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List of Qualcomm Snapdragon systems on chips

(Redirected fromSnapdragon 835)

This is alist ofQualcomm Snapdragonsystems on chips(SoC) made byQualcommfor use insmartphones,tablets,laptops,2-in-1 PCs,smartwatches,andsmartbooksdevices.

Qualcomm Snapdragon
General information
Launched2007;17 years ago(2007)
Designed byQualcomm
Architecture and classification
ApplicationMobileSoCand2-in-1 PC
MicroarchitectureARM9,ARM11,ARM Cortex-A,Cortex-X1,Cortex-X2,Cortex-X3,Cortex-X4,Scorpion,Krait,Kryo,Oryon
Instruction setARMv6,ARMv7-A,ARMv8-A,ARMv9-A
Physical specifications
Cores
  • 1, 2, 4, 6, or 8

Before Snapdragon

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SoC made by Qualcomm before it was renamed to Snapdragon.[1]

Model number Fab CPU GPU(or Gfx Core) Connectivity Sampling availability
QSC1xxx
QSC1100 Q4 2007
QSC6xxx
QSC6010 ARMv5TEJ ARM926EJ-S[citation needed] No 3D and ARM 2D None 2006
QSC6020
QSC6030
QSC6240 HSDPA Q3 2007
QSC6245-1 HSDPA Q3 2007
QSC6055 Q1 2007
QSC6065 HSDPA Q2 2007
QSC6260-1 Q3 2007
QSC6270 HSDPA
QSC6075 Q2 2007
QSC6085 DOrA Q4 2007
MSM6xxx
MSM6000 None 2006
MSM6025
MSM6050
MSM6100 ARM-DSP 3D and ARM 2D
MSM6125
MSM6150 Defender2 3Dand ARM 2D
MSM6175
MSM6225 No 3D and ARM 2D HSDPA
MSM6250 ARM-DSP 3D and ARM 2D WCDMA 2006
MSM6250A No 3D and ARM 2D WCDMA
MSM6245 WEDGE
MSM6255A
MSM6260 ARMv5TEJ ARM926EJ-S @ 225 MHz[2] ARM-DSP 3D and ARM 2D HSUPA
MSM6275 Defender2 3Dand ARM 2D
MSM6280
MSM6280A Stargate 3Dand ARM 2D 2007
MSM6800A Defender3 3Dand ARM 2D DOrA 2006
MSM6575 DOr0
MSM6550 ARMv5TEJ ARM926EJ-S @ 225 MHz[3] Defender2 3Dand ARM 2D
MSM6550A
MSM6800 DOrA
MSM6500 ARMv5TEJ ARM926EJ-S @ 150 MHz[4] ARM-DSP 3D and ARM 2D DOr0
MSM7xxx
MSM7200 Imageon3D

Imageon2D

HSUPA 2006
MSM7200A ARM11@ 528 MHz Q1 2007
MSM7201[5][6] 2008
MSM7500 DOrA 2006
MSM7500A Q4 2007
MSM7600 65 nm ARM1136J-S @ 528 MHz[5][6] HSUPAand DOrA Q1 2007
MSM7850 LT 3D and LT 2D DOrB 2008

Snapdragon S series

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Snapdragon S1notable features over its predecessor (MSM7xxx):

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S1
Model number Fab CPU GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7225[8] 65 nm 1 core up to 528MHzARM11(ARMv6): 16K+16KL1 cache,noL2 cache Software rendered 2D support (HVGA) HexagonQDSP5 320 MHz Up to 5 MP camera LPDDRSingle-channel 166 MHz (1.33 GB/s) UMTS(HSPA);GSM(GPRS,EDGE) Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 2007
MSM7625[8] CDMA(1× Rev. A, 1×EV-DORev. A);UMTS;GSM
MSM7227[8] 1 core up to 800 MHzARM11(ARMv6): 16K+16KL1 cache,256KL2 cache Adreno200 226 MHz (FWVGA) Up to 8 MP camera LPDDRSingle-channel 166 MHz (1.33 GB/s) UMTS;GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 2008
MSM7627[8] CDMA/UMTS;GSM
MSM7225A[8] 45 nm 1 core up to 800 MHzCortex-A5(ARMv7): 32K+32KL1 cache,256KL2 cache Adreno200 245 MHz (HVGA) HexagonQDSP5 350 MHz Up to 5 MP camera LPDDRSingle-channel 200 MHz (1.6 GB/s) UMTS(HSDPA,HSUPA,W-CDMA),MBMS;GSM Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 Q4 2011
MSM7625A[8] CDMA2000(1×RTT, 1×EV-DORel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A[8] 1 core up to 1GHzCortex-A5(ARMv7): 32K+32KL1 cache,256KL2 cache Adreno200 245 MHz (FWVGA) Up to 8 MP camera UMTS,MBMS;GSM
MSM7627A[8] CDMA2000/UMTS, MBMS; GSM
MSM7225AB[8][9][10] UMTS:up to 7.2 Mbit/s,MBMS;GSM
QSD8250[8] 65 nm 1 core up to 1 GHzScorpion(ARMv7): 32K+32KL1 cache,256KL2 cache Adreno200 226 MHz (WXGA) HexagonQDSP6 600 MHz Up to 12 MP camera LPDDRSingle-channel 400 MHz UMTS,MBMS;GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 Q4 2008
QSD8650[8] CDMA2000/UMTS, MBMS; GSM

Snapdragon S2notable features over its predecessor (Snapdragon S1):

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S2
Model number Fab CPU(ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7230[8] 45 nm 1 core up to 800 MHzScorpion:32K+32K L1, 256K L2 Adreno205 266 MHz (XGA) HexagonQDSP5 256 MHz Up to 12 MP camera LPDDR232 bit Dual-channel 333 MHz (5.3 GB/s)[15] UMTS (HSDPA, HSUPA,HSPA+,W-CDMA), MBMS;GSM(GPRS, EDGE) Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 Q2 2010
MSM7630[8] CDMA2000 (1×Adv,[16]1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055[8] 1 core up to 1.4 GHzScorpion:32K+32K L1, 384K L2 —
MSM8255[8] 1 core up to 1 GHzScorpion:32K+32K L1, 384K L2 UMTS, MBMS;GSM
MSM8655[8] CDMA2000/UMTS, MBMS;GSM
MSM8255T[8] 1 core up to 1.5 GHzScorpion:32K+32K L1, 384K L2 UMTS, MBMS;GSM
MSM8655T[8] CDMA2000/UMTS, MBMS;GSM

Snapdragon S3notable features over its predecessor (Snapdragon S2):

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S3
  • CPUfeature
  • GPUfeatures
  • DSPfeatures
  • ISPfeatures
    • Up to 16 MP camera (From 12 MP)
  • 45 nm manufacturing technology
Model number Fab CPU(ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
APQ8060[8] 45 nm 2 cores up to 1.7 GHzScorpion:512 KB L2 Adreno220 266 MHz (WXGA+) HexagonQDSP6 400 MHz Up to 16 MP camera LPDDR2Single-channel 333 MHz (2.67 GB/s)[17] — Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 2011
MSM8260[8] UMTS(HSDPA, HSUPA, HSPA+,W-CDMA),MBMS;GSM(GPRS,EDGE) Q3 2010
MSM8660[8] CDMA2000(1×Adv,[16]1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A);UMTS,MBMS;GSM

Snapdragon S4is offered in three models;S4 Playfor budget and entry-level devices,S4 Plusfor mid-range devices andS4 Profor high-end devices.[18]It was launched in 2012.

The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro)

Snapdragon S4 Play

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S4 Play
Model number Fab CPU(ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8225[18] 45 nm 2 cores up to 1.2 GHzCortex-A5:2x 32K+32K L1, 512K L2 Adreno203 320 MHz (FWVGA) Hexagon Up to 8 MP camera LPDDR2Single-channel 300 MHz UMTS(HSPA);GSM(GPRS,EDGE) Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 1H 2012
MSM8625[18] CDMA(1×Rev.A, 1×EV-DO Rev.A/B);UMTS;GSM

Snapdragon S4 Plus

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S4 Plus

Snapdragon S4 plusnotable features over its predecessor (Snapdragon S3):

Model number Fab CPU(ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8227[18] 28 nm 2 cores up to 1 GHzKrait:4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno305 320 MHz (FWVGA / 720p) HexagonQDSP6 LPDDR2Single-channel 400 MHz UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 2H 2012
MSM8627[18] CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB);UMTS;GSM
APQ8030[18] 2 cores up to 1.2 GHzKrait:4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno305 400 MHz (qHD / 1080p) Up to 13.5 MP camera LPDDR2Single-channel 533 MHz — 3Q 2012
MSM8230[18] UMTS; GSM
MSM8630[18] CDMA/UMTS; GSM
MSM8930[18] World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM)
APQ8060A[18] 2 cores up to 1.5 GHzKrait:4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno225 400 MHz (WUXGA / 1080p) Up to 20 MP camera LPDDR2Dual-channel 500 MHz — 2H 2012
MSM8260A[18] UMTS; GSM Q1 2012
MSM8660A[18] CDMA/UMTS; GSM
MSM8960[18][20] World Mode (LTE Cat 3)

Snapdragon S4 Pro and Snapdragon S4 Prime (2012)

Further information:Devices using Qualcomm Snapdragon processors § Snapdragon S4 Pro

Snapdragon S4 Pronotable features over its predecessor (Snapdragon S4 Play):

  • CPUfeatures
    • up to 2 cores up to 1.7 GHzKrait300 on to Snapdragon S4 Pro
    • up to 4 cores up to 1.5 GHzKrait300 on to Snapdragon S4 Prime
    • 4+4 KB L0, 16+16 KB L1, 1 MB L2
  • GPUfeatures
  • DSPfeatures
  • ISPfeatures
    • Up to 20 MP camera
  • Modemandwirelessfeatures
    • LTE FDD/TDD Cat 3 or external on some models
  • 28 nm LP manufacturing technology
  • Up toeMMC4.4/4.4.1
Model number Fab CPU(ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8260A Pro[18] 28 nm (TSMC 28LP) 2 cores up to 1.7 GHzKrait300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno320 400 MHz (WUXGA / 1080p) HexagonQDSP6 Up to 20 MP camera LPDDR2Dual-channel 500 MHz UMTS (DC-HSPA+,TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T[18] World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) Q2 2012
MSM8960T Pro (MSM8960AB[21])[18]
MSM8960DT[18][22] 2 cores up to 1.7 GHzKrait300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; natural language processor and contextual processor Q3 2013
APQ8064[18][20] 4 cores up to 1.5 GHzKrait:4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno320 400 MHz (QXGA / 1080p) LPDDR2Dual-channel 533 MHz[23] External 2012

Snapdragon 2 Series

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Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 2 series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 series (2013–2019)

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The Snapdragon 200 was announced in 2013.
The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.[24]
The Snapdragon 212 was announced on July 28, 2015.[25]
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.[26]
The Qualcomm 215 was announced on July 9, 2019.[27]It is a toned-down variant of the Snapdragon 425 and primarily optimized forAndroid Go Editiondevices.

Model number Product Name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8225Q[28] Snapdragon 200 45 nm (TSMC 45LP) 4 cores up to 1.4 GHzCortex-A5 Adreno203 400 MHz (12.8 GFLOPS in FP32) HexagonQDSP5 Up to 8 MP single camera LPDDR2Single-channel 333 MHz Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 — 2013
MSM8625Q[28] Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210[28][29] 28 nm (TSMC 28LP) 2 cores up to 1.2 GHzCortex-A7 Adreno302 400 MHz (12.8 GFLOPS in FP32) HexagonQDSP6 Gobi 3G (UMTS; GSM)
MSM8610[28][29] Gobi 3G (CDMA/UMTS; GSM)
MSM8212[28][29] 4 cores up to 1.2 GHzCortex-A7 Gobi 3G (UMTS; GSM)
MSM8612[28][29] Gobi 3G (CDMA/UMTS; GSM)
MSM8905[30] Qualcomm 205 2 cores up to 1.1 GHzCortex-A7 Adreno304 400 MHz (19.2 GFLOPS in FP32) Hexagon536 Up to 3 MP single camera LPDDR2/3Single-channel 384 MHz X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) 4.0 2017
MSM8208[31] Snapdragon 208 Up to 5 MP single camera LPDDR2/3Single-channel 400 MHz Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM) 2.0 2014
MSM8909[32] Snapdragon 210 4 cores up to 1.1 GHzCortex-A7 Up to 8 MP single camera LPDDR2/3Single-channel 533 MHz X5 LTE
MSM8909AA[33] Snapdragon 212 4 cores up to 1.3 GHzCortex-A7 2015
QM215[34] Qualcomm 215 4 cores up to 1.3 GHzCortex-A53 Adreno308 485 MHz (23.3 GFLOPS in FP32) Hexagon Up to 13 MP single camera / 8 MP dual camera LPDDR3Single-channel 672 MHz 3 GB X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 1.0 Q3 2019

Snapdragon 4 Series

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Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 4 series

The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.

