size	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Snapdragon 800 (APQ8074AA)	28 nm (TSMC 28HPM)		4 cores 2.26 GHz Krait400	Adreno330 450 MHz (115.2 GFLOPS in FP32)	Hexagon QDSP6 V5 600 MHz	21 MP single camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)	—	Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B	2.0	Q2 2013
Snapdragon 800 (MSM8274AA)								Gobi 3G (UMTS)
Snapdragon 800 (MSM8674AA)								Gobi 3G (CDMA, UMTS)
Snapdragon 800 (MSM8974AA)								Gobi 4G (LTECat 4: download 150 Mbit/s, upload 50 Mbit/s
Snapdragon 801 (MSM8974AA v3)								Gobi 4G (LTECat 4)			Q3 2014
Snapdragon 801 (APQ8074AB v3)			4 cores 2.36 GHz Krait400	Adreno330 578 MHz(150 GFLOPS in FP32)			LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	—			Q4 2013
Snapdragon 800 (MSM8274AB)								Gobi 3G (UMTS)			Q4 2013
Snapdragon 801 (MSM8674AB v3)								Gobi 3G (CDMA, UMTS)			Q2 2013
Snapdragon 801 (MSM8974AB v3)								Gobi 4G (LTECat 4)			Q4 2013
Snapdragon 801 (MSM8274AC v3)			4 cores 2.45 GHzKrait400					Gobi 3G (UMTS)			Q2 2014
Snapdragon 801 (MSM8974AC v3)								Gobi 4G (LTECat 4)			Q1 2014
Snapdragon 805 (APQ8084)			4 cores 2.7 GHzKrait450	Adreno420 600 MHz (153.6 GFLOPS in FP32)	HexagonV50 800 MHz	55 MP single camera	LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s)	External	Bluetooth 4.1 802.11ac (2.4/5 GHz) IZat Gen8B		Q1 2014
Snapdragon 808 (MSM8992)	20 nm (TSMC)		2 + 4 cores 1.82 GHzCortex-A57+ 1.44 GHzCortex-A53)	Adreno418 600 MHz (153.6 GFLOPS in FP32)	Hexagon V56 800 MHz	Up to 21 MP single camera	LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	X10LTE (Cat 9: download 450 Mbit/s, upload 50 Mbit/s)	Bluetooth 4.1 802.11ac IZat Gen8C		Q3 2014
Snapdragon 810 (MSM8994 v1)			4 + 4 cores 2.0 GHzCortex-A57+ 1.5 GHzCortex-A53)	Adreno430 600 MHz (230.4 GFLOPS in FP32)		55 MP single camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)
Snapdragon 810 (MSM8994 v2)				Adreno430 630 MHz (241.9 GFLOPS in FP32)							2015
Snapdragon 810 (MSM8994 v2.1)											Q2 2015
Snapdragon 820 (MSM8996 Lite)	14 nm FinFET (Samsung 14LPP)	113.7 mm2	2 + 2 cores Kryo (1.8 GHz + 1.36 GHz)	Adreno530 510 MHz (261.1 GFLOPS in FP32)	Hexagon680 1.0 GHz	Spectra	LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s)	X12 LTE (download: Cat 12, 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, 150 Mbit/s; 2x20 MHz CA; 64-QAM.)	Bluetooth 4.1 802.11ac IZat Gen8C	3.0	Q1 2016
Snapdragon 820 (MSM8996)			2 + 2 coresKryo(2.15 GHz + 1.593 GHz)	Adreno530 624 MHz (319.5 GFLOPS in FP32)			LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)				Q4 2015
Snapdragon 821 (MSM8996 Pro-AB)											Q3 2016
Snapdragon 821 (MSM8996 Pro-AC)			2 + 2 coresKryo(2.342 GHz + 1.6/2.188 GHz)	Adreno530 653 MHz (334.3 GFLOPS in FP32)
Snapdragon 835 (MSM8998)	10 nm FinFET (Samsung 10LPE)	72.3 mm2	4 + 4 coresKryo 280(2.45 GHzCortex-A73+ 1.9 GHzCortex-A53)	Adreno540 670/710 MHz (343/363.5 GFLOPS in FP32)	Hexagon682	Spectra 180	LPDDR4XDual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, Beidou, Galileo, QZSS, SBAS	4.0	Q2 2017
Snapdragon 845 (SDM845)	10 nm FinFET (Samsung 10LPP)	95.0 mm2	4 + 4 coresKryo 385(2.8 GHzCortex-A75+ 1.8 GHzCortex-A55)	Adreno630 710 MHz (727 GFLOPS in FP32)	Hexagon685 (3 TOPs)	Spectra 280		X20 LTE (download: Cat 18, @ 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, @ 150 Mbit/s; 2x20 MHz CA; 64-QAM)		4+	Q1 2018
Snapdragon 855 (SM8150)	7 nm (TSMC N7)	76.9 mm2	1 + 3 + 4 coresKryo 485(2.84 GHzCortex-A76+ 2.42 GHzCortex-A76+ 1.8 GHzCortex-A55)	Adreno640 585 MHz (898.6 GFLOPS in FP32)	Hexagon690 (7 TOPs)	Spectra 380	LPDDR4XQuad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal:X24 LTE(Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External:X50 5G(5G NR Sub-6 & mmWave: download up to 5 Gbit/s)	Bluetooth 5.0; 802.11ax Wi-Fi; GPS,Glonass,Beidou, Galileo,QZSS,SBAS; USB 3.1		Q1 2019
Snapdragon 855+ (SM8150-AC) Snapdragon 860 (SM8150-AC)			1 + 3 + 4 coresKryo 485(2.96 GHzCortex-A76+ 2.42 GHzCortex-A76+ 1.80 GHzCortex-A55)	Adreno640 675 MHz (1036.8 GFLOPS in FP32)							Q3 2019 Q1 2021
Snapdragon 855+ (SM8150P)								Internal:no + External:X55 5G(5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)			Q3 2019
Snapdragon 865 (SM8250)	7 nm (TSMCN7P)	86.8 mm2	1 + 3 + 4 coresKryo 585(2.84 GHzCortex-A77+ 2.42 GHzCortex-A77+ 1.80 GHzCortex-A55)	Adreno650 587 MHz (901.6 GFLOPS in FP32)	Hexagon698 (15 TOPs)	Spectra 480	LPDDR5Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4XQuad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal:no + External:X55 5G(5G NR Sub-6 & mmWave: download @ 7.5 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)	FastConnect 6800; Bluetooth5.1; 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS,Glonass,NavIC,Beidou,Galileo,QZSS, SBAS;USB 3.1		Q1 2020
Snapdragon 865+ (SM8250-AB)			1 + 3 + 4 coresKryo 585(3.1 GHzCortex-A77+ 2.42 GHzCortex-A77+ 1.80 GHzCortex-A55)	Adreno650 670 MHz (1029.1 GFLOPS in FP32)					FastConnect 6900; Bluetooth5.2; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS,Glonass,NavIC, Beidou,Galileo,QZSS, SBAS;USB 3.1		Q3 2020
Snapdragon 870 (SM8250-AC)			1 + 3 + 4 coresKryo 585(3.2 GHzCortex-A77+ 2.42 GHzCortex-A77+ 1.80 GHzCortex-A55)						FastConnect 6800 Bluetooth5.2 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS,Glonass,NavIC, Beidou,Galileo,QZSS, SBAS;USB 3.1		Q1 2021
Snapdragon 888 (SM8350)	5 nm (Samsung 5LPE)	112.2 mm2	1 + 3 + 4 coresKryo 680(2.84 GHzCortex-X1+ 2.42 GHzCortex-A78+ 1.80 GHzCortex-A55)	Adreno660 840 MHz (1290.2 GFLOPS in FP32)	Hexagon780 (26 TOPs)	Spectra 580	LPDDR5Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal:X60 5G(5G NR Sub-6 & mmWave: download 7.5 Gbit/s, upload 3 Gbit/s; LTE Cat 22: download 2.5 Gbit/s, upload 0.316 Gbit/s)	FastConnect 6900 Bluetooth5.2 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS,Glonass,NavIC, Beidou,Galileo,QZSS; USB 3.1	5	Q1 2021
Snapdragon 888+ (SM8350-AC)			1 + 3 + 4 cores Kryo 680 3.0 GHzCortex-X1+ 2.42 GHzCortex-A78+ 1.80 GHzCortex-A55)		Hexagon780 (32 TOPs)						Q3 2021

