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USB 3.0

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"SuperSpeed" redirects here. For other uses, seeSuper Speed.

USB 3.0
Deprecated SuperSpeed USB logo
Type USB
Production history
Designed November 2008;16 years ago(2008-11)
Manufacturer USB 3.0 Promoter Group (Hewlett-Packard,Intel,Microsoft,NEC,ST-Ericsson,andTexas Instruments)[1][dead link]
Superseded USB 2.0 Hi-Speed
Superseded by USB 3.1,USB 3.2,USB4(July 2013, September 2017, August 2019)
General specifications
Length Standard-A plug: 12 mm
Standard-B plug: 12 mm
Type-C (USB-C) plug: 6.65 mm
Width Standard-A plug: 12 mm
Standard-B plug: 8 mm
Micro-A & Micro-B plugs: 12.2 mm
Type-C (USB-C) plug: 8.25 mm
Height Standard-A plug: 4.5 mm
Standard-B plug: 10.44 mm
Micro-A & Micro-B plugs: 1.8 mm
Type-C (USB-C) plug: 2.40 mm
Daisy chain No
Audio signal No
Video signal No
Pins 9 (Type A & B) / 24 (Type-C)
Connector (SS) USB 3.0 Standard-A,
(SS) USB 3.0 Standard-B,
(SS) USB 3.0 Micro-A,
(SS) USB 3.0 Micro-B,
(SS) USB 3.0 Micro-AB,
USB-C (USB Type-C)
Electrical
Max. voltage 5V
Max. current 900 mA
1.5 A (BC 1.1/1.2, USB 3.2 single-lane)
3 A (USB 3.2 multi-lane Type-C)
Data
Data signal Yes
Bitrate 5 Gbit/s (500 MB/s, USB 3.0)
10 Gbit/s (1.212 GB/s, USB 3.1 Gen 2)
20 Gbit/s (2.422 GB/s, USB 3.2 Gen 2x2)
A deprecated[2]SuperSpeed USB 5 Gbit/s packaging logo

Universal Serial Bus 3.0(USB 3.0), marketed asSuperSpeed USB,is the third major version of theUniversal Serial Bus(USB) standard for interfacing computers and electronic devices. It was released in November 2008. The USB 3.0 specification defined a new architecture and protocol, named SuperSpeed, which included a new lane for providing full-duplex data transfers that physically required five additional wires and pins, while also adding a new signal coding scheme (8b/10b symbols, 5 Gbps; also known later as Gen 1), and preserving the USB 2.0 architecture and protocols and therefore keeping the original four pins and wires for the USB 2.0 backward-compatibility, resulting in nine wires in total and nine or ten pins at connector interfaces (ID-pin is not wired). The new transfer rate, marketed asSuperSpeed USB(SS), can transfer signals at up to 5Gbit/swith raw data rate of 500MB/safter encoding overhead, which is about 10 times faster than High-Speed (maximum forUSB 2.0standard). USB 3.0 Type-A and B connectors are usually blue, to distinguish them from USB 2.0 connectors, as recommended by the specification,[3]and by the initialsSS.[4]

USB 3.1,released in July 2013, is the successor specification that fully replaces the USB 3.0 specification. USB 3.1 preserves the existingSuperSpeed USBarchitecture and protocol with its operation mode (8b/10b symbols, 5 Gbps), giving it the labelUSB 3.1 Gen 1.[5][6]USB 3.1 introduced anEnhanced SuperSpeed System– while preserving and incorporating the SuperSpeed architecture and protocol (akaSuperSpeed USB) – with an additionalSuperSpeedPlusarchitecture adding and providing a new coding schema (128b/132b symbols) and protocol namedSuperSpeedPlus(akaSuperSpeedPlus USB,sometimes marketed asSuperSpeed+orSS+) while defining a new transfer mode calledUSB 3.1 Gen 2[5]with a signal speed of 10 Gbit/s and a raw data rate of 1212 MB/s over existing Type-A, Type-B, andUSB-Cconnections, more than twice the rate of USB 3.0 (aka Gen 1).[7][8]Backward-compatibility is still given by the parallel USB 2.0 implementation. USB 3.1 Gen 2 Type-A and Type-B connectors are usually teal-colored.