Snapdragon 400 series (2013–2021)

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The Snapdragon 400 was announced in 2013.
The Snapdragon 410 was announced on December 9, 2013.[35]It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China bySMIC.[36]
The Snapdragon 412 was announced on July 28, 2015.[25]
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.[37]
Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.[38]
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.[39]
The Snapdragon 427 was announced on October 18, 2016.[40][41]
The Snapdragon 450 was announced on June 28, 2017.[42]Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018.[43]Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.
The Snapdragon 460 was announced on 20 January 2020, withNavICsupport. It is the first Snapdragon 400 model to incorporate theKryoarchitecture.[44]
The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.[45]
The Snapdragon 480+ was announced on October 26, 2021.[46]

Model number Product Name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8026[47] Snapdragon 400 28 nm (TSMC 28LP) 4 cores up to 1.2 GHzCortex-A7:32 KB L1, 512 KB L2 Adreno305 400 MHz (19.2 GFLOPS in FP32) HexagonQDSP6 Up to 13.5 MP single camera LPDDR2/3Single-channel 533 MHz — Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS 1.0 2013
MSM8226[47] Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626[47] Gobi 3G (CDMA/UMTS)
MSM8926[47] Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028[47] 4 cores up to 1.6 GHzCortex-A7:32 KB L1, 512 KB L2 Adreno305 450 MHz (21.6 GFLOPS in FP32) —
MSM8228[47] Gobi 3G (UMTS)
MSM8628[47] Gobi 3G (CDMA/UMTS)
MSM8928[47] Gobi 4G (LTE Cat 4)
MSM8230[47] 2 cores up to 1.2 GHzKrait200: 32 KB L1, 1 MB L2 Adreno305 400 MHz (19.2 GFLOPS in FP32) LPDDR2Single-channel 533 MHz Gobi 3G (UMTS)
MSM8630[47] Gobi 3G (CDMA/UMTS)
MSM8930[47] Gobi 4G (LTE Cat 4)
MSM8930AA[47] 2 cores up to 1.4 GHzKrait300: 32 KB L1, 1 MB L2 Gobi 4G (LTE Cat 4)
APQ8030AB[47] 2 cores up to 1.7 GHzKrait300: 32 KB L1, 1 MB L2 Adreno305 450 MHz (21.6 GFLOPS in FP32) —
MSM8230AB[47] Gobi 3G (UMTS)
MSM8630AB[47] Gobi 3G (CDMA/UMTS)
MSM8930AB[47] Gobi 4G (LTE Cat 4)
APQ8016 Snapdragon 410 28 nm (TSMC 28LP) / 28 nm (SMIC) 4 cores up to 1.2 GHzCortex-A53 Adreno306 400/450 MHz (19.2/21.6 GFLOPS in FP32) HexagonQDSP6 V5 LPDDR2/3Single-channel 32-bit 533 MHz (4.2 GB/s) — Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou 2.0 H1 2014
MSM8916[48] X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2[49] Snapdragon 412 28 nm (TSMC 28LP) 4 cores up to 1.4 GHzCortex-A53 Adreno306 450 MHz (21.6 GFLOPS in FP32) LPDDR2/3Single-channel 32-bit 600 MHz (4.8 GB/s) H2 2015
MSM8929[50] Snapdragon 415 4 + 4 cores (1.4 GHz + 1.0 GHzCortex-A53) Adreno405 465 MHz (44.6 GFLOPS in FP32) HexagonV50 Up to 13 MP single camera LPDDR3Single-channel 32-bit 667 MHz (5.3 GB/s) Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS H1 2015
MSM8917[51] Snapdragon 425 4 cores up to 1.4 GHzCortex-A53 Adreno308 598 MHz (28.7 GFLOPS in FP32) Hexagon536 Up to 16 MP single camera X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C Q3 2016
MSM8920[52] Snapdragon 427 X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 Q1 2017
MSM8937[53] Snapdragon 430 4 + 4 cores (1.4 GHz + 1.1 GHzCortex-A53) Adreno505 450 MHz (43.2 GFLOPS in FP32) Up to 21 MP single camera LPDDR3Single-channel 32-bit 800 MHz (6.4 GB/s) X6 LTE Q2 2016
MSM8940[54] Snapdragon 435 X9 LTE Q4 2016
SDM429[55] Snapdragon 429 12 nm (TSMC 12FFC) 4 cores up to 2.0 GHzCortex-A53 Adreno504 320 MHz (30.7 GFLOPS in FP32) Hexagon536 Up to 16 MP single camera / 8 MP dual camera X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0 Q3 2018
SDM439[56] Snapdragon 439 4 + 4 cores (2.0 GHz + 1.45 GHzCortex-A53) Adreno505 650 MHz (62.4 GFLOPS in FP32) Up to 21 MP single camera / 8 MP dual camera
SDM450[57] Snapdragon 450 14 nm (Samsung 14LPP) 8 cores up to 1.8 GHzCortex-A53 Adreno505 600 MHz (57.6 GFLOPS in FP32) Hexagon546 Up to 24 MP single camera / 13 MP dual camera LPDDR3Single-channel 32-bit 933 MHz (7.5 GB/s) X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 Q3 2017
SM4250-AA[58] Snapdragon 460 11 nm (Samsung 11LPP) 4 + 4 cores (1.8 GHzKryo 240 Gold–Cortex-A73+ 1.6 GHzKryo 240 Silver–Cortex-A53) Adreno610 600 MHz (153.6 GFLOPS in FP32) Hexagon683 Spectra 340 (48 MP single camera / 16 MP dual camera) LPDDR3up to 933 MHz
or
LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) 		X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1,NFC,Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready,NavIC,USB C Q1 2020
SM4350[59] Snapdragon 480 8 nm (Samsung 8LPP) 2 + 6 cores (2.0 GHzKryo 460 Gold–Cortex-A76+ 1.8 GHzKryo 460 Silver–Cortex-A55) Adreno619 650 MHz (332.8 GFLOPS in FP32) Hexagon686 (3.3 TOPS) Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) LPDDR4XDual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) InternalX51 5G(5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1,NFC,802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C 4+ H1 2021
SM4350-AC[60] Snapdragon 480+ 2 + 6 cores (2.2 GHzKryo 460 Gold–Cortex-A76+ 1.9 GHzKryo 460 Silver–Cortex-A55) FastConnect 6200, Bluetooth 5.2,NFC,802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C Q4 2021

Snapdragon 4 (2022–2024)

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The Snapdragon 4 Gen 1 was announced on September 6, 2022.[61]
The Snapdragon 4 Gen 2 was announced on June 26, 2023.[62]
The Snapdragon 4 Gen 2 Leading Version was launched on Redmi Note 13R on May 17, 2024.[63]
The Snapdragon 4s Gen 2 was announced on July 30, 2024.[64]

Model number Product Name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM4375[65] Snapdragon 4 Gen 1 6 nm (TSMC N6) 2 + 6 cores (2.0 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55) Adreno619 700 MHz (358.4 GFLOPS in FP32) Hexagon Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) InternalX51 5G(5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1 4+ Q3 2022
SM4450[66] Snapdragon 4 Gen 2 4 nm (Samsung 4LPX) 2 + 6 cores (2.2 GHzKryo Gold–Cortex-A78+ 1.95 GHzKryo Silver–Cortex-A55) Adreno613 955 MHz (244.5 GFLOPS in FP32) — Spectra (108 MP single camera / 16 MP dual camera with ZSL) LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) 		InternalX61 5G(5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1 Q2 2023
Snapdragon 4 Gen 2 Accelerated Edition[a] 4 nm (TSMC N4) 2 + 6 cores (2.3 GHzKryo Gold–Cortex-A78+ 1.95 GHzKryo Silver–Cortex-A55) Q2 2024
SM4635[67] Snapdragon 4s Gen 2 4 nm (Samsung) 2 + 6 cores (2.0 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55) Adreno611 Spectra (84 MP single camera / 16 MP dual camera with ZSL) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) Internal (5G NR Sub-6: download up to 1 Gbit/s) Q3 2024
  1. ^Also known as "Leading Version".

Snapdragon 6 Series

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Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 6 series

The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.

Snapdragon 600 series (2013–2023)

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The Snapdragon 600 was announced on January 8, 2013.[68]Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.
The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014.[69]The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.[70]
The Snapdragon 616 was announced on July 31, 2015.[71]
The Snapdragon 617 was announced on September 15, 2015.[38]
The Snapdragon 625 was announced on February 11, 2016.[72]
The Snapdragon 626 was announced on October 18, 2016.[73]Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015.[37]They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.[74]
The Snapdragon 653 was announced on October 18, 2016.[40][41]
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017.[75]
The Snapdragon 636 was announced on October 17, 2017.[76]Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 632 was announced on June 26, 2018.[43]Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018.[77]Pin and software compatible with Snapdragon 710.
The Snapdragon 675 was announced on October 22, 2018.[78]
The Snapdragon 665 was announced on April 9, 2019.[79][80]
The Snapdragon 662 was announced on January 20, 2020, withNavICsupport.[44]
The Snapdragon 678 was announced on December 15, 2020.[81]
The Snapdragon 690 was announced on June 16, 2020, and is the first midrange SoC by Qualcomm to support 5G connectivity.[82]
The Snapdragon 680 and 695 were announced on October 26, 2021.[46]
The Snapdragon 685 was announced on March 23, 2023.

Model number Product Name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8064-1AA (DEB/FLO) Advertised as S4 Pro Snapdragon 600 28 nm (TSMC 28LP) 4 cores up to 1.5 GHzKrait300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno320 400 MHz (76.8 GFLOPS in FP32) HexagonQDSP6 V4 500 MHz Up to 21 MP single camera; Video Capture: 1080p@30fps DDR3L-1600 (12.8 GB/sec) External Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A 1.0 Q1 2013
APQ8064M[83] 4 cores up to 1.7 GHzKrait300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 LPDDR3Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s)
APQ8064T[83] LPDDR3Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s)
APQ8064AB[83] 4 cores up to 1.9 GHzKrait300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno320 450 MHz (86.4 GFLOPS in FP32)
MSM8936[84] Snapdragon 610 4 cores 1.7 GHzCortex-A53 Adreno405 550 MHz (52.8 GFLOPS in FP32) HexagonV50 700 MHz LPDDR3Single-channel 32-bit 800 MHz (6.4 GB/s) X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou 2.0 Q3 2014
MSM8939[85] Snapdragon 615 4 + 4 cores (1.7 GHz + 1.1 GHzCortex-A53)
MSM8939 v2[86] Snapdragon 616 4 + 4 cores (1.7 GHz + 1.2 GHzCortex-A53) Q3 2015
MSM8952[87] Snapdragon 617 4 + 4 cores (1.5 GHz + 1.2 GHzCortex-A53) Hexagon546 LPDDR3Single-channel 32-bit 933 MHz (7.5 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0 3.0 Q4 2015
MSM8953[88] Snapdragon 625 14 nm (Samsung 14LPP) 8 cores up to 2.0 GHzCortex-A53 Adreno506 650 MHz (62.4 GFLOPS in FP32) Up to 24 MP single camera; Video Capture: 4K@30fps X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0 Q2 2016
MSM8953 Pro[89] Snapdragon 626 8 cores up to 2.2 GHzCortex-A53 Q4 2016
SDM630[90] Snapdragon 630 4 + 4 cores (2.2 GHz + 1.8 GHzCortex-A53)[91][92] Adreno508 650 MHz (124.8 GFLOPS in FP32) Hexagon642 Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps) LPDDR4Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5,NFC,802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1 4.0 Q2 2017
SDM632[93] Snapdragon 632 4 + 4 cores (1.8 GHzKryo 250 Gold–Cortex-A73+ 1.8 GHzKryo 250 Silver–Cortex-A53)[94] Adreno506 725 MHz (69.6 GFLOPS in FP32) Hexagon546 Up to 40 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps LPDDR3Single-channel 32-bit 933 MHz (7.5 GB/s) X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 Q3 2018
SDM636[95] Snapdragon 636 4 + 4 cores (1.8 GHzKryo 260 Gold–Cortex-A73+ 1.6 GHzKryo 260 Silver–Cortex-A53) Adreno509 430 MHz (110.1 GFLOPS in FP32) Hexagon680 Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) LPDDR4Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 4.0 Q4 2017
MSM8956[96] Snapdragon 650 28 nm (TSMC 28HPM) 2 + 4 cores (1.8 GHzCortex-A72+ 1.4 GHzCortex-A53) Adreno510 600 MHz (153.6 GFLOPS in FP32) HexagonV56 Up to 21 MP single camera; Video Capture: 4K@30fps LPDDR3Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 3.0 Q1 2016
MSM8976[97] Snapdragon 652 4 + 4 cores (1.8 GHzCortex-A72+ 1.4 GHzCortex-A53)
MSM8976 Pro[98] Snapdragon 653 4 + 4 cores (1.95 GHzCortex-A72+
1.40 GHzCortex-A53) 		Adreno510 621 MHz (159 GFLOPS in FP32) X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Q4 2016
SDM660[99] Snapdragon 660 14 nm (Samsung 14LPP) 4 + 4 cores (2.2 GHzKryo 260 Gold–Cortex-A73+ 1.84 GHzKryo 260 Silver–Cortex-A53) Adreno512 647 MHz (165.6 GFLOPS in FP32) Hexagon680 Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5,NFC,802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 4.0 Q2 2017
SDA660[100] Internal: no
SM6115[101] Snapdragon 662 11 nm (Samsung 11LPP) 4 + 4 cores (2.0 GHzKryo 260 Gold–Cortex-A73+ 1.8 GHzKryo 260 Silver–Cortex-A53) Adreno610 950 MHz (243.2 GFLOPS in FP32) Hexagon683 Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps) LPDDR3up to 933 MHz /LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1,NFC,Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready,NavIC,USB C 3.0 Q1 2020
SM6125[102] Snapdragon 665 Hexagon686 (3.3 TOPS) Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5,NFC,802.11ac Wi-Fi, USB 3.1 Q2 2019
SDM670[103] Snapdragon 670 10 nm (Samsung 10LPP) 2 + 6 cores (2.0 GHzKryo 360 Gold–Cortex-A75+ 1.7 GHzKryo 360 Silver–Cortex-A55)[104] Adreno615 430 MHz (220.2 GFLOPS in FP32) Hexagon685 (3 TOPS) Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) LPDDR4XDual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) Bluetooth 5,NFC,802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 4+ Q3 2018
SM6150[105] Snapdragon 675 11 nm (Samsung 11LPP) 2 + 6 cores (2.0 GHzKryo 460 Gold–Cortex-A76+ 1.7 GHzKryo 460 Silver–Cortex-A55)[106] Adreno612 845 MHz (216.3 GFLOPS in FP32) Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) Q1 2019
SM6150-AC[107] Snapdragon 678 2 + 6 cores (2.2 GHzKryo 460 Gold–Cortex-A76+ 1.7 GHzKryo 460 Silver–Cortex-A55) Adreno612 895 MHz (229.1 GFLOPS in FP32) Q4 2020
SM6225[108] Snapdragon 680 6 nm (TSMC N6) 4 + 4 cores (2.4 GHzKryo 265 Gold–Cortex-A73+ 1.9 GHzKryo 265 Silver–Cortex-A53) Adreno610 1114 MHz (285.2 GFLOPS in FP32) Hexagon686 (3.3 TOPS) Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1,NFC,Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2,NavIC,USB C 3.0 Q4 2021
SM6225-AD[109] Snapdragon 685 4 + 4 cores (2.8 GHzKryo 265 Gold–Cortex-A73+ 1.9 GHzKryo 265 Silver–Cortex-A53) Adreno610 1260 MHz (322.6 GFLOPS in FP32) Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 1x1, USB 3.1 Q1 2023
SM6350[110] Snapdragon 690 8 nm (Samsung 8LPP) 2 + 6 cores (2.0 GHzKryo 560 Gold–Cortex-A77+ 1.7 GHzKryo 560 Silver–Cortex-A55) Adreno619L 565 MHz (289.3 GFLOPS in FP32) Hexagon692 (5 TOPS) Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4XDual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) InternalX51 5G(5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1,NFC,802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB 3.1 4+ H2 2020
SM6375[111] Snapdragon 695 6 nm (TSMC N6) 2 + 6 cores (2.2 GHzKryo 660 Gold–Cortex-A78+ 1.8 GHzKryo 660 Silver–Cortex-A55) Adreno619 840 MHz (430.1 GFLOPS in FP32) Hexagon686 (3.3 TOPS) Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) InternalX51 5G(5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2,NFC,802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C Q4 2021

Snapdragon 6 (2022–2024)

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The Snapdragon 6 Gen 1 was announced on September 6, 2022.[61]
The Snapdragon 6s Gen 3 was announced on June 6, 2024.
The Snapdragon 6s Gen 1 was launched on Oppo A3x on August 9, 2024.[112]
The Snapdragon 6 Gen 3 was announced on August 31, 2024.