Snapdragon 8/8+ Gen 1 (2022)

TheSnapdragon 8 Gen 1was announced on November 30, 2021.

Features of the Snapdragon 8/8+ Gen 1 series

Notable features over its predecessor (888): 4 nm(Samsung4LPX) process ~ billion transistors Support up to 16 GBLPDDR53200 MHz Quick Charge 5(100 W+) SupportUFS 3.1 CPUfeatures 1xKryo Prime(Cortex-X2), up to 3 GHz. Prime core 3xKryo Gold(ARM Cortex-A710), up to 2.5 GHz. Performance cores 4xKryo Silver(ARM Cortex-A510), up to 1.8 GHz. Efficiency cores Move to instruction setARMv9(fromARMv8.2-A) DynamIQwith 4 MB sL3, 20% performance uplift and 30% power efficiency improvement 6 MB L3 cache, 4 MB system-level cache GPU features Adreno730 GPU with API Support:OpenGL ES3.2, OpenCL 2.0 FP,Vulkan 1.1 30% faster graphics rendering and 25% more power efficient Up to 1024 ALU (from 768 onAdreno660) Demura and subpixel rendering for OLED uniformity Variable Rate Shading Pro HDRvideo playback formats:HDR10,HDR10+,Dolby Vision,HLG HDRgaming (including 10-bit color depth,Rec. 2020color gamut) On-device display: 4K@60 Hz, QHD+@144 Hz External display: 4K@60 Hz, 10-bit,Rec. 2020,HDR10,HDR10+ DSPfeatures Hexagonwith Fused AI Accelerator, INT8 and INT16 Hexagon Tensor Accelerator Hexagon Vector eXtensions Hexagon Scalar Accelerator Qualcomm Sensing Hub (3nd generation) New dedicated AI pro ISP features Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag) Dual camera: 64+36 MP at 30 fps with MFNR/ZSL Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL 8K30 FPS and 4K 120 FPSHDR video+ 64 MP Photo Slow-m 5G NR, LTE including CBRS WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE 720p @ 960 FPS HDRvideo capture formats:HEVCwithHDR10,HDR10+,Dolby Vision,HLG HDRphoto capture: 10-bitHDRHEIF Computational HDRphoto and video capture, support for Multi-Frame and Staggered HDR sensors Real-time object classification, segmentation, and replacement AI-based auto-focus, auto-exposure and auto-white-balance Modem and wireless features: InternalX65 5G Modem Modes: NSA, SA, TDD, FDD 5GmmWave 5G sub-6 GHz 5G NR Sub-6 + mmWave download: 10 Gbit/s 5G NR Sub-6 + mmWave upload: 3 Gbit/s (assumed) LTEdownload: 2.5 Gbit/s LTEupload: 0.316 Gbit/s Dynamic Spectrum Sharing(DSS) Bluetooth5.3 Qualcomm Aqstic audio codec (WCD9385) Provide lossless wireless audio with Qualcomm aptX Technology. QualcommWi-Fi 6-readymobile platform: QualcommFastConnect 6900 Wi-Fi standards:802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz MIMOconfiguration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2) Peak speed: 3.6 Gbit/s

TheSnapdragon 8+ Gen 1was announced on May 20, 2022.