USB 3.2,released in September 2017, fully replaces the USB 3.1 specification. The USB 3.2 specification added a second lane to the Enhanced SuperSpeed System besides other enhancements, so that SuperSpeedPlus USB implements theGen 2x1(formerly known asUSB 3.1 Gen 2), and the two newGen 1x2andGen 2x2operation modes while operating on two lanes. The SuperSpeed architecture and protocol (aka SuperSpeed USB) still implements the one-laneGen 1x1(formerly known asUSB 3.1 Gen 1) operation mode. Therefore, two-lane operations, namelyUSB 3.2 Gen 1x2(10 Gbit/s with raw data rate of 1 GB/s after encoding overhead) andUSB 3.2 Gen 2x2(20 Gbit/s, 2.422 GB/s), are only possible with Full-Featured USB Type-C Fabrics (24 pins). As of 2023, USB 3.2 Gen 1x2 and Gen 2x2 are not implemented on many products yet; Intel, however, starts to include them in itsLGA 1200 Rocket Lake chipsets (500 series)in January 2021 and AMD in itsLGA 1718 AM5 chipsetsin September 2022, but Apple never provided them. On the other hand, USB 3.2 Gen 1x1 (5 Gbit/s) and Gen 2x1 (10 Gbit/s) implementations have become quite common. Again, backward-compatibility is given by the parallel USB 2.0 implementation.

Overview

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The USB 3.0 specification is similar toUSB 2.0,but with many improvements and an alternative implementation. Earlier USB concepts such as endpoints and the four transfer types (bulk, control,isochronousand interrupt) are preserved but the protocol and electrical interface are different. The specification defines a physically separate channel to carry USB 3.0 traffic. The changes in this specification make improvements in the following areas:

  • Transfer speed – USB 3.0 adds a new transfer type called SuperSpeed or SS, 5 Gbit/s (electrically, it is more similar toPCI Express 2.0andSATAthan USB 2.0)[9]
  • Increased bandwidth – USB 3.0 uses two unidirectional data paths instead of only one: one to receive data and the other to transmit
  • Power management – U0 to U3 link power management states are defined
  • Improved bus use – a new feature is added (using packets NRDY and ERDY) to let a device asynchronously notify the host of its readiness, with no need for polling
  • Support for rotating media – the bulk protocol is updated with a new feature called Stream Protocol that allows a large number of logical streams within an Endpoint

USB 3.0 has transmission speeds of up to 5 Gbit/s or 5000 Mbit/s, about ten times faster than USB 2.0 (0.48 Gbit/s) even without considering that USB 3.0 isfull duplexwhereas USB 2.0 ishalf duplex.This gives USB 3.0 a potential total bidirectional bandwidth twenty times greater than USB 2.0.[10]Considering flow control, packet framing and protocol overhead, applications can expect 450 MB/s of bandwidth.[11]

Architecture and features

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Front view of a Standard-A USB 3.0 connector, showing its front row of four pins for the USB 1.x/2.0 backward compatibility, and a second row of five pins for the later (but out-of-date) USB 3.0 connectivity. The plastic insert is in the USB 3.0 standard blue color, Pantone 300C.

In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providingbackward compatibility.The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide bus connectivity to devices.

Data transfer and synchronization

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The SuperSpeed transaction is initiated by a host request, followed by a response from the device. The device either accepts the request or rejects it; if accepted, the device sends data or accepts data from the host. If the endpoint is halted, the device responds with a STALL handshake. If there is lack of buffer space or data, it responds with a Not Ready (NRDY) signal to tell the host that it is not able to process the request. When the device is ready, it sends an Endpoint Ready (ERDY) to the host which then reschedules the transaction.