Model number Product Name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM6450[113] Snapdragon 6 Gen 1 4 nm (Samsung 4LPX) 4 + 4 cores (2.2 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55) Adreno710 676 MHz (346.1 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s) Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 4+ Q1 2023
SM6115-AC[114] Snapdragon 6s Gen 1 11 nm (Samsung 11LPP) 4 + 4 cores (2.1 GHzKryo Gold–Cortex-A73+ 2.0 GHzKryo Silver–Cortex-A53) Adreno610 1050 MHz (268.8 GFLOPS in FP32) Hexagon Spectra (48 MP single camera / 13 MP dual camera with ZSL; Video Capture: 1080p@60fps) LPDDR3up to 933 MHz /LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, USB C 3.0 Q3 2024
SM6475-AB[115] Snapdragon 6 Gen 3 4 nm (Samsung 4LPX) 4 + 4 cores (2.4 GHzKryo Gold–Cortex-A78+ 1.8 GHzKryo Silver–Cortex-A55) Adreno710 Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) 		Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 4+ Q3 2024
SM6375-AC[116] Snapdragon 6s Gen 3 6 nm (TSMC N6) 2 + 6 cores (2.3 GHzKryo Gold–Cortex-A78+ 2.0 GHzKryo Silver–Cortex-A55) Adreno619 900 MHz (460.8 GFLOPS in FP32) Hexagon Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) InternalX51 5G(5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C Q2 2024

Snapdragon 7 Series

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Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 7 series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.[117]

Snapdragon 700 series (2018–2022)

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The Snapdragon 710 was announced on May 23, 2018.[118]It is pin and software compatible with the Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.[119]
The Snapdragon 730 and 730G were announced on April 9, 2019.[79][120]
The Snapdragon 720G was announced on January 20, 2020.[44]
The Snapdragon 732G was announced on August 31, 2020.[121]
The Snapdragon 765 and 765G were announced on December 4, 2019[122]as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via thePlay Store.[123]
The Snapdragon 768G was announced on May 10, 2020.[124]
The Snapdragon 750G was announced on September 22, 2020.[125]
The Snapdragon 780G was announced on March 25, 2021.[126]
The Snapdragon 778G was announced on May 19, 2021.[127]
The Snapdragon 778G+ was announced on October 26, 2021.[46]
The Snapdragon 782G was announced on November 23, 2022.[128]

Model number Product Name Fab CPU(ARMv8.2) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM710[129] Snapdragon 710 10 nm (Samsung 10LPP) 2 + 6 cores (2.2 GHzKryo 360 Gold–Cortex-A75+ 1.7 GHzKryo 360 Silver–Cortex-A55) Adreno616 504 MHz (258 GFLOPS in FP32) Hexagon685 (3 TOPS) Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) LPDDR4XDual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0;NFC;802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 4 Q2 2018
SDM712[130] Snapdragon 712 2 + 6 cores (2.3 GHzKryo 360 Gold–Cortex-A75+ 1.7 GHzKryo 360 Silver–Cortex-A55) Adreno616 610 MHz (312.3 GFLOPS in FP32) 4+ Q1 2019
SM7125[131] Snapdragon 720G 8 nm (Samsung 8LPP) 2 + 6 cores (2.3 GHzKryo 465 Gold–Cortex-A76+ 1.8 GHzKryo 465 Silver–Cortex-A55) Adreno618 750 MHz (384 GFLOPS in FP32) Hexagon692 (5 TOPS) Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) FastConnect 6200; Bluetooth 5.1;NFC;802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS,NavIC;USB 3.1 Q1 2020
SM7150-AA,[132] Snapdragon 730 2 + 6 cores (2.2 GHzKryo 470 Gold–Cortex-A76+ 1.8 GHzKryo 470 Silver–Cortex-A55) Adreno618 610 MHz (312.3 GFLOPS in FP32) Hexagon688 (3.6 TOPs) Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) FastConnect 6200; Bluetooth 5.0;NFC;802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 Q2 2019
SM7150-AB[133] Snapdragon 730G Adreno618 700 MHz (358.4 GFLOPS in FP32)
SM7150-AC[134] Snapdragon 732G 2 + 6 cores (2.3 GHzKryo 470 Gold–Cortex-A76+ 1.8 GHzKryo 470 Silver–Cortex-A55) Adreno618 800 MHz (409.6 GFLOPS in FP32) FastConnect 6200; Bluetooth 5.1;NFC;802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 Q3 2020
SM7225[135] Snapdragon 750G 2 + 6 cores (2.2 GHzKryo 570 Gold–Cortex-A77+ 1.8 GHzKryo 570 Silver–Cortex-A55) Adreno619 800 MHz (409.6 GFLOPS in FP32) Hexagon694 (4.7 TOPs) Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4XDual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) InternalX52 5G(5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6200; Bluetooth 5.1;NFC;802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO);GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1 Q4 2020
SM7250-AA,[136] Snapdragon 765 7 nm (Samsung 7LPP) 1x 2.3 GHz {765}Kryo 475 Prime(Cortex-A76) +
1x 2.2 GHzKryo 475 Gold(Cortex-A76) +
6x 1.8 GHzKryo 475 Silver(Cortex-A55) 		Adreno620 540 MHz (414.7 GFLOPS in FP32) Hexagon696 (5.4 TOPs) Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) FastConnect 6200;Bluetooth5.0;NFC;802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1 Q1 2020
SM7250-AB[137] Snapdragon 765G 1x 2.4 GHzKryo 475 Prime(Cortex-A76) +
1x 2.2 GHzKryo 475 Gold(Cortex-A76) +
6x 1.8 GHzKryo 475 Silver(Cortex-A55) 		Adreno620 625 MHz (480 GFLOPS in FP32)
SM7250-AC[138] Snapdragon 768G 1x 2.8 GHzKryo 475 Prime(Cortex-A76) +
1x 2.4 GHzKryo 475 Gold(Cortex-A76) +
6x 1.8 GHzKryo 475 Silver(Cortex-A55) 		Adreno620 750 MHz (576 GFLOPS in FP32) FastConnect 6200;Bluetooth5.2;NFC;802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1 Q2 2020
SM7325[139] Snapdragon 778G 6 nm (TSMC N6) 1x 2.4 GHzKryo 670 Prime(Cortex-A78) +
3x 2.4 GHzKryo 670 Gold(Cortex-A78) +
4x 1.8 GHzKryo 670 Silver(Cortex-A55) 		Adreno642L 550 MHz (563.2 GFLOPS in FP32) Hexagon770 (12 TOPs) Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) Internal:X53 5G(5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 Q2 2021
SM7325-AE[140] Snapdragon 778G+ 1x 2.5 GHzKryo 670 Prime(Cortex-A78) +
3x 2.4 GHzKryo 670 Gold(Cortex-A78) +
4x 1.8 GHzKryo 670 Silver(Cortex-A55) 		Adreno642L 608 MHz (622.6 GFLOPS in FP32) Q4 2021
SM7350-AB[141] Snapdragon 780G 5 nm (Samsung 5LPE) 1x 2.4 GHzKryo 670 Prime(Cortex-A78) +
3x 2.2 GHzKryo 670 Gold(Cortex-A78) +
4x 1.9 GHzKryo 670 Silver(Cortex-A55) 		Adreno642 490 MHz (752.6 GFLOPS in FP32) Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) Internal:X53 5G(5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6900;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 Q1 2021
SM7325-AF[142] Snapdragon 782G 6 nm (TSMC N6) 1x 2.7 GHzKryo 670 Prime(Cortex-A78) +
3x 2.4 GHzKryo 670 Gold(Cortex-A78) +
4x 1.8 GHzKryo 670 Silver(Cortex-A55) 		Adreno642L 719 MHz (736.3 GFLOPS in FP32) Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) Internal:X53 5G(5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 Q4 2022

Snapdragon 7 (2022–2024)

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The Snapdragon 7 Gen 1 was announced on May 20, 2022.[143]
The Snapdragon 7+ Gen 2 was announced on March 17, 2023.[144]
The Snapdragon 7s Gen 2 was announced on September 15, 2023.
The Snapdragon 7 Gen 3 was announced on November 17, 2023.[145]
The Snapdragon 7+ Gen 3 was announced on March 21, 2024.[146]
The Snapdragon 7s Gen 3 was announced on August 20, 2024.[147]

Model number Product Name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7450-AB[148] Snapdragon 7 Gen 1 4 nm (Samsung 4LPX) 1x 2.4 GHz {2.5 GHz Accelerated Edition} Kryo Prime (Cortex-A710) +
3x 2.36 GHz Kryo Gold (Cortex-A710) +
4x 1.8 GHz Kryo Silver (Cortex-A510) 		Adreno644 443 MHz (680.4 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 4+ Q2 2022
SM7475-AB[149] Snapdragon 7+ Gen 2 4 nm (TSMC N4) 1x 2.91 GHz Kryo Prime (Cortex-X2) +
3x 2.49 GHz Kryo Gold (Cortex-A710) +
4x 1.8 GHz Kryo Silver (Cortex-A510) 		Adreno725 580 MHz (1187.8 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) FastConnect 6900;Bluetooth5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 5 Q1 2023
SM7435-AB[150] Snapdragon 7s Gen 2 4 nm (Samsung 4LPX) 4 + 4 cores (2.4 GHzKryo Gold–Cortex-A78+ 1.95 GHzKryo Silver–Cortex-A55) Adreno710 940 MHz (481.3 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) 		Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 4+ Q3 2023
SM7550-AB[151] Snapdragon 7 Gen 3 4 nm (TSMC N4P) 1x 2.63 GHz Kryo Prime (Cortex-A715) +
3x 2.4 GHz Kryo Gold (Cortex-A715) +
4x 1.8 GHz Kryo Silver (Cortex-A510) 		Adreno720 975 MHz (998.4 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) Internal:X63 5G(5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s) FastConnect 6700;Bluetooth5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 5 Q4 2023
SM7675-AB[152] Snapdragon 7+ Gen 3 1× 2.8 GHz Kryo Prime (Cortex-X4) +
4× 2.6 GHz Kryo Gold (Cortex-A720) +
3× 1.9 GHz Kryo Silver (Cortex-A520) 		Adreno732 950 MHz (1459.2 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) LPDDR5Xquad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) FastConnect 7800;Bluetooth5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 Q1 2024
SM7635[153] Snapdragon 7s Gen 3 1× 2.5 GHz Kryo Prime (Cortex-A720) +
3× 2.4 GHz Kryo Gold (Cortex-A720) +
4× 1.8 GHz Kryo Silver (Cortex-A520) 		Adreno810 Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4Xdual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) 		Internal:X62 5G(5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;Bluetooth5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 4+ Q3 2024

Snapdragon 8 Series

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Further information:Devices using Qualcomm Snapdragon processors § Snapdragon 8 series

The Snapdragon 8 Series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800 series (2013–2021)

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Features of the Snapdragon 800 series
TheSnapdragon 800was announced on January 8, 2013.[68]

TheSnapdragon 801was announced on February 24, 2014.[156][157]

  • CPUfeatures
    • 4 cores up to 2.45 GHzKrait400
  • DSPfeatures
    • H.265HD/30fps software decoding
  • ISPfeatures
    • Throughput: 1.0 GP/sec (From 0.64 GP/sec on S800)[158]
    • Up to 465 MHz (From 320 MHz on S800)[158]
  • eMMC5.0 support (Up to 400 MB/s)[154]
  • DSDA[154]

TheSnapdragon 805was announced on November 20, 2013.[159]

  • CPUfeatures
    • 4 cores up to 2.7 GHzKrait450
    • Up to 128-bit wide LPDDR3 memory interface
  • GPUfeatures
  • DSPfeatures
    • ImproveH.265support: UHD/30fps hardware decoding[162]
    • 1080p 120fps encoding and decoding
  • ISPfeatures
    • Up to 55 megapixel
    • Throughput: 1.0 GP/sec (From 0.64 GP/sec on SD800)[163]
  • Modemandwirelessfeatures
    • External modem