Product name (Model number)	Fab	Die size	CPU(ARMv9) (Cores / Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
Snapdragon 8 Gen 1 (SM8450)	4 nm (Samsung 4LPX)	128.5 mm2	1x 3.0 GHz (Kryo Prime) Cortex-X2+ 3x 2.5 GHz (Kryo Gold) Cortex-A710 + 4x 1.8 GHz (Kryo Silver) Cortex-A510	Adreno730 818 MHz (1675.3 GFLOPs in FP32)	Hexagon	Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR)	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X65 5G(5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)	FastConnect 6900; Bluetooth5.3; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1	5	Q4 2021
Snapdragon 8+ Gen 1 (SM8475)	4 nm (TSMC N4)	102.6 mm2		Adreno730 900 MHz (1843.2 GFLOPS in FP32)
			1x 3.2 GHz (Kryo Prime) Cortex-X2+ 3x 2.75 GHz (Kryo Gold)Cortex-A710 + 4x 2.0 GHz (Kryo Silver) Cortex-A510								Q2 2022
Snapdragon 8+ Gen 1 4G (SM8425-100-AC)								Internal: (LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)

Snapdragon 8 Gen 2 (2023)

TheSnapdragon 8 Gen 2was announced on November 15, 2022.

Features of the Snapdragon 8 Gen 2 series

Notable featuresover its predecessor (8 Gen 1): 4 nm (TSMCN4) process Support up to 16 GBLPDDR5X4200 MHz SupportUFS 4.0 CPU features 1Kryo Prime(ARM Cortex-X3), up to 3.36 GHz. Prime core 1 MB L2 cache Only 64-bit support 2Kryo Gold(ARM Cortex-A715), up to 2.8 GHz. High Performance cores Only 64-bit support 2Kryo Gold(ARM Cortex-A710), up to 2.8 GHz. Performance cores 32-bit and 64-bit support 3Kryo Silver(ARM Cortex-A510), up to 2 GHz. Efficiency cores 32-bit and 64-bit support 35% performance uplift and 40% power efficiency improvement 8 MB L3 cache, 6 MB system-level cache GPU features Adreno740 GPU with API support:OpenGL ES 3.2,OpenCL 2.0,Vulkan 1.3 25% faster graphics rendering and 45% more power efficient Up to 1536 ALU (from 1024 onAdreno730) Real-time hardware-acceleratedray tracing ray-box and ray-triangle intersections Bounding Volume Hierarchical (BVH) Doubled bandwidth between ISP,HexagonDSP, andAdrenoGPU DSPfeatures Hexagonwith Fused AI Accelerator Hexagon Tensor Accelerator Hexagon Vector eXtensions Hexagon Scalar Accelerator Mixed precision INT8/INT16 Add INT4 support INT4, INT8, INT16, FP16 support Hexagon Direct Link (ISP andHexagon) Qualcomm Sensing Hub (4th generation) Add second AI processor x2 performance from last year Dedicated power delivery system 50% more memory ISP features Video capture up to 8K30 or 4K120 or 720p960 (HDR) Video playback up to 8K60 or 4K120 (HDR) H.264, H.265, VP9 and add AV1 decoding Photo is same as 8 Gen 1 Modem and wireless features: Similar as 8 Gen 1 QualcommFastConnect 7800 InternalX70 5G Modem 5G up to 10 Gbit/s down and 3.5 Gbit/s up Wi-Fi 7,Bluetooth5.3 support, Dual Bluetooth radios There is an overclocked variant of the Snapdragon 8 Gen 2 with model number SM8550-AC. It was exclusive to theSamsung Galaxy S23 serieson launch. Nubia's Red Magic 8S Pro became the first non-Galaxy phone to feature this variant,launching July 5th 2023.

Product name (Model number)	Fab	Die size	CPU(ARMv9) (Cores/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
Snapdragon 8 Gen 2 (SM8550-AB)	4 nm (TSMC N4)	118.4 mm2	1× 3.2 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2×Cortex-A715, 2×Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510)	Adreno740 680 MHz (2089 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera @30fps ZSL / 64+36 MP dual camera @30fps ZSL / 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR)	LPDDR5XQuad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal: X70 5G(5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s)	FastConnect 7800; Bluetooth5.3; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS,Glonass,NavIC,Beidou,Galileo,QZSS; USB 3.1 or FastConnect 6900; Bluetooth5.3; 802.11ac/ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS,Glonass,NavIC,Beidou,Galileo,QZSS; USB 3.1	5	Q4 2022
Snapdragon 8 Gen 2 forGalaxy (SM8550-AC)			1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2×Cortex-A715, 2×Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510)	Adreno740 719 MHz (2208.8 GFLOPS in FP32)							Q1 2023

Snapdragon 8/8s Gen 3 (2024)

TheSnapdragon 8 Gen 3was announced on October 24, 2023.

Features of the Snapdragon 8/8s Gen 3 series

Notable features over its predecessor (8 Gen 2): Support for memory up to 4800 MHz (up from 4200 MHz) CPU features 1xKryo Prime(ARM Cortex-X4), up to 3.3 GHz. Prime core 3xKryo Gold(ARM Cortex-A720), up to 3.2 GHz. High Performance cores 2xKryo Gold(ARM Cortex-A720), up to 3.0 GHz. Performance cores 2xKryo Silver(ARM Cortex-A520), up to 2.3 GHz. Efficiency cores 30% performance uplift and 20% power efficiency improvement 12 MB L3 cache (up from 8 MB), 6 MB system-level cache GPU features Adreno750 GPU with API support:OpenGL ES 3.2,OpenCL 2.0,Vulkan 1.3 25% faster graphics rendering and 25% more power efficient DSPfeatures HexagonNPU 98% faster performance and 40% improved performance-per-watt for sustained AI inferencing. ISP features Photo expansion Video Object Eraser Night Vision video capture Dolby HDR video capture Modem and wireless features: InternalX75 5G Modem Bluetooth5.4 support

TheSnapdragon 8s Gen 3was announced on March 18, 2024.