The use ofunicastand the limited number ofmulticastpackets, combined with asynchronous notifications, enables links that are not actively passing packets to be put into reduced power states, which allows better power management.

USB 3.0 uses aspread-spectrum clockvarying by up to 5000 ppm at 33 KHz to reduce EMI. As a result, the receiver needs to continually "chase" the clock to recover the data.Clock recoveryis helped by the 8b/10b encoding and other designs.[12]

Data encoding

[edit]

The"SuperSpeed"bus provides for a transfer mode at a nominal rate of 5.0 Gbit/s, in addition to the three existing transfer modes. Accounting for the encoding overhead, the raw data throughput is 4 Gbit/s, and the specification considers it reasonable to achieve 3.2 Gbit/s (400 MB/s) or more in practice.[13]

All data is sent as a stream of eight-bit (one-byte) segments that are scrambled and converted into 10-bit symbols via8b/10b encoding;this helps prevent transmissions from generatingelectromagnetic interference(EMI).[7]Scrambling is implemented using a free-runninglinear feedback shift register(LFSR). The LFSR is reset whenever a COM symbol is sent or received.[13]

Unlike previous standards, the USB 3.0 standard does not specify a maximum cable length, requiring only that all cables meet an electrical specification: for copper cabling withAWG26 wires, the maximum practical length is 3 meters (10 ft).[14]

Power and charging

[edit]

As with earlier versions of USB, USB 3.0 provides power at 5 volts nominal. The available current for low-power (one unit load) SuperSpeed devices is 150 mA, an increase from the 100 mA defined in USB 2.0. For high-power SuperSpeed devices, the limit is six unit loads or 900 mA (4.5W)—almost twice USB 2.0's 500 mA.[13]: section 9.2.5.1 Power Budgeting 

USB 3.0 ports may implement other USB specifications for increased power, including theUSB Battery Charging Specificationfor up to 1.5 A or 7.5 W, or, in the case of USB 3.1, theUSB Power Delivery Specificationfor charging the host device up to 100 W.[15]

Naming scheme

[edit]

Starting with the USB 3.2 specification, USB-IF introduced a new naming scheme.[16]To help companies with branding of the different operation modes, USB-IF recommended branding the 5, 10, and 20 Gbit/s capabilities asSuperSpeed USB 5Gbps,SuperSpeed USB 10 Gbps,andSuperSpeed USB 20 Gbps,respectively.[17]

In 2023, they were replaced again,[18]removing"SuperSpeed",withUSB 5Gbps,USB 10Gbps,andUSB 20Gbps.With newPackagingandPortlogos.[19]

Availability

[edit]
Internal circuitboard and connectors of a USB 3.0 four-port hub, using aVIA Technologieschipset

The USB 3.0 Promoter Group announced on 17 November 2008 that the specification of version 3.0 had been completed and had made the transition to theUSB Implementers Forum(USB-IF), the managing body of USB specifications.[20]This move effectively opened the specification to hardware developers for implementation in future products.

The first USB 3.0 consumer products were announced and shipped byBuffalo Technologyin November 2009, while the first certified USB 3.0 consumer products were announced on 5 January 2010, at the Las VegasConsumer Electronics Show(CES), including two motherboards byAsusandGigabyte Technology.[21][22]

Manufacturers of USB 3.0 host controllers include, but are not limited to,Renesas Electronics,Fresco Logic,ASMedia,Etron,VIA Technologies,Texas Instruments,NECandNvidia.As of November 2010, Renesas and Fresco Logic[23]have passed USB-IF certification. Motherboards forIntel'sSandy Bridgeprocessors have been seen with Asmedia and Etron host controllers as well. On 28 October 2010,Hewlett-Packardreleased theHP Envy17 3D featuring a Renesas USB 3.0 host controller several months before some of their competitors.AMDworked with Renesas to add its USB 3.0 implementation into its chipsets for its 2011 platforms.[needs update]At CES2011,Toshibaunveiled a laptop called "QosmioX500 "that included USB 3.0 andBluetooth 3.0,andSonyreleased a new series ofSony VAIOlaptops that would include USB 3.0. As of April 2011, theInspironandDell XPSseries were available with USB 3.0 ports, and, as of May 2012, theDell Latitudelaptop series were as well; yet the USB root hosts failed to work at SuperSpeed under Windows 8.