The Snapdragon 808 and 810 were announced on April 7, 2014.[164]
Snapdragon 808notable features over its predecessor (805):[165]

Snapdragon 810notable features over its lower end version (808):[169]

TheSnapdragon 820was announced at theMobile World Congressin March 2015,[171]with the first phones featuring the SoC released in early 2016.[172][173]
Notable features over its predecessors (808 and 810):[171]

  • CPUfeatures
    • CustomKryoquad-coreCPU
    • Per Core: L1: 32+32 KB, L2: 2 MB + 1 MB[172]
    • L3 cache shared between CPU cluster[174]
  • GPUfeatures
  • DSPfeatures
  • ISPfeatures
    • Qualcomm Spectra ISP with Dual 14-bit ISPs
    • 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL
    • Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS
    • Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS
    • Throughput: 1.2GP/sec (Same as 810)
  • Modemandwirelessfeatures
    • Snapdragon X12LTEmodem
      • Download: Cat 12 (up to 600 Mbit/s), 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C
      • Upload: Cat 13 (up to 150 Mbit/s), 2x20 MHz CA; 64-QAM
      • Support MIMO 4×4
    • 802.11a/b/g/n/acWi-Ficonnectivity
    • Wi-Fi adsupport with external chip
  • SOCfeatures

TheSnapdragon 821was announced in July 2016.[178]The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820.[178]
Notable features over its predecessor (820):

  • CPUfeatures
    • Faster CPU (+10%)
  • GPUfeatures
    • Faster GPU 650 MHz from 624 (+5%)
    • Snapdragon VR-SDK.[179]
  • ISPfeatures
    • Support Dual PD (PDAF).[179]
    • Extended laser Auto-focus.[179]

TheSnapdragon 835was announced on November 17, 2016.[180]
Notable features over its predecessor (821):

TheSnapdragon 845was announced on December 7, 2017.[185][186]
Notable features over its predecessor (835):[187][188][189]

TheSnapdragon 855was announced on December 5, 2018.[195][196]The Snapdragon 855 is Qualcomm's first 7 nmFinFETchipset.
Notable features over its predecessor (845):

  • 7 nm(TSMCN7) process
  • Die size: 73 mm² (8.48 mm × 8.64 mm)[197][198]
  • 6.7 billion transistors[198]
  • Support up to 16 GBLPDDR4X2133 MHz support
  • 4x 16-bit memory bus, (34.13 GB/s) up to 16 GB[199]
  • NVM Express2x 3.0 (1x for external 5G modem)
  • CPUfeatures[200]
  • 3 MB system-level cache
  • GPU features
    • Adreno640 GPU with support forVulkan 1.1
    • Up to 768 ALU (From 512 onAdreno630)
    • Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs (up from 512 ALUs, 24 TMUs and 16 ROPs)[181]
    • 954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth[201]
    • HDRgaming (10-bit color depth, Rec. 2020)
    • 120 fps gaming
    • Improvement on hardware-acceleratedH.265andVP9decoder
    • HDR playback codec support forHDR10+,HDR10,HLGandDolby Vision
    • Volumetric VR video playback
    • 8K 360 VR video playback
    • Quarterly GPU driver updates viaGoogle Play Store
    • Android GPU Inspector Tool[202]
  • DSPfeatures[203]
    • Hexagon690 4th generation "AI engine" with greater than 7 trillion operations per second (TOPS)
    • Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions
    • Qualcomm Hexagon Tensor Accelerator (HTA)
    • Qualcomm Hexagon Voice Assistant
    • All-Ways Aware Hub
    • Caffe,Caffe2,HalideandTensorFlowsupport
    • Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance
  • ISP features:
    • Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
    • Multi-frame noise reduction[204]
    • Hybrid AF
    • 192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL
    • HEIFphoto capture support
    • Tri-core hardware CV functions including object detection & tracking, and stereo depth processing
    • Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array (QCFA) HDR
    • 4K 60 FPS HDR video with real-time object segmentation (portrait mode, background swap) features HDR10, HDR10+ and HLG with Portrait Mode (bokeh), 10-bit color depth and Rec. 2020 color gamut
    • Up to 1.32 Gpixel/s[205]
    • Video Capture Formats: HDR10,HLG
    • Video Codec Support: H.265 (HEVC), H.264 (AVC), HLG,HDR10,HDR10+,VP8,VP9
  • Modem and wireless features:[206]
    • InternalX24 LTE Modem
    • Download: 2000 Mbit/s DL (Cat. 20), 7x20 MHz CA, 256-QAM, 4x4 MIMO
    • Upload: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM
    • ExternalSnapdragon X50 (5G Modem):5000 Mbit/s DL
    • QualcommWi-Fi 6-readymobile platform:
      • Wi-Fi Standards:802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz
      • MIMOConfiguration: 2x2 (2-stream) • MU-MIMO• Dual-band simultaneous (DBS)
      • Key Features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
    • Qualcomm 60 GHz Wi-Fi mobile platform
      • Wi-Fi Standards:802.11ad, 802.11ay
      • Wi-Fi Spectral Band: 60 GHz
      • Peak speed: 10 Gbit/s

TheSnapdragon 855+was announced on July 15, 2019.[207]It is an overclocked version of the Snapdragon 855 providing 10% higher CPU and GPU performance.

TheSnapdragon 860was announced on March 22, 2021. It is a pure rebranding of the Snapdragon 855+.

TheSnapdragon 865was announced on December 4, 2019.[208]
Notable features over its predecessor (855):[209]

  • 2nd generation 7 nm(N7P TSMC)process[210]
  • 10.3 billion transistors[211]
  • 83.54 mm2 (8.49 mm x 9.84 mm)[212]
  • Support up to 16 GBLPDDR52750 MHz orLPDDR4X2133 MHz support
  • 4x 16-bit memory bus, (or 34.13 GB/s) up to 16 GB[213]
  • NVM Express2x 3.0 (1x for external5Gmodem)
  • SupportQuick charge 4+
  • CPUfeatures
  • 3 MB system-level cache
  • GPU features[213]
    • Adreno650 GPU with support forVulkan 1.1
    • 25% faster graphics rendering and 35% more power efficient
    • Quarterly GPU driver updates viaGoogle Play Store
    • Android GPU Inspector Tool[202]
    • Desktop Forward Rendering
    • Up to 1029.1 GFLOPs FP32 (From 898.5 GFLOPs on SD855)
  • DSPfeatures
    • Hexagon698 5th generation "AI engine" capable of 15 trillion operations per second (TOPS)
    • Quad-core Qualcomm Hexagon Tensor Accelerator (HTA)
    • Deep learningbandwidth compression
  • ISP features:
    • Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
    • Multi-frame noise reduction[204]
    • Hybrid AF
    • 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL
    • 8K30 FPS and 4K 120 FPS HDR video
    • Up to 2 Gpixel/s
    • Video capture formats:Dolby Vision,HDR10,HDR10+,HEVC
    • Video codec support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10,H.264 (AVC),VP8,VP9
    • New functionalities to improve noise reduction and local contrast enhancements
  • Modem and wireless features:
    • ExternalX55 5G Modem
    • Modes: NSA, SA, TDD, FDD
    • 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
    • 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
    • 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL
    • 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
    • LTEdownload: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
    • LTEupload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
    • Dynamic Spectrum Sharing (DSS)
    • QualcommWi-Fi 6-readymobile platform:
      • QualcommFastConnect 6800 (for 865 and 870), 6900 (for 865+)
      • Wi-Fi standards:802.11ax-ready (Wi-Fi 6Efor 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi spectral bands: 2.4 GHz, 5 GHz (for 865 and 870), 2.4 GHz, 5 GHz, 6 GHz (for 865+) • channel utilization: 20/40/80 MHz (for 865 & 870), 20/40/80/160 MHz (for 865+)
      • MIMOconfiguration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS)
      • Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security withWPA3
    • Qualcomm 60 GHz Wi-Fi mobile platform
      • Wi-Fi Standards:802.11ad, 802.11ay
      • Wi-Fi spectral band: 60 GHz
      • Peak speed: 10 Gbit/s
  • Other features:
    • Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support

TheSnapdragon 865+was announced on July 8, 2020.[214]

TheSnapdragon 870was announced on January 19, 2021.[215]The only difference between it and the Snapdragon 865+ is a minor 0.1 GHz increase in clock frequency on the prime core.

TheSnapdragon 888was announced on December 1, 2020.[216][217][218][219][220]
Notable features over its predecessor (865):

  • 5 nm(Samsung5LPE) process
  • ~10 billion transistors
  • Support up to 16 GBLPDDR53200 MHz (51.2 GB/s)[221]
  • 4x 16-bit memory bus
  • Quick Charge 5(100 W+)
  • SupportUFS 3.1
  • CPUfeatures
  • 3 MB system-level cache
  • GPU features
    • Adreno660 GPU with API Support:OpenGL ES3.2, OpenCL 2.0 FP,Vulkan 1.1
    • Up to 840 MHz (From 670 MHz on 865+ and 870)
    • 35% faster graphics rendering and 20% more power efficient
    • 73% AI performance boost (From 15 TOPS to 26 TOPS)
    • Variable rate shading(VRS)[222]
    • Demura and subpixel rendering for OLED uniformity
    • Up to 1720.3 GFLOPs FP32 (From 1202.1 GFLOPs on SD865)
    • HDRvideo playback formats:HDR10,HDR10+,Dolby Vision,HLG
    • HDRgaming (including 10-bit color depth,Rec. 2020color gamut)
    • On-device display: 4K@60 Hz, QHD+@144 Hz
    • External display: 4K@60 Hz, 10-bit,Rec. 2020,HDR10,HDR10+
  • DSPfeatures
    • Hexagon780 with Fused AI Accelerator architecture 6th generation "AI engine" capable of 26 trillion operations per second (TOPS), From 15 TOPS on 865.
      • Hexagon Tensor Accelerator
      • Hexagon Vector eXtensions
      • Hexagon Scalar Accelerator
    • Qualcomm Sensing Hub (2nd generation)
      • New dedicated AI processor
      • 80% task reduction offload from Hexagon DSP
      • 5X more processing power
    • 16X larger shared memory
    • 1000X hand off time improvement in certain use cases[223]
    • 50% faster scalar accelerator, 2x faster tensor accelerator
    • Video codec playback support:H.264 (AVC),H.265 (HEVC),VP8,VP9
  • ISP features:
    • Qualcomm Spectra 580 with triple 14-bit CV-ISPs and hardware accelerator for computer vision
    • Single camera: 1x 200 MP or 84 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
    • Dual camera: 64+25 MP at 30 fps with MFNR/ZSL
    • Triple camera: 3x 28 MP at 30 fps with MFNR/ZSL
    • 8K30 FPS and 4K 120 FPSHDR video+ 64 MP Photo
    • Slow-mo video capture at 720p @ 960 FPS, 1080p @ 480 FPS
    • HDRvideo capture formats:HEVCwithHDR10,HDR10+,Dolby Vision,HLG
    • HDRphoto capture: 10-bitHDRHEIF
    • Computational HDRphoto and video capture, support for Multi-Frame and Staggered HDR sensors
    • Real-time object classification, segmentation, and replacement
    • AI-based auto-focus, auto-exposure and auto-white-balance
    • Advanced HW-based face detection with deep learning filter
    • New low-light architecture (capture photos in 0.1 lux)
    • 2.7 Gigapixel per second ISP (+35% speed increase over S865)
    • 120 photos at 12MP/s
  • Modem and wireless features:
    • InternalX60 5G Modem
    • Modes: NSA, SA, TDD, FDD
    • 5GmmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
    • 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
    • 5G NR Sub-6 + mmWave download: 7500 Mbit/s DL
    • 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
    • LTEdownload: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
    • LTEupload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
    • Dynamic Spectrum Sharing(DSS)
    • Bluetooth5.2
      • Dual antennas[224]
      • Premium audio
    • QualcommWi-Fi 6-readymobile platform:
      • QualcommFastConnect 6900
      • Wi-Fi standards:802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
      • MIMOconfiguration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
      • Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security withWPA3
  • Other features:

TheSnapdragon 888+was announced on June 28, 2021.[226]

Model number Product Name Fab Die size CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8074AA[227] Snapdragon 800 28 nm (TSMC 28HPM) 4 cores up to 2.26 GHzKrait400 Adreno330 450 MHz (115.2 GFLOPS in FP32) HexagonQDSP6 V5 600 MHz Up to 21 MP single camera LPDDR3Dual-channel 32-bit 800 MHz (12.8 GB/s) — Bluetooth 4.0;802.11n/ac(2.4/5 GHz); IZat Gen8B 2.0 Q2 2013[68]
MSM8274AA[227] Gobi 3G (UMTS)
MSM8674AA[227] Gobi 3G (CDMA/UMTS)
MSM8974AA[227] Gobi 4G (LTECat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8974AA v3[157] Snapdragon 801 Gobi 4G (LTECat 4) Q3 2014
APQ8074AB v3[157] 4 cores up to 2.36 GHzKrait400 Adreno330 578 MHz[228](150 GFLOPS in FP32) LPDDR3Dual-channel 32-bit 933 MHz (14.9 GB/s) — Q4 2013
MSM8274AB[227] Snapdragon 800 Gobi 3G (UMTS) Q4 2013[229]
MSM8674AB v3[157] Snapdragon 801 Gobi 3G (CDMA/UMTS) Q2 2013[68]
MSM8974AB v3[157] Gobi 4G (LTECat 4) Q4 2013
MSM8274AC v3[157] 4 cores up to 2.45 GHz[230]Krait400[231] Gobi 3G (UMTS) Q2 2014[68]
MSM8974AC v3[157] Gobi 4G (LTECat 4) Q1 2014[68]
APQ8084[232] Snapdragon 805 4 cores up to 2.7 GHzKrait450 Adreno420 600 MHz (153.6 GFLOPS in FP32) HexagonV50 800 MHz Up to 55 MP single camera LPDDR3Dual-channel 64-bit 800 MHz (25.6 GB/s) External Bluetooth 4.1;802.11n/ac(2.4/5 GHz); IZat Gen8B Q1 2014
MSM8992[165][233] Snapdragon 808 20 nm (TSMC) 2 + 4 cores (1.82 GHzCortex-A57+ 1.44 GHzCortex-A53)[234] Adreno418 600 MHz[235](153.6 GFLOPS in FP32) HexagonV56 800 MHz Up to 21 MP single camera LPDDR3Dual-channel 32-bit 933 MHz (14.9 GB/s) X10LTE(Cat 9:download up to 450 Mbit/s, upload up to 50 Mbit/s)[236] Bluetooth 4.1; 802.11ac; IZat Gen8C Q3 2014[237]
MSM8994[169][233] Snapdragon 810 4 + 4 cores (2.0 GHzCortex-A57+ 1.5 GHzCortex-A53)[238] Adreno430 600 MHz (230.4 GFLOPS in FP32) Up to 55 MP single camera LPDDR4Dual-channel 32-bit 1600 MHz (25.6 GB/s)
MSM8994v2[239] Adreno430 630 MHz[239](241.9 GFLOPS in FP32) 2015[239]
MSM8994v2.1[240] Q2 2015
MSM8996
Lite[241] 		Snapdragon 820 14 nm FinFET (Samsung 14LPP) 113.7 mm2[242] 2 + 2 coresKryo(1.804 GHz + 1.363 GHz) Adreno530 510 MHz (261.1 GFLOPS in FP32) Hexagon680 1 GHz Spectra LPDDR4Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s) X12 LTE (download: Cat 12,

up to 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM.)