Productname (Modelnumber)	Fab	Die size	CPU(ARMv9) (Cores/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
Snapdragon 8 Gen 3 (SM8650-AB)	4 nm (TSMC N4P)	137.3 mm2	1× 3.3 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520)	Adreno750 903 MHz (2774 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera @30fps ZSL / 64+36 MP dual camera @30fps ZSL / 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR)	LPDDR5Xquad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)	Internal:X75 5G(5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s)	FastConnect 7800; Bluetooth5.4; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS,Glonass,NavIC,Beidou,Galileo,QZSS;USB 3.1	5	Q4 2023
			1× 3.0 GHz Kryo Prime (Cortex-X4) + 5× 2.95 GHz Kryo Gold (Cortex-A720) + 2× 2.0 GHz Kryo Silver (Cortex-A520)								Q4 2024
Snapdragon 8 Gen 3 forGalaxy (SM8650-AC)			1× 3.4 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520)	Adreno750 1000 MHz (3072 GFLOPS in FP32)							Q1 2024
Snapdragon 8s Gen 3 (SM8635)			1× 3.0 GHz Kryo Prime (Cortex-X4) + 4× 2.8 GHz Kryo Gold (Cortex-A720) + 3× 2.0 GHz Kryo Silver (Cortex-A520)	Adreno735 1100 MHz (1689.6 GFLOPS in FP32)		Spectra (200 MP Photo Capture / 108 MP single camera @30fps ZSL / 64+36 MP dual camera @30fps ZSL / 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR)	LPDDR5Xquad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal:X70 5G(5G NR Sub-6 & mmWave: download @ 6.5 Gbit/s, upload @ 3.5 Gbit/s)			Q1 2024

Snapdragon 8 Elite (2024)

TheSnapdragon 8 Elitewas announced on October 22, 2024.

Features of the Snapdragon 8 Elite series

Notable features over its predecessor (8 Gen 3): Support for memory up to 5333.5 MHz (up from 4800 MHz) CPU features 2OryonPrime cores up to 4.32 GHz 12 MB L2 cache 6OryonPerformance cores up to 3.53 GHz 12 MB L2 cache 45% performance uplift and 44% power efficiency improvement 8 MB SLC, no L3 cache GPU features Adreno830 GPU with API support:OpenGL ES 3.2,OpenCL 3.0,Vulkan 1.3 Uses a sliced architecture, with 3 slices with 4 CUs per slice total 12 CU and 4 MB cache each in the Adreno 830. 40% faster graphics rendering and 40% more power efficient DSPfeatures HexagonNPU 45% AI performance improvement and 45% better performance per watt ISP features Limitless Segmentation Al Relighting Al Pet Suite Video Magic Eraser Modem and wireless features: InternalX80 5G Modem QualcommFastConnect 7900 Bluetooth6.0 support

Productname (Modelnumber)	Fab	Die size	CPU(Cores/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
Snapdragon 8 Elite (SM8750-AB)	3 nm (TSMC N3E)	124.1 mm2	Oryon 2 + 6 cores (4.32 GHz Prime cores + 3.53 GHz Performance core)	Adreno830 1100 MHz (3379.2 GFLOPS in FP32)	Hexagon	Spectra 320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR	LPDDR5X dual-channel 32-bit (64-bit) 5333.5 MHz (85.3 GB/s)	Internal:X80 5G(5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s)	FastConnect 7900, Bluetooth6.0, 802.11ax/be (Wi-Fi 7) @ 5.8 Gbit/s, GPS,QZSS,Glonass,NavIC,Beidou,Galileo, USB 3.1	5	Q4 2024
Snapdragon 8 Elite (SM8750-3-AB)			Oryon 2 + 5 cores (4.32 GHz Prime cores + 3.53 GHz Performance core)								Q1 2025
Snapdragon 8 Elite forGalaxy (SM8750-AC)			Oryon 2 + 6 cores (4.47 GHz Prime cores + 3.53 GHz Performance core)	Adreno830 1200 MHz (3686.4 GFLOPS in FP32)							Q1 2025

Mobile Compute Platforms

Further information:Devices using Qualcomm Snapdragon processors § Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

The first and second generations of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
TheSnapdragon 835 Mobile PC Platformfor Windows 10 PCs was announced on December 5, 2017.
TheSnapdragon 850 Mobile Compute Platformfor Windows 10 PCs, was announced on June 4, 2018.It is essentially an over-clocked version of the Snapdragon 845.

Productname (Modelnumber)	Fab	CPU(ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Snapdragon 835 (MSM8998)	10 nm (Samsung 10LPE)	Kryo 2804 + 4 cores (2.6 GHz + 1.9 GHz)	Adreno540 710 MHz (363.5 GFLOPS in FP32)	Hexagon682	Spectra 180 (Up to 32 MP camera / 16 MP dual)	LPDDR4XDual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11ac/ad Wave 2 (MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4	Q2 2018
Snapdragon 850 (SDM850)	10 nm (Samsung 10LPP)	Kryo 3854 + 4 cores (2.96 GHz + 1.77 GHz)	Adreno630 710 MHz (727 GFLOPS in FP32)	Hexagon685 (3 TOPS)	Spectra 280 (192MP single camera / 16MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4XQuad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)	X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)		4+	Q3 2018

Snapdragon 7c/7c+ Compute Platforms

TheSnapdragon 7c Compute Platformfor Windows 10 PCs was announced on December 5, 2019.
TheSnapdragon 7c Gen 2 Compute Platformfor Windows 10 PCs was announced on May 24, 2021.
TheSnapdragon 7c+ Gen 3 Compute Platformfor Windows 10 / 11 PCs was announced on December 1, 2021.

Productname (Modelnumber)	Fab	CPU(ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Snapdragon 7c (SC7180)	8 nm (Samsung 8LPP)	Kryo 468 2 + 6 cores (2.4 GHz)	Adreno618 825 MHz (422.4 GFLOPS in FP32)	Hexagon692 (5 TOPS)	Spectra 255 (32 MP camera, 16 MP dual)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)	X15 LTE (download: Cat 15, @ 800 Mbit/s; upload: Cat 13, @ 150 Mbit/s)	Bluetooth 5; 802.11ax (Wi-Fi 6); GPS,Glonass,SBAS,Beidou,Galileo,QZSS,NavIC; USB 3.1; eMMC 5.1,UFS3.0		Q1 2020
Snapdragon 7c Gen 2 (SC7180P)		Kryo 468 2 + 6 cores (2.55 GHz)								Q2 2021
Snapdragon 7c+ Gen 3 (SC7280)	6 nm (TSMC N6)	Kryo4 Gold + 4 Silver cores (Cortex-A78 2.4 GHz) + Cortex-A55		Hexagon (6.5 TOPS)	Spectra (64MP single camera, 36+22MP dual camera)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X53 5G/LTE(5G: download @ 3.7 Gbit/s, upload @ 2.9 Gbit/s; LTE Cat 24/22: download @ 1200 Mbit/s, upload @ 210 Mbit/s)	FastConnect 6700, Bluetooth5.2; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS,Glonass,BeiDou,Galileo,QZSS,SBAS, USB 3.1; eMMC 5.1,UFS2.1, NVMe SSD		Q1 2022

Snapdragon 8c Compute Platforms

TheSnapdragon 8c Compute Platformfor Windows 10 PCs was announced on December 5, 2019.

