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Zen 2

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AMD Zen 2
General information
Launched7 July 2019;5 years ago(7 July 2019)[1]
Designed byAMD
Common manufacturers
CPUIDcodeFamily 17h
Cache
L1cache64 KB per core:
  • 32 KB instructions
  • 32 KB data
L2 cache512 KB per core
L3 cache16 MB perCCX(APU: 8 MB)
Architecture and classification
Technology nodeTSMCN7[2][3]
TSMCN6[4]
Instruction setAMD64(x86-64)
Physical specifications
Transistors
  • 5.89 billion (1× CCD) or
    9.69 billion (2× CCD)
    (3.8 billion per 7 nm 8-core "CCD" & 2.09 billion for the 12 nm "I/O die" )[5]
Cores
    • 4–16 (desktop)
    • 24–64 (HEDT)
    • 12–64 (workstation)
    • Up to 64 (server)
    • 2–8 (mobile)
Sockets
Products, models, variants
Product code names
  • Matisse (desktop)
  • Rome (server)[3]
  • Castle Peak (HEDT/workstation)
  • Renoir (Desktop APU, mobile and embedded)
  • Mendocino (mobile and embedded refresh)
Brand names
History
PredecessorZen+
SuccessorZen 3
Support status
Supported

Zen 2is acomputer processormicroarchitecturebyAMD.It is the successor ofAMD'sZenandZen+microarchitectures, and is fabricated on the7 nmMOSFETnode fromTSMC.The microarchitecture powers the third generation ofRyzenprocessors, known asRyzen 3000for the mainstream desktop chips (codename "Matisse" ),Ryzen 4000U/H(codename "Renoir" ) andRyzen 5000U(codename "Lucienne" ) for mobile applications, asThreadripper 3000for high-end desktop systems,[6][7]and asRyzen 4000Gforaccelerated processing units(APUs). The Ryzen 3000 series CPUs were released on 7 July 2019,[8][9]while the Zen 2-basedEpycserver CPUs (codename "Rome" ) were released on 7 August 2019.[10]An additional chip, the Ryzen 9 3950X, was released in November 2019.[8]

At CES 2019, AMD showed a Ryzen third-generationengineering samplethat contained one chiplet with eight cores and 16 threads.[6]AMD CEOLisa Sualso said to expect more than eight cores in the final lineup.[11]AtComputex2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed atE32019, being the aforementioned Ryzen 9 3950X.[12][13]

Zen 2 includes hardware mitigations to theSpectre security vulnerability.[14]Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ( "chiplets") are combined with a 14nmI/Odie (as opposed to the 12nm IOD on Matisse variants) on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (withsimultaneous multithreading) are supported per socket. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X.[15]Zen 2 delivers about 15% moreinstructions per clockthan Zen and Zen+,[16][17]the 14- and 12-nm microarchitectures utilized on first and second generation Ryzen, respectively.

TheSteam Deck,[18][19]PlayStation 5,Xbox Series X and Series Sall use chips based on the Zen 2 microarchitecture, with proprietary tweaks and different configurations in each system's implementation than AMD sells in its own commercially available APUs.[20][21]

Design[edit]

TwodeliddedZen 2 processors designed with the multi-chip module approach. The Ryzen 5 3600 CPU on the left/top (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the Epyc 7702 on the right/bottom (used for high-end desktop, HEDT, Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures,ZenandZen+.Zen 2 moves to amulti-chip moduledesign where theI/Ocomponents of the CPU are laid out on its own, separatedie,which is also called a chiplet in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks inprocess technology,their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD ascore complex diesor CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewermanufacturing defectsthan a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[15][22][23]

Simplified illustration of the Zen 2 microarchitecture
On the left (top on mobile): Die shot of a Zen 2 Core Complex Die. On the middle: Die shot of a Zen 2 EPYC/Threadripper I/O die, On the right (bottom): I/O die of a Zen 2 mainstream Ryzen I/O die.

With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2core complexes(CCXs), each of 4 CPU cores. These chiplets are manufactured usingTSMC's7 nanometerMOSFETnode and are about 74 to 80 mm2in size.[22]The chiplet has about 3.8 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm2and has 2.09 billion transistors.[24]The amount ofL3 cachehas been doubled to 32 MB, with each CCX in the chiplet now having access to 16 MB of L3 compared to the 8 MB of Zen and Zen+.[25]AVX2performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.[26]There are multiple variants of the I/O die: one manufactured onGlobalFoundries14 nanometerprocess, and another manufactured using the same company's12 nanometerprocess. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.[22]Both processes have similar feature sizes, so their transistor density is also similar.[27]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel'sCascade Lakearchitecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165W.[28]

New features[edit]

  • Some newinstruction setextensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT. Each instruction uses its ownCPUIDbit.[29][30]
  • Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[31]
  • Zero-latency memory mirroring optimization (undocumented).[32]
  • Doubled width of the execution units and load store units (from 128-bit to 256-bit) in the floating point coprocessor and significant further throughput enhancements in the multiplication execution unit. This allows the FPU to perform single-cycle AVX2 calculations.[33]

Feature tables[edit]

CPUs[edit]

APUs[edit]

APU features table

Products[edit]

On 26 May 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse" ). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors.[34]

The Matisse I/O die is also used as theX570 chipset.