Bluetooth 4.1;802.11ac/ad; IZat Gen8C 3.0 Q1 2016
MSM8996[241] 2 + 2 coresKryo(2.15 GHz + 1.593 GHz) Adreno530 624 MHz (319.5 GFLOPS in FP32) LPDDR4Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) Q4 2015
MSM8996
Pro-AB[243][244] 		Snapdragon 821 Q3 2016
MSM8996
Pro-AC[243][244][245] 		2 + 2 coresKryo(2.342 GHz + 1.6/2.188 GHz) Adreno530 653 MHz (334.3 GFLOPS in FP32)
MSM8998[246] Snapdragon 835 10 nm FinFET (Samsung 10LPE) 72.3 mm2 4 + 4 coresKryo 280(2.45 GHzCortex-A73+ 1.9 GHzCortex-A53) Adreno540 670/710 MHz (343/363.5 GFLOPS in FP32) Hexagon682 Spectra 180 LPDDR4XDual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4.0 Q2 2017[247]
SDM845[187] Snapdragon 845 10 nm
FinFET (Samsung 10LPP) 		95.0 mm2 4 + 4 coresKryo 385(2.8 GHzCortex-A75+ 1.8 GHzCortex-A55) Adreno630 710 MHz (727 GFLOPS in FP32) Hexagon685
(3 TOPs) 		Spectra 280 X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ Q1 2018
SM8150[248] Snapdragon 855 7 nm (TSMCN7) 76.9 mm2 1 + 3 + 4 coresKryo 485(2.84 GHzCortex-A76+ 2.42 GHzCortex-A76+ 1.8 GHzCortex-A55) Adreno640 585 MHz (898.6 GFLOPS in FP32) Hexagon690
(7 TOPs) 		Spectra 380 LPDDR4XQuad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) Internal:X24 LTE(Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External:X50 5G[249](5G NR Sub-6 & mmWave: download up to 5 Gbit/s) Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready;GPS,GLONASS,Beidou,Galileo,QZSS,SBAS;USB 3.1 Q1 2019
SM8150-AC[250] Snapdragon 855+ 1 + 3 + 4 coresKryo 485(2.96 GHzCortex-A76+ 2.42 GHzCortex-A76+ 1.80 GHzCortex-A55) Adreno640 675 MHz (1036.8 GFLOPS in FP32) Q3 2019
Snapdragon 860 Q1 2021
SM8150P Snapdragon 855+ Internal: no + External:X55 5G(5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) Q3 2019
SM8250[251] Snapdragon 865 7 nm (TSMCN7P) 86.8 mm2 1 + 3 + 4 coresKryo 585(2.84 GHzCortex-A77+ 2.42 GHzCortex-A77+ 1.80 GHzCortex-A55) Adreno650 587 MHz (901.6 GFLOPS in FP32) Hexagon698
(15 TOPs) 		Spectra 480 LPDDR5Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or
LPDDR4XQuad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) 		Internal: no + External:X55 5G[252](5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) FastConnect 6800;Bluetooth5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1 Q1 2020
SM8250-AB[253] Snapdragon 865+ 1 + 3 + 4 coresKryo 585(3.1 GHzCortex-A77+ 2.42 GHzCortex-A77+ 1.80 GHzCortex-A55) Adreno650 670 MHz (1029.1 GFLOPS in FP32) FastConnect 6900;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1 Q3 2020
SM8250-AC[254] Snapdragon 870 1 + 3 + 4 coresKryo 585(3.2 GHzCortex-A77+ 2.42 GHzCortex-A77+ 1.80 GHzCortex-A55) FastConnect 6800;Bluetooth5.2;[255]802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS,SBAS;USB 3.1 Q1 2021
SM8350[256] Snapdragon 888 5 nm (Samsung 5LPE) 112.2 mm2 1 + 3 + 4 coresKryo 680(2.84 GHzCortex-X1+ 2.42 GHzCortex-A78+ 1.80 GHzCortex-A55) Adreno660 840 MHz (1290.2 GFLOPS in FP32) Hexagon780
(26 TOPs) 		Spectra 580 LPDDR5Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal:X60 5G(5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) FastConnect 6900;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 5 Q1 2021
SM8350-AC[257] Snapdragon 888+ 1 + 3 + 4 coresKryo 680(3.0 GHzCortex-X1+ 2.42 GHzCortex-A78+ 1.80 GHzCortex-A55) Hexagon780
(32 TOPs) 		Q3 2021

Snapdragon 8/8+ Gen 1 (2022)

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TheSnapdragon 8 Gen 1was announced on November 30, 2021.[258]

Notable features over its predecessor (888):

  • 4 nm(Samsung4LPX) process
  • ~ billion transistors
  • Support up to 16 GBLPDDR53200 MHz
  • Quick Charge 5(100 W+)
  • SupportUFS 3.1
  • CPUfeatures
  • GPU features
  • DSPfeatures
    • Hexagonwith Fused AI Accelerator, INT8 and INT16
      • Hexagon Tensor Accelerator
      • Hexagon Vector eXtensions
      • Hexagon Scalar Accelerator
    • Qualcomm Sensing Hub (3nd generation)
      • New dedicated AI pro
  • ISP features[260]
    • Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision
    • Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
    • Dual camera: 64+36 MP at 30 fps with MFNR/ZSL
    • Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL
    • 8K30 FPS and 4K 120 FPSHDR video+ 64 MP Photo
    • Slow-m 5G NR, LTE including CBRS
    • WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
    • 720p @ 960 FPS
    • HDRvideo capture formats:HEVCwithHDR10,HDR10+,Dolby Vision,HLG
    • HDRphoto capture: 10-bitHDRHEIF
    • Computational HDRphoto and video capture, support for Multi-Frame and Staggered HDR sensors
    • Real-time object classification, segmentation, and replacement
    • AI-based auto-focus, auto-exposure and auto-white-balance
  • Modem and wireless features:
    • InternalX65 5G Modem
    • Modes: NSA, SA, TDD, FDD
    • 5GmmWave
    • 5G sub-6 GHz
    • 5G NR Sub-6 + mmWave download: 10 Gbit/s
    • 5G NR Sub-6 + mmWave upload: 3 Gbit/s (assumed)[261]
    • LTEdownload: 2.5 Gbit/s
    • LTEupload: 0.316 Gbit/s
    • Dynamic Spectrum Sharing(DSS)
    • Bluetooth5.3
      • Qualcomm Aqstic audio codec (WCD9385)
      • Provide lossless wireless audio with Qualcomm aptX Technology.
    • QualcommWi-Fi 6-readymobile platform:
      • QualcommFastConnect 6900
      • Wi-Fi standards:802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
      • MIMOconfiguration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
      • Peak speed: 3.6 Gbit/s[260]

TheSnapdragon 8+ Gen 1was announced on May 20, 2022.[143]

Model number Product Name Fab Die size CPU(ARMv9) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Released
SM8450[262] Snapdragon 8 Gen 1 4 nm (Samsung 4LPX) 128.5 mm2[242] 1x 3.0 GHz Kryo Prime (Cortex-X2) +
3x 2.5 GHz Kryo Gold (Cortex-A710) +
4x 1.8 GHz Kryo Silver (Cortex-A510) 		Adreno730 818 MHz (1675.3 GFLOPs in FP32) Hexagon Spectra (200 MP Photo Capture / 108 MP single camera @30fps ZSL / 64+36 MP dual camera @30fps ZSL / 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) LPDDR5Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal:X65 5G(5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) FastConnect 6900;Bluetooth5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 5 Q4 2021[258]
SM8475[263] Snapdragon 8+ Gen 1 4 nm (TSMC N4) 102.6 mm2 Adreno730 900 MHz (1843.2 GFLOPS in FP32) Q2 2022[264]
SM8425-100-AC[265] Snapdragon 8+ Gen 1 4G mobile Plattform[266] n.a. mm2 1x 3.2 GHz Kryo Prime (Cortex-X2) +
3x 2.75 GHz Kryo Gold (Cortex-A710) +
4x 2.0 GHz Kryo Silver (Cortex-A510) 		Internal:X65 4G(LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)

Snapdragon 8 Gen 2 (2023)

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TheSnapdragon 8 Gen 2was announced on November 15, 2022.[267]

Notable features over its predecessor (8 Gen 1):

  • 4nm (TSMCN4) process
  • Support up to 16 GBLPDDR5X4200 MHz
  • SupportUFS 4.0
  • CPU features
  • GPU features
    • Adreno740 GPU with API support:OpenGL ES 3.2,OpenCL 2.0,Vulkan 1.3
    • 25% faster graphics rendering and 45% more power efficient
    • Up to 1536 ALU (From 1024 onAdreno730)
    • Real-time hardware-acceleratedray tracing
      • ray-box and ray-triangle intersections
      • Bounding Volume Hierarchical (BVH)
    • Doubled bandwidth between ISP,HexagonDSP, andAdrenoGPU
  • DSPfeatures
    • Hexagonwith Fused AI Accelerator
      • Hexagon Tensor Accelerator
      • Hexagon Vector eXtensions
      • Hexagon Scalar Accelerator
      • Mixed precision INT8/INT16
      • Add INT4 support[268]
      • INT4, INT8, INT16, FP16 support
      • Hexagon Direct Link (ISP andHexagon)
    • Qualcomm Sensing Hub (4th generation)
      • Add second AI processor
      • x2 performance from last year
      • Dedicated power delivery system[268]
      • 50% more memory
  • ISP features
    • Video capture up to 8K30 or 4K120 or 720p960 (HDR)
    • Video playback up to 8K60 or 4K120 (HDR)
    • H.264, H.265, VP9 and add AV1 decoding[268]
    • Photo is same as 8 Gen 1
  • Modem and wireless features:

There is an overclocked variant of the Snapdragon 8 Gen 2 with model number SM8550-AC. It was exclusive to theSamsung Galaxy S23 serieson launch. Nubia's Red Magic 8S Pro became the first non-Galaxy phone to feature this variant,[269]launching July 5th 2023.[270]

Model number Product Name Fab Die size CPU(ARMv9) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Released
SM8550-AB[271] Snapdragon 8 Gen 2 4 nm (TSMC N4) 118.4 mm2[242] 1× 3.2 GHz Kryo Prime (Cortex-X3) +
4× 2.8 GHz Kryo Gold (2×Cortex-A715,2×Cortex-A710) +
3× 2.0 GHz Kryo Silver (Cortex-A510) 		Adreno740 680 MHz (2089 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 108 MP single camera @30fps ZSL / 64+36 MP dual camera @30fps ZSL / 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) LPDDR5XQuad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) Internal:X70 5G(5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s) FastConnect 7800;Bluetooth5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1[272]
or
FastConnect 6900;Bluetooth5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1[273][274] 		5 Q4 2022[267]
SM8550-AC Snapdragon 8 Gen 2 forGalaxy[a] 1× 3.36 GHz Kryo Prime (Cortex-X3) +
4× 2.8 GHz Kryo Gold (2×Cortex-A715,2×Cortex-A710) +
3× 2.0 GHz Kryo Silver (Cortex-A510) 		Adreno740 719 MHz (2208.8 GFLOPS in FP32) Q1 2023
  1. ^Also known as "Leading Version".