Adding to existing equipment

[edit]
A USB 3.0 controller in form of a PCI Expressexpansion card
Side connectors on a laptop computer. Left to right: USB 3.0 host,VGA connector,DisplayPortconnector, USB 2.0 host. Note the five additional pins on the underside of the tongue of the USB 3.0 port.

Additional power for multiple ports on a laptop PC may be obtained in the following ways:

  • SomeExpressCard-to-USB 3.0 adapters may connect by a cable to an additional USB 2.0 port on the computer, which supplies additional power.
  • The ExpressCard may have a socket for an external power supply.
  • If the external device has an appropriate connector, it can be powered by anexternal power supply.
  • USB 3.0 port provided by an ExpressCard-to-USB 3.0 adapter may be connected to a separately-powered USB 3.0 hub, with external devices connected to that USB 3.0 hub.

On the motherboards of desktop PCs which havePCI Express(PCIe) slots (or the olderPCIstandard), USB 3.0 support can be added as a PCI Expressexpansion card.In addition to an empty PCIe slot on the motherboard, many "PCI Express to USB 3.0" expansion cards must be connected to a power supply such as aMolexadapter or external power supply, in order to power many USB 3.0 devices such as mobile phones, or external hard drives that have no power source other than USB; as of 2011, this is often used to supply two to four USB 3.0 ports with the full 0.9 A (4.5 W) of power that each USB 3.0 port is capable of (while also transmitting data), whereas the PCI Express slot itself cannot supply the required amount of power.

If faster connections to storage devices are the reason to consider USB 3.0, an alternative is to useeSATAp,possibly by adding an inexpensive expansion slot bracket that provides an eSATAp port; some external hard disk drives provide both USB (2.0 or 3.0) and eSATAp interfaces.[22]To ensure compatibility between motherboards and peripherals, all USB-certified devices must be approved by theUSB Implementers Forum(USB-IF). At least one complete end-to-end test system for USB 3.0 designers is available on the market.[24]

Adoption

[edit]

The USB Promoter Group announced the release of USB 3.0 in November 2008. On 5 January 2010, theUSB-IFannounced the first two certified USB 3.0 motherboards, one byASUSand one byGiga-Byte Technology.[22][25]Previous announcements included Gigabyte's October 2009 list of sevenP55 chipsetUSB 3.0 motherboards,[26]and an Asus motherboard that was cancelled before production.[27]

Commercial controllers were expected to enter into volume production in the first quarter of 2010.[28]On 14 September 2009,Freecomannounced a USB 3.0 external hard drive.[29]On 4 January 2010,Seagateannounced a small portable HDD bundled with an additional USB 3.0ExpressCard,targeted for laptops (or desktops with ExpressCard slot addition) at the CES in Las Vegas Nevada.[30][31]

TheLinux kernel mainlinecontains support for USB 3.0 since version 2.6.31, which was released in September 2009.[32][33][34]

FreeBSDsupports USB 3.0 since version 8.2, which was released in February 2011.[35]

Windows 8was the first Microsoft operating system to offer built in support for USB 3.0.[36]InWindows 7support was not included with the initial release of the operating system.[37]However, drivers that enable support for Windows 7 are available through websites of hardware manufacturers.