Productname (Modelnumber)	Fab	CPU(ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Snapdragon 8c (SC8180)	7 nm (TSMC N7)	Kryo 4904 + 4 cores (2.45 GHz + 1.80 GHz)	Adreno675 590 MHz	Hexagon690 (9 TOPS)	Spectra 390 (192MP single camera, 22MP at 30fps dual camera with MFNR / ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)	Internal: X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) External:X55 5G/LTE(5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)	Bluetooth5.0; 802.11ac/ad; GPS,Glonass,SBAS,Beidou,Galileo,QZSS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q1 2020

Snapdragon 8cx Compute Platforms

TheSnapdragon 8cx Compute Platformfor Windows 10 PCs was announced on December 6, 2018.
Notable features over the Snapdragon 855:

• 10 MB total cache (L3 + SLC)
• 8x 16-bit memory bus, (68.3 GB/s)
• NVM Express4x
• 112.05 mm2 die size

TheSnapdragon 8cx Gen 2 5G Compute Platformfor Windows 10 PCs was announced on September 3, 2020.
TheSnapdragon 8cx Gen 3 Compute Platformfor Windows 10 / 11 PCs was announced on December 1, 2021.

Notable features over the Snapdragon 888:

• 8 MB L3 cache & 6 MB SLC (14 MB total cache)
• 8x 16-bit memory bus, (68.3 GB/s)
• NVM Express4x
• Built-in Microsoft Pluton TPM

Productname (Modelnumber)	Fab	CPU(ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Snapdragon 8cx (SC8180X)	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (2.84 GHzCortex-A76 + 1.80 GHzCortex-A55)	Adreno680 585 MHz (1797.1 GFLOPS in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (32MP single camera, 16MP at 30fps dual camera with MFNR / ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s)	No internal modem Optional externalX24 LTE(Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM)	Bluetooth5.0; 802.11ac/ad; GPS,Glonass,SBAS,Beidou,Galileo,QZSS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q3 2019
Snapdragon 8cx Gen 2 5G (SC8180XP)		Kryo 495 4 + 4 cores (3.15 GHzCortex-A76 + 1.8 GHzCortex-A55)	Adreno690 660 MHz (2027.5 GFLOPS in FP32)				No internal modem Optional externalX24 LTE(Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) or X55 5G/LTE(5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)	Bluetooth5.1; 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 2.4 Gbit/s, NFC, GPS, Glonass, Beidou, Galileo, QZSS, SBAS, USB 3.1;UFS3.0. NVMe SSD		Q3 2020
Snapdragon 8cx Gen 3 (SC8280)	5 nm (Samsung 5LPE)	Kryo 4 + 4 cores (3.0 GHzCortex-X1 + 2.40 GHzCortex-A78)	Adreno695 900 MHz (3686.4 GFLOPS in FP32)	Hexagon (15 TOPS)	Spectra (24MP at 30fps single camera with MFNR/ZSL)		No internal modem Optional external X55 5G/LTE, X62 5G/LTE,X65 5G/LTE (5G: download @ 4.4/7.5/10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)	FastConnect 6900, Bluetooth5.1; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS,Glonass,BeiDou,Galileo,QZSS,SBAS, USB 3.1;UFS3.1, NVMe SSD		Q1 2022

Microsoft SQ compute platforms

Further information:Devices using Qualcomm Snapdragon processors § SQ

TheMicrosoft SQ1was announced on October 2, 2019.Co-developed withMicrosoft,it was exclusively designed for Microsoft'sSurface Pro X.Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
TheMicrosoft SQ2was announced on October 1, 2020.

Productname	Fab	CPU(ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Microsoft SQ1	7 nm (TSMC N7)	Kryo 4954 + 4 cores (3 GHzCortex-A76+ 1.80 GHzCortex-A55)	Adreno685 590MHz (1812.5 GFLOPs in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (192MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4XOcta-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)	No internal modem Optional external X24 LTE(Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)	Bluetooth5.0; 802.11ac/ad; GPS,GLONASS,Beidou,Galileo,QZSS,SBAS; USB 3.1;UFS3.0, NVMe SSD	4+	Q4 2019
Microsoft SQ2		Kryo 4954 + 4 cores (3.15 GHzCortex-A76+ 2.42 GHzCortex-A55)	Adreno 690 680MHz (2089 GFLOPs in FP32)							Q4 2020
Microsoft SQ3	5 nm (Samsung 5LPE)	Kryo4 + 4 cores (3.0 GHzCortex-X1+ 2.40 GHzCortex-A78)	Adreno 695 900MHz (3686.4 GFLOPS in FP32)	Hexagon(15 TOPS)	Spectra (24 MP at 30fps single camera with MFNR/ZSL)		No internal modem Optional external X62 5G/LTE,X55 5G/LTE,X65 5G/LTE(5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth5.1; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS,GLONASS,BeiDou,Galileo,QZSS,SBAS, USB 3.1;UFS3.1, NVMe SSD		Q3 2022

Snapdragon X series

TheSnapdragon X Elitefor Windows 11 PCs was announced on October 24, 2023.
TheSnapdragon X Plusfor Windows 11 PCs was announced on April 24, 2024.