Snapdragon 8/8s Gen 3 (2024)

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TheSnapdragon 8 Gen 3was announced on October 24, 2023.[275]

Notable features over its predecessor (8 Gen 2):

  • Support for memory up to 4800 MHz (up from 4200 MHz)
  • CPU features
  • GPU features
  • DSPfeatures
    • HexagonNPU 98% faster performance and 40% improved performance-per-watt for sustained AI inferencing.
  • ISP features
    • Photo expansion
    • Video Object Eraser
    • Night Vision video capture
    • Dolby HDR video capture
  • Modem and wireless features:

TheSnapdragon 8s Gen 3was announced on March 18, 2024.[276]

Model number Product Name Fab Die size CPU(ARMv9) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Released
SM8650-AB[277] Snapdragon 8 Gen 3 4 nm (TSMC N4P) 137.3 mm2[242] 1× 3.30 GHz Kryo Prime (Cortex-X4) +
3× 3.15 GHz Kryo Gold (Cortex-A720) +
2× 2.96 GHz Kryo Gold (Cortex-A720) +
2× 2.27 GHz Kryo Silver (Cortex-A520) 		Adreno750 903 MHz (2774 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 108 MP single camera @30fps ZSL / 64+36 MP dual camera @30fps ZSL / 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) LPDDR5Xquad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) Internal:X75 5G(5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s) FastConnect 7800;Bluetooth5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 5 Q4 2023[275]
SM8650-AC Snapdragon 8 Gen 3 forGalaxy[a] 1× 3.39 GHz Kryo Prime (Cortex-X4) +
3× 3.15 GHz Kryo Gold (Cortex-A720) +
2× 2.96 GHz Kryo Gold (Cortex-A720) +
2× 2.27 GHz Kryo Silver (Cortex-A520) 		Adreno750 1000 MHz (3072 GFLOPS in FP32) Q1 2024
SM8635[278] Snapdragon 8s Gen 3 1× 3.0 GHz Kryo Prime (Cortex-X4) +
4× 2.8 GHz Kryo Gold (Cortex-A720) +
3× 2.0 GHz Kryo Silver (Cortex-A520) 		Adreno735 1100 MHz (1689.6 GFLOPS in FP32) Spectra (200 MP Photo Capture / 108 MP single camera @30fps ZSL / 64+36 MP dual camera @30fps ZSL / 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR) LPDDR5Xquad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) Internal:X70 5G(5G NR Sub-6 & mmWave: download up to 6.5 Gbit/s, upload up to 3.5 Gbit/s) Q1 2024[276]
  1. ^Also known as "Leading Version".

Snapdragon 8 Elite (2024)

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TheSnapdragon 8 Elitewas announced on October 22, 2024.[279]

Notable features over its predecessor (8 Gen 3):

  • Support for memory up to 5333.5 MHz (up from 4800 MHz)
  • CPU features
    • 2OryonPrime cores up to 4.32 GHz
      • 12 MB L2 cache
    • 6OryonPerformance cores up to 3.53 GHz
      • 12 MB L2 cache
    • 45% performance uplift and 44% power efficiency improvement
    • 8 MB SLC, no L3 cache
  • GPU features
    • Adreno830 GPU with API support:OpenGL ES 3.2,OpenCL 3.0,Vulkan 1.3
    • Uses a sliced architecture, with 3 slices with 4 CUs per slice total 12 CU and 4 MB cache each in the Adreno 830.
    • 40% faster graphics rendering and 40% more power efficient
  • DSPfeatures
    • HexagonNPU 45% AI performance improvement and 45% better performance per watt
  • ISP features
    • Limitless Segmentation
    • Al Relighting
    • Al Pet Suite
    • Video Magic Eraser
  • Modem and wireless features:
Model number Product Name Fab Die size CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Released
SM8750-AB[280] Snapdragon 8 Elite 3 nm (TSMC N3E) 124.1 mm2[242] Oryon2 + 6 cores

(4.32 GHz Prime cores + 3.53 GHz Performance core)

Adreno830 1100 MHz (3379.2 GFLOPS in FP32) Hexagon Spectra (320 MP Photo Capture / 108 MP single camera @30fps ZSL / 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR) LPDDR5Xdual-channel 32-bit (64-bit) 5333.5 MHz (85.3 GB/s) Internal:X80 5G(5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s) FastConnect 7900;Bluetooth6.0; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s;GPS,GLONASS,NavIC,Beidou,Galileo,QZSS;USB 3.1 5 Q4 2024[279]

Mobile Compute Platforms

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Further information:Devices using Qualcomm Snapdragon processors § Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

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The first and second generation of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
TheSnapdragon 835 Mobile PC Platformfor Windows 10 PCs was announced on December 5, 2017.[185]
TheSnapdragon 850 Mobile Compute Platformfor Windows 10 PCs, was announced on June 4, 2018.[281]It is essentially an over-clocked version of the Snapdragon 845.

Model number Product Name Fab CPU(ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8998[282] Snapdragon 835 Mobile PC Platform 10 nm
(Samsung 10LPE) 		Kryo 2804 + 4 cores

(2.6 GHz + 1.9 GHz)

Adreno540 710 MHz (363.5 GFLOPS in FP32) Hexagon682 Spectra 180 (Up to 32 MP camera / 16 MP dual) LPDDR4XDual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4 Q2 2018
SDM850[283] Snapdragon 850 Mobile Compute Platform 10 nm
(Samsung 10LPP) 		Kryo 3854 + 4 cores

(2.96 GHz + 1.77 GHz)

Adreno630 710 MHz (727 GFLOPS in FP32) Hexagon685 (3 TOPS) Spectra 280

(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4XQuad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ Q3 2018

Snapdragon 7c/7c+ Compute Platforms

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TheSnapdragon 7c Compute Platformfor Windows 10 PCs was announced on December 5, 2019.[284]
TheSnapdragon 7c Gen 2 Compute Platformfor Windows 10 PCs was announced on May 24, 2021.[285]
TheSnapdragon 7c+ Gen 3 Compute Platformfor Windows 10 / 11 PCs was announced on December 1, 2021.[286]

Model number Product Name Fab CPU(ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SC7180[287] Snapdragon 7c 8 nm (Samsung 8LPP) Kryo 4682 + 6 cores

(up to 2.4 GHz)

Adreno618 825 MHz (422.4 GFLOPS in FP32) Hexagon692 (5 TOPS) Spectra 255 (Up to 32 MP camera / 16 MP dual) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad/ax (Wi-Fi 6);GPS,GLONASS,Beidou,Galileo,QZSS,SBAS,NavIC; USB 3.1; eMMC 5.1,UFS3.0 Q1 2020
SC7180P[288] Snapdragon 7c Gen 2 Kryo 4682 + 6 cores

(up to 2.55 GHz)

Q2 2021
SC7280[289] Snapdragon 7c+ Gen 3 6 nm (TSMC N6) Kryo4 Gold + 4 Silver cores

(Cortex-A78r1p1, up to 2.4 GHz) +Cortex-A55r2p0

Hexagon(6.5 TOPS) Spectra (64 MP single camera / 36+22 MP dual camera) LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)
LPDDR5Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) 		Internal:X53 5G/LTE(5G: download up to 3.7 Gbit/s, upload up to 2.9 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s) FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,BeiDou,Galileo,QZSS,SBAS,USB 3.1; eMMC 5.1,UFS2.1, NVMe SSD Q1 2022

Snapdragon 8c Compute Platforms

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TheSnapdragon 8c Compute Platformfor Windows 10 PCs was announced on December 5, 2019.[284]

Model number Product Name Fab CPU(ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SC8180[290] Snapdragon 8c 7 nm (TSMCN7) Kryo 4904 + 4 cores

(2.45 GHz + 1.80 GHz)

Adreno675 590 MHz Hexagon690 (9 TOPS) Spectra 390

(192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4XQuad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s) Internal:X24 LTE(Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)

+

External:X55 5G/LTE[252](5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)

Bluetooth 5; 802.11a/b/g/n/ac/ad;GPS,GLONASS,Beidou,Galileo,QZSS,SBAS;USB 3.1; UFS 3.0, NVMe SSD 4+ Q1 2020

Snapdragon 8cx Compute Platforms

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TheSnapdragon 8cx Compute Platformfor Windows 10 PCs was announced on December 6, 2018.[291][292][293]
Notable features over the Snapdragon 855:

  • 10 MB total cache (L3 + SLC)
  • 8x 16-bit memory bus, (68.3 GB/s)
  • NVM Express4x
  • 112.05 mm2 die size[294]

TheSnapdragon 8cx Gen 2 5G Compute Platformfor Windows 10 PCs was announced on September 3, 2020.[295]
TheSnapdragon 8cx Gen 3 Compute Platformfor Windows 10 / 11 PCs was announced on December 1, 2021.[286][296][297]

Notable features over the Snapdragon 888:

  • 8 MB L3 cache & 6 MB SLC (14 MB total cache)
  • 8x 16-bit memory bus, (68.3 GB/s)
  • NVM Express4x
  • Built-in Microsoft Pluton TPM[298]
Model number Product Name Fab CPU(ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SC8180X[299] Snapdragon 8cx 7 nm (TSMCN7) Kryo 4954 + 4 cores

(2.84 GHzCortex-A76+ 1.80 GHzCortex-A55)

Adreno680
585 MHz (1797.1 GFLOPS in FP32) 		Hexagon690 (9 TOPS) Spectra 390

(32 MP single camera /

16 MP at 30fps dual camera with MFNR/ZSL)[300]

LPDDR4XOcta-channel 16-bit (128-bit)

2133 MHz (68.3 GB/s)

No internal modem

Optional externalX24 LTE(Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) 		Bluetooth 5.0; 802.11a/b/g/n/ac/ad;GPS,GLONASS,Beidou,Galileo,QZSS,SBAS;USB 3.1; UFS 3.0, NVMe SSD 4+ Q3 2019
SC8180XP[301] Snapdragon 8cx Gen 2 5G Kryo 4954 + 4 cores

(3.15 GHzCortex-A76+ 1.8 GHzCortex-A55)

Adreno690
660 MHz
(2027.5 GFLOPS in FP32) 		No internal modem

Optional externalX24 LTE(Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)
or
X55 5G/LTE[252](5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) 		Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.4 Gbit/s, NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1;UFS3.0. NVMe SSD Q3 2020
SC8280[302] Snapdragon 8cx Gen 3 5 nm (Samsung 5LPE) Kryo4 + 4 cores

(3.0 GHzCortex-X1+ 2.40 GHzCortex-A78)[296]

Adreno695
900 MHz
(3686.4 GFLOPS in FP32) 		Hexagon(15 TOPS)[303] Spectra (24 MP at 30fps single camera with MFNR/ZSL) No internal modem

Optional externalX62 5G/LTE,X55 5G/LTE,X65 5G/LTE(5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) 		FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,BeiDou,Galileo,QZSS,SBAS,USB 3.1;UFS3.1, NVMe SSD Q1 2022

Microsoft SQ Compute Platforms

edit
Further information:Devices using Qualcomm Snapdragon processors § SQ

TheMicrosoft SQ1was announced on October 2, 2019.[304][305]Co-developed withMicrosoft,it was exclusively designed for Microsoft'sSurface Pro X.Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
TheMicrosoft SQ2was announced on October 1, 2020.[306]

Product Name Fab CPU(ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
Microsoft SQ1 7 nm

(TSMC N7)

Kryo 4954 + 4 cores

(3 GHzCortex-A76+ 1.80 GHzCortex-A55)

Adreno685 590MHz (1812.5 GFLOPs in FP32) Hexagon690 (9 TOPS) Spectra 390 (192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4XOcta-channel 16-bit (128-bit)

2133 MHz (68.2 GB/s)

No internal modem

Optional externalX24 LTE(Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) 		Bluetooth 5.0; 802.11a/b/g/n/ac/ad;GPS,GLONASS,Beidou,Galileo,QZSS,SBAS;USB 3.1;UFS3.0, NVMe SSD 4+ Q4 2019
Microsoft SQ2 Kryo 4954 + 4 cores

(3.15 GHzCortex-A76+ 2.42 GHzCortex-A55)

Adreno690 680MHz (2089 GFLOPs in FP32) Q4 2020
Microsoft SQ3[307][308] 5 nm (Samsung 5LPE) Kryo4 + 4 cores

(3.0 GHzCortex-X1+ 2.40 GHzCortex-A78)

Adreno695 900MHz (3686.4 GFLOPS in FP32) Hexagon(15 TOPS)[309] Spectra (24 MP at 30fps single camera with MFNR/ZSL) No internal modem

Optional externalX62 5G/LTE,X55 5G/LTE,X65 5G/LTE(5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) 		FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,BeiDou,Galileo,QZSS,SBAS,USB 3.1;UFS3.1, NVMe SSD Q3 2022

Snapdragon X series

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TheSnapdragon X Elitefor Windows 11 PCs was announced on October 24, 2023.[310]
TheSnapdragon X Plusfor Windows 11 PCs was announced on April 24, 2024.[311]

Model number Fab CPU GPU DSP/NPU ISP Memory technology Modem Connectivity Sampling availability
Snapdragon X Plus[312][313]
X1P-42-100 4 nm (TSMC N4) Oryon8 core (3.2 GHz, single-core boost up to 3.4 GHz) AdrenoX1-45 1107 MHz (1.7 TFLOPS) Hexagon(45 TOPS) Spectra (36 MP single camera) LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) No internal modem

Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) 		No internal connectivity

External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,BeiDou,Galileo,QZSS,SBAS,USB4;UFS4.0, NVMe SSD 		Mid-2024
X1P-46-100 Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz) Adreno X1-45 (2.1 TFLOPS)
X1P-64-100 Oryon 10 core (3.4 GHz) Adreno X1-85 1250 MHz (3.8 TFLOPS) Spectra (64 MP single camera / 36 MP dual camera)
X1P-66-100 Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz)
Snapdragon X Elite[314][313]
X1E-78-100 4 nm (TSMC N4) Oryon12 core (3.4 GHz) AdrenoX1-85 1250 MHz (3.8 TFLOPS) Hexagon(45 TOPS) Spectra (64 MP single camera / 36 MP dual camera) LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) No internal modem

Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) 		No internal connectivity

External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s;GPS,GLONASS,BeiDou,Galileo,QZSS,SBAS,USB4;UFS4.0, NVMe SSD 		Mid-2024
X1E-80-100 Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100 Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz) AdrenoX1-85 1500 MHz (4.6 TFLOPS)
X1E-00-1DE Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)

Hardware codec supported

edit

See:Qualcomm Hexagon

Wearable platforms

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The Snapdragon Wear 1100 processor was announced May 30, 2016[315]for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.

The Snapdragon Wear 1200 processor was announced June 27, 2017[316]for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.

The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches.[317]It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.

The Snapdragon Wear 2500 was announced on June 26, 2018.[318]It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.

The Snapdragon Wear 3100 was announced on September 10, 2018.[319]The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.