Intelreleased its firstchipsetwith integrated USB 3.0 ports in 2012 with the release of thePanther Pointchipset. Some industry analysts have claimed that Intel was slow to integrate USB 3.0 into the chipset, thus slowing mainstream adoption.[38]These delays may be due to problems in theCMOSmanufacturing process,[39]a focus to advance theNehalemplatform,[40]a wait to mature all the 3.0 connections standards (USB 3.0,PCIe 3.0,SATA 3.0) before developing a new chipset,[41][42]or a tactic by Intel to favor its newThunderboltinterface.[43]Apple, Inc. announced laptops with USB 3.0 ports on 11 June 2012, nearly four years after USB 3.0 was finalized.

AMDbegan supporting USB 3.0 with itsFusion Controller Hubsin 2011.Samsung Electronicsannounced support of USB 3.0 with itsARM-basedExynos 5 Dualplatform intended for handheld devices.

Issues

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Speed and compatibility

[edit]

Various early USB 3.0 implementations widely used theNEC/RenesasμD72020x family of host controllers,[44]which are known to require a firmware update to function properly with some devices.[45][46][47]

A factor affecting the speed of USB storage devices (more evident with USB 3.0 devices, but also noticeable with USB 2.0 ones) is that theUSB Mass Storage Bulk-Only Transfer(BOT) protocol drivers are generally slower than theUSB Attached SCSIprotocol (UAS[P]) drivers.[48][49][50][51]

On some old (2009–2010)Ibex Peak-based motherboards, the built-in USB 3.0 chipsets are connected by default via a 2.5GT/sPCI Expresslane of thePCH,which then did not provide full PCI Express 2.0 speed (5 GT/s), so it did not provide enough bandwidth even for a single USB 3.0 port. Early versions of such boards (e.g. theGigabyte TechnologyP55A-UD4 or P55A-UD6) have a manual switch (in BIOS) that can connect the USB 3.0 chip to the processor (instead of the PCH), which did provide full-speed PCI Express 2.0 connectivity even then, but this meant using fewer PCI Express 2.0 lanes for the graphics card. However, newer boards (e.g. Gigabyte P55A-UD7 or the Asus P7P55D-E Premium) used achannel bondingtechnique (in the case of those boards provided by aPLXPEX8608 or PEX8613 PCI Express switch) that combines two PCI Express 2.5 GT/s lanes into a single PCI Express 5 GT/s lane (among other features), thus obtaining the necessary bandwidth from the PCH.[52][53][54]

Radio frequency interference

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USB 3.0 devices and cables mayinterferewith wireless devices operating in the 2.4 GHz ISM band. This may result in a drop in throughput or complete loss of response withBluetoothandWi-Fidevices.[55]When manufacturers were unable to resolve the interference issues in time, some mobile devices, such as the Vivo Xplay 3S, had to drop support for USB 3.0 just before they shipped.[56]Various strategies can be applied to resolve the problem, ranging from simple solutions such as increasing the distance of USB 3.0 devices from Wi-Fi and Bluetooth devices, to applying additional shielding around internal computer components.[57]

Connectors

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See also:USB hardware § Connectors
USB 3.0 Standard-A receptacle (top, in the blue color "Pantone300C "), Standard-B plug (middle), and Micro-B plug (bottom)

A USB 3.0 Standard-A receptacle accepts either a USB 3.0 Standard-A plug or a USB 2.0 Standard-A plug. Conversely, it is possible to plug a USB 3.0 Standard-A plug into a USB 2.0 Standard-A receptacle. This is a principle of backward compatibility. The Standard-A plug is used for connecting to a computer port, at the host side.

A USB 3.0 Standard-B receptacle accepts either a USB 3.0 Standard-B plug or a USB 2.0 Standard-B plug. Backward compatibility applies to connecting a USB 2.0 Standard-B plug into a USB 3.0 Standard-B receptacle. However, it is not possible to plug a USB 3.0 Standard-B plug into a USB 2.0 Standard-B receptacle, due to the physically larger connector. The Standard-B plug is used at the device side.