Productname (Modelnumber)	Fab	CPU(Cores/Freq)	GPU	DSP/NPU	ISP	Memory technology	Modem	Connectivity	Sampling availability
Snapdragon X Plus X1P-42-100	4 nm (TSMC N4)	Oryon8 core (3.2 GHz, single-core boost up to 3.4 GHz)	Adreno X1-45 1107 MHz (1.7 TFLOPS)	Hexagon (45 TOPS)	Spectra (36 MP single camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal External: FastConnect 7800, Bluetooth5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS,GLONASS,BeiDou,Galileo,QZSS,SBAS, USB 4.0; UFS4.0, NVMe SSD	Mid-2024
X1P-46-100		Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz)	Adreno X1-45 (2.1 TFLOPS)
X1P-64-100		Oryon 10 core (3.4 GHz)	Adreno X1-85 1250 MHz (3.8 TFLOPS)		Spectra (64 MP single camera / 36 MP dual camera)
X1P-66-100		Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz)
Snapdragon X Elite X1E-78-100	4 nm (TSMC N4)	Oryon12 core (3.4 GHz)	Adreno X1-85 1250 MHz (3.8 TFLOPS)	Hexagon(45 TOPS)	Spectra (64 MP single camera / 36 MP dual camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal External: FastConnect 7800, Bluetooth5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS,Glonass,BeiDou,Galileo,QZSS,SBAS, USB 4.0;UFS4.0, NVMe SSD	Mid-2024
X1E-80-100		Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100		Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz)	Adreno X1-85 1500 MHz (4.6 TFLOPS)
X1E-00-1DE		Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)

Hardware codec supported

See:Qualcomm Hexagon

Wearable platforms

The Snapdragon Wear 1100 processor was announced May 30, 2016for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.

The Snapdragon Wear 1200 processor was announced June 27, 2017for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.

The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches.It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.

The Snapdragon Wear 2500 was announced on June 26, 2018.It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.

The Snapdragon Wear 3100 was announced on September 10, 2018.The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.

The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020.The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022.The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

Model number	Product name	Fab	CPU	Co-processor	GPU	DSP	Memory technology	Modem	Connectivity	Sampling availability
?	Wear 1100	28 nm	1 core up to 1.2 GHzCortex-A7(ARMv7)	—	Fixed FunctionGPU		LPDDR2	Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s)	Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	Q2 2016
	Wear 1200		1 core up to 1.3 GHzCortex-A7(ARMv7)					Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s)	Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	Q2 2017
MSM8909w	Wear 2100		4 cores up to 1.2 GHzCortex-A7(ARMv7)		Adreno304	Hexagon	LPDDR3400 MHz	X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 4.1;802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou	Q1 2016
	Wear 2500									Q2 2018
	Wear 3100			QCC1110 (1 core 50 MHzCortex-M0) 3100 & 4100+ only						Q3 2018
SDM429w	Wear 4100 and 4100+	12 nm + 28 nm	4 cores up to 2.0 GHzCortex-A53(ARMv8-A)		AdrenoA504 320 MHz	HexagonQDSP6 V56	1x32 bitLPDDR3750 MHz		Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	Q2 2020
SW5100	W5 and W5+ Gen 1	4 nm + 22 nm	4 cores up to 1.7 GHzCortex-A53(ARMv8-A)	QCC5100 (1 core 250 MHzCortex-M55+ Ethos-U55) W5+ only	AdrenoA702 1 GHz	HexagonDSP V66K	1x16 bitLPDDR42133 MHz	Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	Q3 2022

Automotive platforms

The Snapdragon 602A,for application in the motor industry,was announced on January 6, 2014.
The Snapdragon 820Awas announced on January 6, 2016.

Snapdragon Automotive Cockpit platform SA4150P SA4155P SA6145P SA6150P SA6155 SA6155P •

SA7255P SA8145P SA8150P SA8155 SA8155P • SA8195P • SA8255P • SA8295P •

Snapdragon Ride & Ride Flex platform SA8540P SA8620P SA8650P SA8770P SA8775P SA9000P • AI Accelerator

Snapdragon Cockpit Elite Snapdragon Digital Chassis Snapdragon Ride Elite Qualcomm Oryon CPU

Productname (Modelnumber)	Fab	CPU(Core/Freq)	GPU	DSP	Memory technology	Modem	Connectivity	Sampling availability
Snapdragon 602A (APQ8064-AU)	28 nm (TSMC 28LP)	Krait300 4 cores 1.51 GHz (ARMv7)	Adreno320 400 MHz (76.8 GFLOPs) (2048x1536 + 1080p external display)	Hexagon QDSP6 V4 500 MHz	LPDDR3 Dual-channel 32-bit 533 MHz (8.5 GB/s)	External:GobiMDM9615 LTE:FDD/TDDCat3 CDMA: EV-DOrB/rA 1x UMTS: TD-SCDMA, DC-HSPA+/HSPA GSM: EDGE/GPRS	Bluetooth 4.1 + BLE Qualcomm VIVE QCA6574 802.11ac (Wi-Fi 5) 2x2 (MU-MIMO)	Q1 2014
Snapdragon 820AM (APQ8096AU/ MSM8996AU)	14 nm (Samsung 14LPP)	Kryo2 + 2 cores 2.15 GHz Gold + 1.59 GHz Silver (ARMv8)	Adreno530 624 MHz (319.4 GFLOPs)	Hexagon 680 1.0 GHz	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	Internal: APQ: no MSM: X12 LTE Download: Cat 12, 600 Mbit/s Upload: Cat 13, 150 Mbit/s	Bluetooth 4.1 802.11ac(Wi-Fi 5) IZat Gen8C	Q1 2016
SA6155P	11 nm (Samsung 11LPP)	Kryo 460 2 + 6 cores (2.0 GHz Gold + 1.6 GHz Silver)	Adreno 608/612 (110 GFLOPs)	Hexagon685 V6 DSP, Spectra 230 ISP	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal: no	Bluetooth 5.0 802.11ac (Wi-Fi 5) GPS,Glonass,Beidou, Galileo, QZSS, SBAS	Q1 2019
Snapdragon 855A (SA8155P)	7 nm (TSMC N7)	Kryo 485 1 + 3 + 4 cores 2.96 GHz Prime + 2.42 GHz Gold + 1.79 GHz Silver	Adreno640 675 MHz (1036.8 GFLOPs)	Hexagon 690 (10 TOPS)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)	X24 LTE Modem FDD·TDD Cat.20 2Gbps/316Mbps 7·3CA / VoLTE, 3G GSM, CDMA 2000, TD-SCDMA, 2G GSM/CDMA	Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS	Q1 2021
SA8195P		Kryo 495 4 + 4 cores Cortex-A76+ Cortex-A55	Adreno680 600 MHz (1843.2 GFLOPs)	Hexagon	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)	Internal: no	Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS
SA8255P	5 nm (Samsung 5LPE)	Kryo4 + 4 cores 2.35 GHz Prime + 2.35 GHz Gold	Adreno663	Hexagon	LPDDR5 Hexa-channel 16-bit (96-bit) 3200 MHz (76.8 GB/s)		Bluetooth 5.2 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS
SA8295P		Kryo 695 4 + 4 cores 2.56 GHz Cortex-X1+ 2.05 GHz Cortex-A78	Adreno695	Hexagon (30 TOPS)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)		Bluetooth 5.2 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 1.7 Gbit/s GPS, Glonass, Beidou, Galileo, QZSS, SBAS	2023