The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020.[320]The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022.[321]The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

Model number Product Name Fab CPU Co-processor GPU DSP Memory technology Modem Connectivity Sampling availability
? Wear 1100[322] 28 nm 1 core up to 1.2 GHzCortex-A7(ARMv7) — Fixed FunctionGPU LPDDR2 Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2016[323]
Wear 1200[324] 1 core up to 1.3 GHzCortex-A7(ARMv7) Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2017[325]
MSM8909w[326] Wear 2100[327] 4 cores up to 1.2 GHzCortex-A7(ARMv7) Adreno304 Hexagon LPDDR3400 MHz X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 4.1[a];802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou Q1 2016[328]
Wear 2500[329] Q2 2018
Wear 3100[330] QCC1110 (1 core 50 MHzCortex-M0)

3100 & 4100+ only

Q3 2018[331]
SDM429w Wear 4100 and 4100+[332] 12 nm + 28 nm 4 cores up to 2.0 GHzCortex-A53(ARMv8-A) AdrenoA504 320 MHz HexagonQDSP6 V56 1x32 bitLPDDR3750 MHz Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou Q2 2020[333]
SW5100 W5 and W5+ Gen 1[334] 4 nm + 22 nm 4 cores up to 1.7 GHzCortex-A53(ARMv8-A) QCC5100 (1 core 250 MHzCortex-M55+ Ethos-U55)

W5+ only

AdrenoA702 1 GHz HexagonDSP V66K 1x16 bitLPDDR42133 MHz Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou Q3 2022[335]
  1. ^Bluetooth 4.2 for Wear 3100

Automotive platforms

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The Snapdragon 602A,[336]for application in the motor industry,[337]was announced on January 6, 2014.
The Snapdragon 820A[338]was announced on January 6, 2016.

Model number Product Name Fab CPU GPU DSP Memory technology Modem Connectivity Sampling availability
8064-AU[339] Snapdragon 602A 28 nm (TSMC 28LP) 4 cores up to 1.5 GHzKrait300 (ARMv7) Adreno320 400 MHz
(76.8 GFLOPs)

(2048x1536 + 1080p external display) 		HexagonV40 600 MHz LPDDR3Dual-channel 32-bit 533 MHz (8.5 GB/s) ExternalGobi9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA+/HSPA; GSM: EDGE/GPRS) Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 802.11n/ac (Wi-Fi 5) 2x2 (MU-MIMO) Q1 2014
MSM8996AU[340] Snapdragon 820A 14 nm (Samsung 14LPP) Kryo2 + 2 cores (2.15 GHz Gold + 1.59 GHz Silver) (ARMv8) Adreno530 624 MHz
(319.4 GFLOPs) 		Hexagon680 1 GHz LPDDR4XDual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1;802.11ac/ad (Wi-Fi 5); IZat Gen8C Q1 2016
SA6155P[341] 11 nm (Samsung11LPP) Kryo 4xx2 + 6 cores Adreno608/612
(110 GFLOPs) 		Hexagon LPDDR4XDual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) Internal: no Bluetooth 5.0; 802.11a/b/g/n/ac (Wi-Fi 5); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8155P[342][343] Snapdragon 855A 7 nm (TSMCN7) Kryo 4851 + 3 + 4 cores (2.96 GHz Prime + 2.42 GHz Gold + 1.80 GHz Silver) Adreno640 675 MHz
(1036.8 GFLOPs) 		Hexagon690
(>10 TOPS) 		LPDDR4XQuad-channel 16-bit (64-bit)

2133 MHz (34.1 GB/s)[344]

Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS Q1 2021
SA8195P[345][346] Kryo 4954 + 4 cores

(Cortex-A76+Cortex-A55)

Adreno680 600 MHz
(1843.2 GFLOPs) 		Hexagon LPDDR4XQuad-channel 16-bit (64-bit)

2133 MHz (34.1 GB/s)[347]

Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8255P 5 nm (Samsung 5LPE) Kryo4 + 4 cores (2.35 GHz Prime + 2.35 GHz Gold) Adreno663
 Hexagon LPDDR5Hexa-channel 16-bit (96-bit)

3200 MHz (76.8 GB/s)

Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8295P Kryo 6954 + 4 cores (2.56 GHzCortex-X1+ 2.05 GHzCortex-A78) Adreno695 Hexagon
(30 TOPS) 		LPDDR4XOcta-channel 16-bit (128-bit)

2133 MHz (68.2 GB/s)

Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 1.8 Gbit/s; GPS; GLONASS; Beidou; Galileo; QZSS; SBAS 2023

Embedded platforms

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The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.[348][349]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.[350]

Model number Product Name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Sampling availability
APQ8016E[351] Snapdragon 410E 28 nm (TSMC 28LP) 4 cores up to 1.2 GHzCortex-A53(ARMv8) Adreno306 HexagonQDSP6 V5 691 MHz Up to 13 MP camera LPDDR2/3Single-channel 32-bit 533 MHz (4.2 GB/s) none Bluetooth 4.0, 802.11n, GPS
APQ8064E[352] Snapdragon 600E 4 cores up to 1.5 GHzKrait300 (ARMv7) Adreno320 400 MHz HexagonQDSP6 V4 500 MHz Up to 21 MP camera DDR3/DDR3LDual-channel 533 MHz Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
APQ8074[353] Snapdragon 800E 28 nm (TSMC 28HPM) 4 cores up to 2.3 GHzKrait400 (ARMv7) Adreno330
 HexagonQDSP6 V5 Up to 55 MP camera LPDDR3Dual-channel 32-bit 800 MHz (12.8 GB/s) Bluetooth 4.1;802.11n/ac(2.4 and 5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0
APQ8094[354] Snapdragon 810E 20 nm (TSMC 20SoC) 4 + 4 cores (2.0 GHzCortex-A57+ 1.55 GHzCortex-A53;ARMv8) Adreno430 650 MHz HexagonV56 800 MHz Up to 55 MP camera LPDDR4Dual-channel 32-bit 1600 MHz (25.6 GB/s) Bluetooth 4.1; 802.11ac; IZat Gen8C
APQ8096[355] Snapdragon 820E 14 nm FinFET (Samsung 14LPP) 2 + 2 cores (2.15 GHz + 1.593 GHzKryo;ARMv8) Adreno530 Hexagon680 825 MHz Up to 28 MP camera LPDDR4Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) Bluetooth 4.1;802.11ac/ad; IZat Gen8C

Vision Intelligence Platform

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The Qualcomm Vision Intelligence Platform[356]was announced on April 11, 2018.[357][358]The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model number Fab CPU(ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
QCS603[359] 10 nm (Samsung 10LPP) 2 + 2 cores (1.6 GHzKryo360 Gold + 1.7 GHzKryo360 Silver) Adreno615 (Quad HD + 4K Ultra HD external display) Hexagon685 Spectra 270 (Up to 24 MP camera / 16 MP dual) LPDDR4X16-bit 1866 MHz none Bluetooth 5.0,NFC,802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+
QCS605[360] 8 cores up to 2.5 GHzKryo300 Spectra 270 (Up to 32 MP camera / 16 MP dual) Bluetooth 5.0,NFC,802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

Home Hub and Smart Audio platforms

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The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)[361]was announced on June 14, 2017.[362]
The Qualcomm 212 Home Hub (APQ8009)[363]and Qualcomm 624 Home Hub (APQ8053)[364]were announced on January 9, 2018.[365]

The QCS400 Series was announced March 19, 2019.[366]

Model number Fab CPU GPU DSP ISP Audio Memory technology Modem Connectivity Sampling availability
APQ8009[367][361](SDA212)[368] 28 nm (TSMC 28LP) 4 cores up to 1.3 GHzCortex-A7(ARMv7) Adreno304 (HD) Hexagon536 Up to 16 MP camera LPDDR2/3Single-Channel 533 MHz none Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi
APQ8017[361] 4 cores up to 1.4 GHzCortex-A53(ARMv8) Adreno308 (Full HD) LPDDR3Single-channel 667 MHz
APQ8053[369](SDA624)[370] 14 nm (Samsung 14LPP) 8 cores up to 1.8 GHzCortex-A53(ARMv8) Adreno506 (Full HD+) Hexagon546 Up to 24 MP camera / 13 MP dual LPDDR3
QCS403[371] Dual-core CPU none 2xHexagonV66 12x Audio Channels Supported Bluetooth 5.1;

802.11ax-ready, 802.11ac, 4x4 (MIMO);

Zigbee/15.4

Q1 2019
QCS404[372] Quad-core CPU
QCS405[373] Adreno306 (Full HD+)
QCS407[374] 32x Audio Channels Supported

Mixed Reality (MR) platforms

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Snapdragon XR series

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  • In May 2018, Qualcomm announced theSnapdragon XR1 Platform,their first purpose-builtSoCforAugmented reality,Virtual realityandmixed reality.Qualcomm also announced thatHTC Vive,Pico, Meta, andVuzixwould be announcing consumer products featuring the XR1 by the end of 2018.[375]
  • TheSnapdragon XR2 5G Platformwas announced on December 5, 2019, and is a derivative of the Snapdragon 865.[376][failed verification][377]It is used in theMeta Quest 2,theHTC Vive Focus 3and thePico 4.
    • TheSnapdragon XR2+ Gen 1 Platformwas announced on October 11, 2022,[378]and is used in theMeta Quest Pro.
  • On September 27, 2023 Qualcomm announced theSnapdragon XR2 Gen 2 PlatformforMRandVRheadsets.[379]Qualcomm claims 2.5x higher GPU and 8x better AI performance compared to its predecessor the XR2 5G. The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.[380]With the support ofWi-Fi 7network throughput is increased by 60% while latency is decreased by 80%. The platform debuted on theMeta Quest 3.
    • TheSnapdragon XR2+ Gen 2 Platformis anoverclockedversion of the XR2 Gen 2 announced on January 4, 2024.[381]The GPU frequency has been increased by 15% while the CPU frequency has been increased by 20% compared to the XR2 Gen 2. This enables a higher 4.3K resolution per-eye at 90 Hz and the processing of 12 or more concurrent cameras and sensors. This chip forms the basis of theXRheadset and ecosystem jointly developed by Qualcomm, Samsung, and Google that has been announced atGalaxy Unpackedin February 2023.[382]
Product Name Fab CPU(ARMv8) GPU DSP ISP Memory technology Tracking Connectivity Sampling availability
XR1[383] 10 nm (Samsung10LPP) 4xKryo 385Gold + 4x Kryo 385 Silver Adreno 615 Hexagon 685 Spectra LPDDR4X 3DoF and 6DoF head and controller tracking WiFi 5Bluetooth 5 Q1 2019
XR2[384] 7 nm (TSMCN7+) 1xKryo 585Prime + 3x Kryo 585 Gold + 4x Kryo 585 Silver Adreno 650(up to 2x 3K displays at 90 Hz) Hexagon 698 Spectra (input from up to 7 cameras) Full 6DoF head and controller tracking, as well as hand and finger tracking WiFi 6Bluetooth 55G Q1 2020
XR2+ Gen1[385] LPDDR5 WiFi 6EBluetooth 5.25G Q4 2022
XR2 Gen2[386] 4 nm (Samsung4LPX)[387] 4xKryo(2.36 GHz) + 2x Kryo (2.05 GHz) Adreno 740(up to 2x 3K displays at 90 Hz) Hexagon Spectra (input from up to 10 cameras) LPDDR5X WiFi 7Bluetooth 5.35G Q4 2023
XR2+ Gen2[388] ? Adreno 740(up to 2x 4.3K displays at 90 Hz) Hexagon Spectra (input from up to 12 cameras) Q1 2024

Snapdragon AR series

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The QualcommSnapdragon AR2 Gen 1 Platformwas announced November 17, 2022.[389]It is intended for use in smart glasses.[390]
On September 27, 2023 Qualcomm announced theSnapdragon AR1 Gen 1 Platformfor slim and lightARglasses.[379]It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

Gaming platforms

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Snapdragon G series

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In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform.[391][392]TheRazer Edgeis the first device to use the platform.[393]The G3x Gen 1 is a based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters with higher clock speeds, and the same GPU with a higher clockspeed. Connectivity options also seem in line.[394]

In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.[395]

Product Name Fab CPU GPU Modem Connectivity Display Sampling availability
G1 Gen 1[396] Un­known Kryo (8 core) Adreno A11 — Wi-Fi 5, Bluetooth 5.0 HD at 60 fps Q4 2023
G2 Gen 1[397] Un­known Adreno A21 X62 5G/LTE Wi-Fi 6/6E, Bluetooth 5.0 FHD+ up to 144 fps
G3x Gen 1[398] 5 nm (Samsung 5LPE) 1x 3.0 GHzKryo 680 Prime(Cortex-X1) +
3x 2.42 GHz Kyro 680 Gold (Cortex-A78) +
4x 1.80 GHz Kyro 680 SilverCortex-A55) 		Adreno 660 900 MHz
(1382.4 GFLOPs in FP32) 		X60 5G(5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) FastConnect 6900;Bluetooth5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s Q1 2023
G3x Gen 2[399][400] 4 nm (TSMC N4) 1× 3.36 GHz Kryo Prime (Cortex-X3) +
4× 2.8 GHz Kryo Gold (2×Cortex-A715,2×Cortex-A710) +
3× 2.02 GHz Kryo Silver (Cortex-A510) 		Adreno A32 1000 MHz
(3072 GFLOPS in FP32) 		X70 5G(5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s) FastConnect 7800;Bluetooth5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s Q4 2023

Bluetooth SoC platforms

edit

Following Qualcomm's acquisition ofCSRin 2015, Qualcomm designs ultra-low-powerBluetoothSoCsunder the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with bothAmazonandGoogleon reference designs to help manufacturers develop headsets with support forAlexa,Google AssistantandGoogle Fast Pair.[401][402]Qualcomm announced the QCC5100 Series at CES 2018.[403]