Since USB 2.0 and USB 3.0 ports may coexist on the same machine and they look similar, the USB 3.0 specification recommends that the Standard-A USB 3.0 receptacle have a blue insert (Pantone300C color). The same color-coding applies to the USB 3.0 Standard-A plug.[13]: sections 3.1.1.1 and 5.3.1.3 

USB 3.0 also introduced a new Micro-B cable plug, which consists of a standard USB 1.x/2.0 Micro-B cable plug, with an additional 5-pin plug "stacked" beside it. That way, the USB 3.0 Micro-B host receptacle preserves its backward compatibility with the USB 1.x/2.0 Micro-B cable plug, allowing devices with USB 3.0 Micro-B ports to run at USB 2.0 speeds on USB 2.0 Micro-B cables. However, it is not possible to plug a USB 3.0 Micro-B plug into a USB 2.0 Micro-B receptacle, due to the physically larger connector.

Pinouts

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USB 3.0 Standard-A plug (top) and receptacle (bottom), with annotated pins

The connector has the same physical configuration as its predecessor but with five more pins.

The VBUS, D−, D+, and GND pins are required for USB 2.0 communication. The five additional USB 3.0 pins are two differential pairs and one ground (GND_DRAIN). The two additional differential pairs are for SuperSpeed data transfer; they are used for full duplex SuperSpeed signaling. The GND_DRAIN pin is for drain wire termination and to control EMI and maintain signal integrity.

USB 3.0 connector pinouts[58]
Pin Color Signal name Description
A connector B connector
Shell — Shield Metal housing
1 Red VBUS Power
2 White D− USB 2.0 differential pair
3 Green D+
4 Black GND Ground for power return
5 Blue StdA_SSRX− StdB_SSTX− SuperSpeed receiver differential pair
6 Yellow StdA_SSRX+ StdB_SSTX+
7 — GND_DRAIN Ground for signal return
8 Purple StdA_SSTX− StdB_SSRX− SuperSpeed transmitter differential pair
9 Orange StdA_SSTX+ StdB_SSRX+
The USB 3.0Powered-Bconnector has two additional pins for power and ground supplied to the device.[59]
10 — DPWR Power provided to device (Powered-B only)
11 DGND Ground for DPWR return (Powered-B only)

Backward compatibility

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USB Micro-B USB 2.0 vs USB Micro-B SuperSpeed (USB 3.0)

USB 3.0 and USB 2.0 (or earlier) Type-A plugs and receptacles are designed to interoperate.

USB 3.0 Type-B receptacles, such as those found on peripheral devices, are larger than in USB 2.0 (or earlier versions), and accept both the larger USB 3.0 Type-B plug and the smaller USB 2.0 (or earlier) Type-B plug. USB 3.0 Type-B plugs are larger than USB 2.0 (or earlier) Type-B plugs; therefore, USB 3.0 Type-B plugs cannot be inserted into USB 2.0 (or earlier) Type-B receptacles.

Micro USB 3.0 (Micro-B) plug and receptacle are intended primarily for small portable devices such as smartphones, digital cameras and GPS devices. The Micro USB 3.0 receptacle is backward compatible with the Micro USB 2.0 plug.

A receptacle foreSATAp,which is an eSATA/USB combo, is designed to accept USB Type-A plugs from USB 2.0 (or earlier), so it also accepts USB 3.0 Type-A plugs.

USB 3.1

[edit]
See also:USB-C
A deprecated[2]SuperSpeed+ USB 10 Gbit/s packaging logo

In January 2013 the USB group announced plans to update USB 3.0 to 10 Gbit/s (1250 MB/s).[60]The group ended up creating a new USB specification, USB 3.1, which was released on 31 July 2013,[61]replacing the USB 3.0 standard. The USB 3.1 specification takes over the existing USB 3.0'sSuperSpeed USBtransfer rate, now referred to asUSB 3.1 Gen 1,and introduces a faster transfer rate calledSuperSpeed USB 10Gbps,corresponding to operation modeUSB 3.1 Gen 2,[62]putting it on par with a single first-generationThunderboltchannel. The new mode's logo features a caption stylized asSUPERSPEED+;[63]this refers to the updatedSuperSpeedPlusprotocol. The USB 3.1 Gen 2 mode also reduces line encoding overhead to just 3% by changing theencoding schemeto128b/132b,with raw data rate of 1,212 MB/s.[64]The first USB 3.1 Gen 2 implementation demonstrated real-world transfer speeds of 7.2 Gbit/s.[65]

