TMTPOST--Analysts from UBS have indicated that the expansion pace of semiconductor CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging is faster than anticipated. It is projected to reach 45,000 wafers per month by the end of this year and increase to 65,000 wafers per month by the end of next year. Moreover, by 2026, more companies are expected to ramp up production, potentially increasing capacity by an additional 20% to 30%. UBS Analyst Lin Lijun said that industry plans for expansion in 2026 signify increasing visibility and demand for cloud accelerators. Shipments of smartphones and personal computers (PCs) saw significant declines last year but are expected to grow slightly this year, driven by the anticipated acceleration in adoption of generative artificial intelligence, which could spur replacement cycles.