Embedded platforms

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.

Productname (Modelnumber)	Fab	CPU (Cores/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
Snapdragon 410E (APQ8016E)	28 nm (TSMC 28LP)	4 cores up to 1.2 GHz Cortex-A53 (ARMv8)	Adreno306	Hexagon QDSP6 V5 691 MHz	Up to 13 MP camera	LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	none	Bluetooth 4.0, 802.11n, GPS
Snapdragon 600E (APQ8064E)		4 cores up to 1.5 GHz Krait300 (ARMv7)	Adreno320 400 MHz	HexagonQDSP6 V4 500 MHz	Up to 21 MP camera	DDR3/DDR3L Dual-channel 533 MHz		Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
Snapdragon 800E (APQ8074)	28 nm (TSMC 28HPM)	4 cores up to 2.3 GHz Krait400 (ARMv7)	Adreno330	Hexagon QDSP6 V5	Up to 55 MP camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)		Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, JTAG; USB 3.0/2.0
Snapdragon 810E (APQ8094)	20 nm (TSMC 20SoC)	4 + 4 cores 2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53 (ARMv8)	Adreno430 650 MHz	Hexagon V56 800 MHz	Up to 55 MP camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)		Bluetooth 4.1; 802.11ac; IZat Gen8C
Snapdragon 820E (APQ8096)	14 nm FinFET (Samsung 14LPP)	2 + 2 cores (2.15 GHz + 1.6 GHz) Kryo (ARMv8)	Adreno530	Hexagon 680 825 MHz	Up to 28 MP camera	LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)		Bluetooth 4.1; 802.11ac/ad; IZat Gen8C

Vision Intelligence Platform

The Qualcomm Vision Intelligence Platformwas announced on April 11, 2018.The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Modelnumber	Fab	CPU(ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
QCS603	10 nm (Samsung 10LPP)	2 + 2 cores (1.6 GHzKryo360 Gold + 1.7 GHzKryo360 Silver)	Adreno615 (Quad HD + 4K Ultra HD external display)	Hexagon685	Spectra270 (Up to 24 MP camera / 16 MP dual)	LPDDR4X16-bit 1866 MHz	none	Bluetooth 5.0,NFC,802.11ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4+
QCS605		8 cores up to 2.5 GHzKryo300			Spectra 270 (Up to 32 MP camera / 16 MP dual)			Bluetooth 5.0,NFC,802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

Home Hub and Smart Audio platforms

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)was announced on June 14, 2017.
The Qualcomm 212 Home Hub (APQ8009)and Qualcomm 624 Home Hub (APQ8053)were announced on January 9, 2018.

The QCS400 Series was announced March 19, 2019.

Modelnumber	Fab	CPU(Cores/Freq)	GPU	DSP	ISP	Audio	Memory technology	Modem	Connectivity	Sampling availability
APQ8009 (SDA212)	28 nm (TSMC 28LP)	4 cores up to 1.3 GHz Cortex-A7(ARMv7)	Adreno304 (HD)	Hexagon536	Up to 16 MP camera		LPDDR2/3Single-channel 533 MHz	none	Bluetooth 4.2 + BLE, 802.11ac (2.4/5GHz) Wi-Fi
APQ8017		4 cores up to 1.4 GHz Cortex-A53(ARMv8)	Adreno308 (Full HD)				LPDDR3Single-channel 667 MHz
APQ8053 (SDA624)	14 nm (Samsung 14LPP)	8 cores up to 1.8 GHz Cortex-A53(ARMv8)	Adreno506 (Full HD+)	Hexagon546	Up to 24 MP camera, 13 MP dual		LPDDR3
QCS403		Dual-core CPU	none	2xHexagonV66		12× audio channels supported			Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4	Q1 2019
QCS404		Quad-core CPU
QCS405			Adreno306 (Full HD+)
QCS407						32× audio channels supported

Mixed Reality (MR) platforms

Snapdragon XR series

• Snapdragon XR1was announced in May 2018, is designed forAugmented reality,Virtual realityandmixed reality.
• Snapdragon XR2was announced in December 2019, and is a derivative of the Snapdragon 865.

It is used in theMeta Quest 2,theHTC Vive Focus 3and thePico 4.

• Snapdragon XR2+ Gen 1was announced on October 11, 2022,and is used in theMeta Quest Pro.
• Snapdragon XR2 Gen 2is announced in September 2023.Qualcomm claims improved performance compared to its predecessor XR2 5G.

The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.

It supportsWi-Fi 7network. It is integrated intoMeta Quest 3.

• Snapdragon XR2+ Gen 2is anoverclockedversion of the XR2 Gen 2.