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.[404][405]On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.[406]On March 25, 2020, theBLE AudioQCC304x and QCC514x SoCs were officially announced.[407][408]

Qualcomm QCC300x Series Bluetooth audio SoCs

edit
Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Sampling availability
QCC3001[409] RISC application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP (Up to 80 MHz) Bluetooth 5.0

Dual-mode Bluetooth

TrueWireless Stereo

cVc audio

Mono / 2-mic
QCC3002[410] TrueWireless Stereo

aptX Classic/HD/LL

cVc audio

QCC3003[411] cVc audio Stereo / 1-mic
QCC3004[412] Stereo / 2-mic
QCC3005[413] aptX Classic/HD/LL

cVc audio

Qualcomm QCC30xx Series Bluetooth audio SoCs

edit
Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Digital Assistant activation Sampling availability
QCC3020[414] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

~6mA (2DP streaming) Mono / 2-mic Button press H1 2017
QCC3021[415] Stereo / 1-mic
QCC3024[416] cVc audio

Google Fast Pair

Stereo / 2-mic
QCC3026[417] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Mono / 2-mic
QCC3031[418] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Stereo / 1-mic
QCC3034[419] aptX Classic/HD/LL

cVc audio

Google Fast Pair

Mono / 2-mic
QCC3040[420] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[404][405]BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth speed: 2 Mbit/s

aptX Classic/HD

TrueWireless mirroring

ANC (Feedforward/feedback and hybrid)

cVc audio

Google Fast Pair

<5 mA Stereo / 2-mic Button press H1 2020
QCC3046[421] <5 mA

Qualcomm QCC510x Series Bluetooth audio SoCs

edit
Model number Fab CPU DSP Bluetooth Technologies support Power consumption Digital Assistant activation Sampling availability
QCC5120[422] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback and Hybrid)

cVc audio

Google Fast Pair

~6mA (2DP streaming)

~7mA HFP Narrow Band, 1 Digital MIC cVc

Button press

Qualcomm Voice Activation

H1 2018
QCC5121[423]
QCC5124[424]
QCC5125[425] Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~10mA (2DP streaming)

~10mA HFP Narrow Band, 1 Digital MIC cVc

Button press
QCC5141[426] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[404][405]BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Speed: 2 Mbit/s

aptX Adaptive

eXtension program

TrueWireless Mirroring

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~5mA A2DP stream Button press

Qualcomm Voice Activation

H1 2020
QCC5144[427]

See also

edit

References

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  349. ^"Qualcomm Snapdragon 600E and 410E Designed for Embedded Computing, Internet of Things Applications Now Widely Available".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  350. ^"Qualcomm Extends its Embedded Computing Portfolio and Brings its Premium Tier Processors for Cutting-Edge IoT Applications".Qualcomm. February 21, 2018.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  351. ^"Snapdragon 410E Embedded Platform".Qualcomm. October 2, 2018.Archivedfrom the original on February 1, 2018.RetrievedFebruary 23,2018.
  352. ^"Snapdragon 600E Embedded Platform".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  353. ^"Snapdragon 800 Processor for Embedded".Qualcomm.Archivedfrom the original on June 30, 2018.RetrievedJune 30,2018.
  354. ^"Snapdragon 810 Processor for Embedded".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  355. ^"Snapdragon 820E Embedded Platform".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  356. ^"Qualcomm Vision Intelligence Platform".Qualcomm.Archivedfrom the original on July 21, 2018.RetrievedJuly 21,2018.
  357. ^"Qualcomm Unveils the Vision Intelligence Platform Purpose-built for IoT Devices Powered by Latest Advances in Camera, AI and Computer Vision".Qualcomm.Archivedfrom the original on July 21, 2018.RetrievedJuly 21,2018.
  358. ^"Made for the IoT: Meet the Qualcomm Vision Intelligence Platform".Qualcomm.Archivedfrom the original on July 21, 2018.RetrievedJuly 21,2018.
  359. ^"Qualcomm QCS603 SoC".Qualcomm.Archivedfrom the original on August 1, 2018.RetrievedJuly 21,2018.
  360. ^"Qualcomm QCS605 SoC".Qualcomm.Archivedfrom the original on August 1, 2018.RetrievedJuly 21,2018.
  361. ^abc"Qualcomm Smart Audio Platform".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  362. ^"Qualcomm Announces Highly Flexible Smart Speaker Platform with Unique Combination of Support for Voice Assistants and Multi-Room Streaming Audio Capability".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  363. ^"Qualcomm 212 Home Hub Platform".Qualcomm.Archivedfrom the original on July 21, 2018.RetrievedJuly 21,2018.
  364. ^"Qualcomm 624 Home Hub Platform".Qualcomm.Archivedfrom the original on July 21, 2018.RetrievedJuly 21,2018.
  365. ^"Qualcomm Announces New Home Hub Platforms Supporting Android Things to Bring the Google Assistant into Households Everywhere".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  366. ^"Qualcomm Launches New, AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform to Help Drive the Evolution of Smart Audio".Qualcomm.March 19, 2019.Archivedfrom the original on May 16, 2020.RetrievedMay 11,2019.
  367. ^"APQ8009 Processor".Qualcomm.Archivedfrom the original on July 21, 2018.RetrievedJuly 21,2018.
  368. ^"SDA212 SOM".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  369. ^"APQ8053 Processor".Qualcomm.Archivedfrom the original on July 21, 2018.RetrievedJuly 21,2018.
  370. ^"SDA624 SOM".Qualcomm.Archivedfrom the original on February 24, 2018.RetrievedFebruary 23,2018.
  371. ^"QCS403".Qualcomm.February 20, 2019.Archivedfrom the original on July 11, 2019.RetrievedMay 11,2019.
  372. ^"QCS404".Qualcomm.February 20, 2019.Archivedfrom the original on July 11, 2019.RetrievedMay 11,2019.
  373. ^"QCS405".Qualcomm.February 20, 2019.Archivedfrom the original on May 2, 2020.RetrievedMay 11,2019.
  374. ^"QCS407".Qualcomm.February 20, 2019.Archivedfrom the original on July 11, 2019.RetrievedMay 11,2019.
  375. ^Smith, Ryan."Qualcomm Announces XR1 Platform: Dedicated SoC for VR/XR Headsets, Coming Late 2018".www.anandtech.com.Archivedfrom the original on October 14, 2019.RetrievedMay 19,2019.
  376. ^"Lantronix Open-Q 865XR SoM Brings Snapdragon XR2 Processor Beyond Virtual Reality - CNX Software".CNX Software - Embedded Systems News.September 27, 2020.RetrievedSeptember 14,2021.
  377. ^"IQualcomm Technologies Announces the World's First 5G XR Platform".Qualcomm.Archivedfrom the original on December 6, 2019.RetrievedDecember 6,2019.
  378. ^"Qualcomm Powers the Next Generation of Mixed and Virtual Reality Devices with the Snapdragon XR2+ Platform".Qualcomm. October 11, 2022.RetrievedNovember 14,2022.
  379. ^ab"Qualcomm Launches Its Next Generation XR and AR Platforms, Enabling Immersive Experiences and Slimmer Devices".San Diego, California. September 27, 2023.RetrievedSeptember 30,2023.
  380. ^"Snapdragon XR2 Gen 2 Platform".RetrievedSeptember 30,2023.
  381. ^"Qualcomm Accelerates New Wave of Mixed Reality Experiences with Snapdragon XR2+ Gen 2".Qualcomm.San Diego, California. January 4, 2024.RetrievedJanuary 5,2024.
  382. ^"Samsung, Google, and Qualcomm announce XR partnership ahead of Apple's rumored headset debut".ZDNet.February 1, 2023.RetrievedJanuary 5,2024.
  383. ^"Snapdragon XR1 Platform".Qualcomm.October 2, 2018.Archivedfrom the original on April 30, 2020.RetrievedMay 19,2019.
  384. ^"Snapdragon XR2 5G Platform".Qualcomm.Archivedfrom the original on December 6, 2019.RetrievedDecember 6,2019.
  385. ^"Snapdragon XR2+ Gen1 5G Platform".Qualcomm.RetrievedMarch 2,2024.
  386. ^"Snapdragon XR2 Gen2 5G Platform".Qualcomm.RetrievedMarch 2,2024.
  387. ^Kiêu long XR2+GEN2 cao thông XR bình đài tâm phiến sách giải sxr2230p,24 Sep 2024
  388. ^"Snapdragon XR2+ Gen2 5G Platform".Qualcomm.RetrievedMarch 2,2024.
  389. ^"Qualcomm Launches Snapdragon AR2 Designed to Revolutionize AR Glasses".qualcomm.com.Hawaii. November 27, 2022.RetrievedJune 27,2023.
  390. ^"Snapdragon AR2 Gen 1 Platform".qualcomm.com.RetrievedJune 27,2023.
  391. ^"Snapdragon G3x Gen 1 Gaming Platform"(PDF).Qualcomm.RetrievedDecember 1,2021.
  392. ^"Qualcomm Introduces Snapdragon G3x Gen 1 Gaming Platform to Power a New Generation of Dedicated Gaming Devices".Qualcomm.Archivedfrom the original on December 2, 2021.RetrievedDecember 1,2021.
  393. ^Amadeo, Ron (October 17, 2022)."$399 Razer Edge tries to make Android gaming tablets happen".Ars Technica.RetrievedNovember 5,2022.
  394. ^"Razer Edge - Geekbench Search".RetrievedAugust 25,2023.
  395. ^"Qualcomm Unveils Snapdragon G Series - The Powerhouse Portfolio Designed for Next-Gen Handheld Gaming Devices".Qualcomm.RetrievedAugust 24,2023.
  396. ^"Snapdragon G1 Gen 1 Gaming Platform".RetrievedAugust 24,2023.
  397. ^"Snapdragon G2 Gen 1 Gaming Platform".RetrievedAugust 24,2023.
  398. ^"Snapdragon G3x Gen 1 Gaming Platform".RetrievedDecember 1,2022.
  399. ^"Snapdragon G3x Gen 2 Gaming Platform".RetrievedAugust 24,2023.
  400. ^"Official Release of AYANEO Pocket S, High-End Flagship Android Handheld Featuring the Snapdragon G3x Gen 2 Gaming Platform… - AYANEO".
  401. ^"Amazon.com, Qualcomm to put Alexa assistant in more headphones".Reuters.October 23, 2018.Archivedfrom the original on October 4, 2019.RetrievedMay 19,2019.
  402. ^Li, Abner (May 9, 2019)."Google, Qualcomm working to help create more Fast Pair and Assistant headphones".9to5Google.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  403. ^"Qualcomm wants to triple Bluetooth headphone listening time".Android Authority.January 8, 2018.Archivedfrom the original on December 5, 2019.RetrievedMay 19,2019.
  404. ^abc"Launch Studio - D046352 Listing Details".launchstudio.bluetooth.com.Archivedfrom the original on January 29, 2020.RetrievedJanuary 29,2020.
  405. ^abc"Launch Studio - D046351 Listing Details".launchstudio.bluetooth.com.Archivedfrom the original on January 29, 2020.RetrievedJanuary 29,2020.
  406. ^"LE Audio: A new age of Bluetooth audio sharing".Qualcomm.January 27, 2020.Archivedfrom the original on January 29, 2020.RetrievedJanuary 29,2020.
  407. ^"New Ultra-Low Power Bluetooth Audio SoCs From Qualcomm Improve Truly Wireless Sound".Qualcomm.March 25, 2020.Archivedfrom the original on March 27, 2020.RetrievedMarch 27,2020.
  408. ^"New audio technologies help bring out the best in truly wireless earbuds".Qualcomm.March 25, 2020.Archivedfrom the original on March 27, 2020.RetrievedMarch 27,2020.
  409. ^"QCC3001".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  410. ^"QCC3002".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  411. ^"QCC3003".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  412. ^"QCC3004".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  413. ^"QCC3005".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  414. ^"QCC3020".Qualcomm.October 2, 2018.Archivedfrom the original on May 24, 2020.RetrievedMay 19,2019.
  415. ^"QCC3021".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  416. ^"QCC3024".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  417. ^"QCC3026".Qualcomm.October 2, 2018.Archivedfrom the original on January 15, 2020.RetrievedMay 19,2019.
  418. ^"QCC3031".Qualcomm.October 2, 2018.Archivedfrom the original on March 27, 2020.RetrievedMay 19,2019.
  419. ^"QCC3034".Qualcomm.October 2, 2018.Archivedfrom the original on March 27, 2020.RetrievedMay 19,2019.
  420. ^"QCC3040 | Entry-Level TrueWireless Bluetooth Audio BGA SoC".Qualcomm.March 17, 2020.Archivedfrom the original on March 27, 2020.RetrievedMarch 27,2020.
  421. ^"QCC3046 | Mid-Level TrueWireless Bluetooth Audio WLCSP".Qualcomm.March 19, 2020.Archivedfrom the original on March 27, 2020.RetrievedMarch 27,2020.
  422. ^"QCC5120".Qualcomm.October 2, 2018.Archivedfrom the original on July 11, 2019.RetrievedMay 19,2019.
  423. ^"QCC5121".Qualcomm.October 2, 2018.Archivedfrom the original on March 27, 2020.RetrievedMay 19,2019.
  424. ^"QCC5124".Qualcomm.October 2, 2018.Archivedfrom the original on January 29, 2020.RetrievedMay 19,2019.
  425. ^"QCC5125".Qualcomm.October 2, 2018.Archivedfrom the original on January 29, 2020.RetrievedMay 19,2019.
  426. ^"QCC5141 Chipset | Premium-tier WLCSP package for TrueWireless Earbuds".Qualcomm.March 19, 2020.Archivedfrom the original on March 27, 2020.RetrievedMarch 27,2020.
  427. ^"QCC5144 Chipset | Premium BGA package for TrueWireless Earbuds".Qualcomm.March 19, 2020.Archivedfrom the original on March 27, 2020.RetrievedMarch 27,2020.
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