Dicing saw
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Adicing sawis a kind ofsawwhich employs a high-speed spindle fitted with an extremely thindiamond bladeordiamond wire[1]todice, cut, or groove semiconductor wafers,andglass,ceramic,crystal,and many other types of material.
The thickness of the cutting blades used varies with the material being cut, and is of about 20μmto 35 μm when cutting silicon wafers[citation needed].Japanese companies, such as DISCO Corporation and Accretech (Tokyo Seimitsu), account for about 90% of dicing saw sales[citation needed].In the past, cutting 1/2 to 2/3 of wafer thickness was the mainstream; with large diameter wafers ondicing tape,full cut cutting is becoming mainstream[citation needed].
See also
[edit]- Diamond tools
- Disco Corporation– a manufacturer of dicing saws
References
[edit]- ^"Single blade saw or horizontal diamond wire saw?".Thibaut.Retrieved2020-07-29.
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