Productname	Fab	CPU(ARMv8)	GPU	DSP	ISP	Memory technology	Tracking	Connectivity	Sampling availability
XR1	10 nm (Samsung 10LPP)	4xKryo 385 Gold + 4x Kryo 385 Silver	Adreno 615	Hexagon 685	Spectra	LPDDR4X	3DoF and 6DoF head and controller tracking	Wi-Fi 5 Bluetooth 5	Q1 2019
XR2	7 nm (TSMC N7+)	1xKryo 585 Prime + 3x Kryo 585 Gold + 4x Kryo 585 Silver	Adreno 650 (up to 2x 3K displays at 90 Hz)	Hexagon 698	Spectra (input from up to 7 cameras)		Full 6DoF head and controller tracking, as well as hand and finger tracking	Wi-Fi 6 Bluetooth 5 5G	Q1 2020
XR2+ (Gen 1)						LPDDR5		Wi-Fi 6E Bluetooth 5.2 5G	Q4 2022
XR2 (Gen 2)	4 nm (Samsung 4LPX)	1xKryoPrime (Cortex-X3, 2.36 GHz) + 2x Kryo Gold (Cortex-A715, 2.36 GHz) + 3x Kryo Silver (Cortex-A510, 2.05GHz)	Adreno 740 (up to 2x 3K displays at 90 Hz)	Hexagon	Spectra (input from up to 10 cameras)	LPDDR5X		Wi-Fi 7 Bluetooth 5.3 5G	Q4 2023
XR2+ (Gen 2)		1x Kryo Prime (Cortex-X3) + 2x Kryo Gold (Cortex-A715) + 3x Kryo Silver (Cortex-A510)	Adreno 740 (up to 2x 4.3K displays at 90 Hz)	Hexagon	Spectra (input from up to 12 cameras)				Q1 2024

Snapdragon AR series

The QualcommSnapdragon AR2 Gen 1 Platformwas announced November 17, 2022.It is intended for use in smart glasses.
On September 27, 2023 Qualcomm announced theSnapdragon AR1 Gen 1 Platformfor slim and lightARglasses.It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

Gaming platforms

Snapdragon G series

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform.

TheRazer Edgeis the first device to use the platform.

The G3x Gen 1 is based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters

with higher clock speeds, and the same GPU with a higher clockspeed. Connectivity options also seem in line.

In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.

Productname	Fab	CPU(Cores/Freq)	GPU	Modem	Connectivity	Display	Sampling availability
G1 (Gen 1)	Un­known	Kryo (8 core)	Adreno A11	—	Wi-Fi 5, Bluetooth 5.0	HD at 60 fps	Q4 2023
G2 (Gen 1)	Un­known		AdrenoA21	X62 5G/LTE	Wi-Fi 6/6E, Bluetooth 5.0	FHD+ up to 144 fps
G3x (Gen 1)	5 nm (Samsung 5LPE)	1x 3.0 GHz Kryo 680 Prime (Cortex-X1) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78) + 4x 1.80 GHz Kryo 680 Silver Cortex-A55)	Adreno660 900 MHz (1382.4 GFLOPs in FP32)	X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect6900; Bluetooth5.2; 802.11ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s		Q1 2023
G3x (Gen 2)	4 nm (TSMC N4)	1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2×Cortex-A715, 2×Cortex-A710) + 3× 2.02 GHz Kryo Silver (Cortex-A510)	AdrenoA32 1000 MHz (3072 GFLOPS in FP32)	X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect7800; Bluetooth5.3; 802.11ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s		Q4 2023

Bluetooth SoC platforms

Following Qualcomm's acquisition ofCSRin 2015, Qualcomm designs ultra-low-powerBluetoothSoCsunder the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with bothAmazonandGoogleon reference designs to help manufacturers develop headsets with support forAlexa,Google AssistantandGoogle Fast Pair.Qualcomm announced the QCC5100 Series at CES 2018.

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.On March 25, 2020, theBLE AudioQCC304x and QCC514x SoCs were officially announced.

Qualcomm QCC300x Series Bluetooth audio SoCs

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	DAC output / Digital microphone input	Sampling availability
QCC3001		RISC application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 80 MHz)	Bluetooth 5.0 Dual-mode Bluetooth	TrueWireless Stereo cVc audio		Mono / 2-mic
QCC3002					TrueWireless Stereo aptX Classic/HD/LL cVc audio
QCC3003					cVc audio		Stereo / 1-mic
QCC3004							Stereo / 2-mic
QCC3005					aptX Classic/HD/LL cVc audio

Qualcomm QCC30xx Series Bluetooth audio SoCs

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	DAC output / Digital microphone input	Digital assistant activation	Sampling availability
QCC3020		Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio	~6mA (2DP streaming)	Mono / 2-mic	Button press	H1 2017
QCC3021							Stereo / 1-mic
QCC3024					cVc audio Google Fast Pair		Stereo / 2-mic
QCC3026					aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Mono / 2-mic
QCC3031					aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Stereo / 1-mic
QCC3034					aptX Classic/HD/LL cVc audio Google Fast Pair		Mono / 2-mic
QCC3040		Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s	aptX Classic/HD TrueWireless mirroring ANC (Feedforward/feedback and hybrid) cVc audio Google Fast Pair	<5 mA	Stereo / 2-mic	Button press	H1 2020
QCC3046						<5 mA

Qualcomm QCC510x Series Bluetooth audio SoCs

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	Digital assistant activation	Sampling availability
QCC5120		Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair	~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc	Button press Qualcomm Voice Activation	H1 2018
QCC5121
QCC5124
QCC5125			Single core Qualcomm Kalimba DSP (Up to 120 MHz)		aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc	Button press
QCC5141		Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s	aptX Adaptive eXtension program TrueWireless Mirroring ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~5mA A2DP stream	Button press Qualcomm Voice Activation	H1 2020
QCC5144

See also

• List of devices using Qualcomm Snapdragon systems on chips
• Qualcomm Adreno
• Qualcomm Hexagon
• List of Qualcomm Snapdragon modems
• Apple M1
• Tegra
• Exynos
• HiSilicon
• List of MediaTek systems on chips
• List of UNISOC systems on chips

External links

• Media related toSnapdragon (microprocessor)at Wikimedia Commons
• Official website,product page