The USB 3.1 specification includes the USB 2.0 specification while fully preserving its dedicated physical layer, architecture, and protocol in parallel. USB 3.1 specification defines the following operation modes:

  • USB 3.1 Gen 1– newly marketed asSuperSpeed or SS,5 Gbit/s signaling rate over 1 lane using 8b/10b encoding (raw data rate: 500 MB/s); replaces USB 3.0.
  • USB 3.1 Gen 2–new,marketed asSuperSpeed+ or SS+,10 Gbit/s signaling rate over 1 lane using 128b/132b encoding (raw data rate: 1212 MB/s).

The nominal data rate in bytes accounts for bit-encoding overhead. The physical SuperSpeed signaling bit rate is 5 Gbit/s. Since transmission of every byte takes 10 bit times, the raw data overhead is 20%, so the raw byte rate is 500 MB/s, not 625. Similarly, for Gen 2 link the encoding is 128b/132b, so transmission of 16 bytes physically takes 16.5 bytes, or 3% overhead. Therefore, the new raw byte-rate is 128/132 * 10 Gbit/s = 9.697 Gbit/s = 1212 MB/s. In reality any operation mode has additional link management and protocol overhead, so the best-case achievable data rates for the Gen 2 operation mode are of roughly below 800 MB/s for reading bulk transfers only.[66][11]

The re-specification of USB 3.0 as "USB 3.1 Gen 1" was misused by some manufacturers to advertise products with signaling rates of only 5 Gbit/s as "USB 3.1" by omitting the defining generation.[67]

USB 3.2

[edit]
A deprecated[2]SuperSpeed+ USB 20 Gbit/s packaging logo
USB 20Gbps port logo

On 25 July 2017, a press release from the USB 3.0 Promoter Group detailed a pending update to theUSB Type-Cspecification, defining the doubling of bandwidth for existing USB-C cables. Under the USB 3.2 specification, released 22 September 2017,[11]existing SuperSpeed certified USB-C 3.1 Gen 1 cables will be able to operate at 10 Gbit/s (up from 5 Gbit/s), and SuperSpeed+ certified USB-C 3.1 Gen 2 cables will be able to operate at 20 Gbit/s (up from 10 Gbit/s). The increase in bandwidth is a result of multi-lane operation over existing wires that were intended for flip-flop capabilities of the USB-C connector.[68][69]

The USB 3.2 standard includes the USB 2.0 specification with four dedicated wires on the physical layer. TheEnhanced SuperSpeed Systemencompasses both, but separated – and in parallel to the USB 2.0 implementation:[70]

  • SuperSpeed USB(based onSuperSpeed-architecture and -protocols):
    • USB 3.2 Gen 1x1– newly marketed asSuperSpeed USB 5Gbps(replacesSuperSpeed or SS), 5 Gbit/s signaling rate over 1 lane using 8b/10b encoding (raw data rate: 500 MB/s); replaces USB 3.1 Gen 1, or USB 3.0, respectively.
  • SuperSpeedPlus USB(based onSuperSpeedPlus-architecture and -protocols):
    • USB 3.2 Gen 2x1– newly marketed asSuperSpeed USB 10 Gbps(replacesSuperSpeed+ or SS+),[63]10 Gbit/s signaling rate over 1 lane using 128b/132b encoding (raw data rate: 1212 MB/s); replaces USB 3.1 Gen 2.
    • USB 3.2 Gen 1x2–new,10 Gbit/s signaling rate over 2 lanes using 8b/10b encoding (raw data rate: 1000 MB/s).
    • USB 3.2 Gen 2x2–new,marketed asSuperSpeed USB 20 Gbps,20 Gbit/s signaling rate over 2 lanes using 128b/132b encoding (raw data rate: 2424 MB/s).

As with the previous version, the same considerations around encoding and raw data rates apply. Although both Gen 1x2 and Gen 2(x1) signal at 10 Gbit/s, Gen 1x2 uses the older, less efficient 8b/10b line coding which results in a lower raw data rate compared with Gen 2(x1), though both using the newer SuperSpeedPlus protocol.[70]

In May 2018,Synopsysdemonstrated the first USB 3.2 Gen 2x2 operation mode, where a Windows PC was connected to a storage device, reaching an average data rate of 1600 MB/s for reading bulk transmissions,[71][72]which is 66% of its raw throughput.

USB 3.2 is supported with the default Windows 10 USB drivers and in Linux kernels 4.18 and onwards.[71][72][73]

In February 2019, USB-IF simplified the marketing guidelines by excluding Gen 1x2 mode and required the SuperSpeed trident logos to include maximum transfer speed.[74][75]

Two-lane operation (USB 3.2 Gen 1x2, USB 3.2 Gen 2x2) is only possible with Full-Featured USB-C Fabrics.[76]

USB 3.2 specification operation modes
USB-IFrecommended
marketing name[77] 		Logo[19] USB 3.2 specification operation mode[11] Older operation mode names
(first publication)[78][79] 		Dual lane Encoding Nominal signal rate[11] Raw data rate[11] Measured real-world throughput[80] Supporting connectors[81]
SuperSpeed USB 5Gbps USB 3.2 Gen 1x1 USB 3.0,
USB 3.1 Gen 1
(USB 3.0) 		No 8b/10b 5 Gbit/s 0.5 GB/s ≤ 0.45 GB/s A,B,Micro-[A, B, AB],C
SuperSpeed USB 10Gbps USB 3.2 Gen 2x1 USB 3.1 Gen 2
(USB 3.1) 		128b/132b 10 Gbit/s 1.2 GB/s ≤ 0.8 GB/s
— USB 3.2 Gen 1x2 —
(USB 3.2) 		Yes 8b/10b 1 GB/s ≤ 0.70 GB/s C
SuperSpeed USB 20Gbps USB 3.2 Gen 2x2 128b/132b 20 Gbit/s 2.4 GB/s ≤ 1.6 GB/s

See also

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References

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  1. ^"Intel Universal Serial Bus (USB) Frequently Asked Questions (FAQ)".Intel.com.Intel Corporation.Retrieved26 December2014.
  2. ^abc USB Implementers Forum (20 September 2023)."USB-IF Licensed Mark(s) Requirements".USB Implementers Forum. Archived fromthe originalon 21 September 2023.Retrieved29 August2023.
  3. ^"Universal Serial Bus Revision 3.1 Specification".USB.org.USB Implementers Forum. pp. 5–20. Archived fromthe original(ZIP)on 12 April 2016.Retrieved12 April2016.
  4. ^McFedries, Paul (2013). "Connecting USB Devices".PCs for Grown-Ups: Getting the Most Out of Your Windows 8 Computer.Indianapolis: Que Publishing.ISBN978-0-13-303501-8.Retrieved18 February2016– via Internet Archive.Most PC manufacturers label each USB port using the logo for USB type... the USB 2.0 logo is a trident, while the USB 3.0 logo is a similar trident with the letters 'SS' (which stands for SuperSpeed) attached.
  5. ^ab"USB 3.1 Specification Language Usage Guidelines from USB-IF"(PDF).USB.org.USB Implementers Forum. 28 May 2015. Archived fromthe original(PDF)on 12 March 2016.Retrieved10 March2016.
  6. ^"USB 3.1 Gen 1 & Gen 2 explained".MSI.com.Micro-Star International.5 August 2015.
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