AMD's second generation ofEpycprocessors, codenamed "Rome", feature up to 64 cores, and were launched on 7 August 2019.[10]

Desktop CPUs[edit]

3000 series (Matisse)[edit]

Common features of Ryzen 3000 desktop CPUs:

  • Socket:AM4.
  • All the CPUs supportDDR4-3200 indual-channelmode.
  • L1cache:64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24PCIe 4.0lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process:TSMC7FF.
Branding and Model Cores
(threads) 		Thermal Solution Clock rate(GHz) L3 cache
(total) 		TDP Chiplets Core
config[i] 		Release
date 		MSRP
Base Boost
Ryzen 9 3950X 16 (32) N/A 3.5 4.7 64 MB 105W[ii] 2 ×CCD
1 ×I/OD 		4 × 4 Nov 25, 2019 US $749
3900XT 12 (24) 3.8 4 × 3 Jul 7, 2020 US $499
3900X Wraith Prism 4.6 Jul 7, 2019
3900[a] OEM 3.1 4.3 65 W Oct 8, 2019 OEM
Ryzen 7 3800XT 8 (16) N/A 3.9 4.7 32 MB 105W 1 ×CCD
1 ×I/OD 		2 × 4 Jul 7, 2020 US $399
3800X Wraith Prism 4.5 Jul 7, 2019
3700X[a] 3.6 4.4 065W[iii] US $329
Ryzen 5 3600XT 6 (12) N/A 3.8 4.5 95 W 2 × 3 Jul 7, 2020 US $249
3600X Wraith Spire (non-LED) 4.4 Jul 7, 2019
3600[a] Wraith Stealth 3.6 4.2 65 W US $199
3500X[37] 6 (6) 4.1 Oct 8, 2019 China
¥1099
3500 OEM 16 MB Nov 15, 2019 OEM(West)
Japan
¥16000[38]
Ryzen 3 3300X 4 (8) Wraith Stealth 3.8 4.3 1 × 4 Apr 21, 2020 US $119
3100 3.6 3.9 2 × 2 US $99
  1. ^Core Complexes (CCXs) × cores per CCX
  2. ^Ryzen 9 3900X and Ryzen 9 3950X may consume over 145W under load.[35]
  3. ^Ryzen 7 3700X may consume 90W under load.[36]
  1. ^abcModel also available asPRO 3600,PRO 3700,PRO 3900,released on September 30, 2019 for OEMs.

Common features of Ryzen 3000 HEDT/workstation CPUs:

  • Socket:sTRX4(Threadripper),sWRX8(Threadripper PRO).
  • ThreadripperCPUs supportDDR4-3200 inquad-channelmode whileThreadripper PROCPUs support DDR4-3200 inocta-channelmode.
  • L1cache:64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • ThreadripperCPUs support 64PCIe 4.0lanes whileThreadripper PROCPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process:TSMC7FF.
Branding and Model Cores
(threads) 		Clock rate(GHz) L3 cache
(total) 		TDP Chiplets Core
config[i] 		Release
date 		MSRP
Base Boost
Ryzen
Threadripper
PRO 		3995WX 64 (128) 2.7 4.2 256 MB 280W
[ii] 		8 ×CCD
1 ×I/OD 		16 × 4 Jul 14, 2020
3975WX 32 (64) 3.5 128 MB 4 ×CCD
1 ×I/OD 		8 × 4
3955WX 16 (32) 3.9 4.3 64 MB 2 ×CCD
1 ×I/OD 		4 × 4
3945WX 12 (24) 4.0 4 × 3
Ryzen
Threadripper 		3990X 64 (128) 2.9 256 MB 8 ×CCD
1 ×I/OD 		16 × 4 Feb 7, 2020 US $3990
3970X 32 (64) 3.7 4.5 128 MB 4 ×CCD
1 ×I/OD 		8 × 4 Nov 25, 2019 US $1999
3960X 24 (48) 3.8 8 × 3 US $1399
  1. ^Core Complexes (CCXs) × cores per CCX
  2. ^Ryzen Threadripper 3990X may consume over 490 W under load.[39]

4000 series (Renoir)[edit]

Based on the Ryzen 4000G seriesAPUsbut with theintegrated graphicsdisabled. Common features of Ryzen 4000 desktop CPUs:

  • Socket:AM4.
  • All the CPUs supportDDR4-3200 indual-channelmode.
  • L1cache:64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24PCIe 3.0lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process:TSMC7FF.
  • Bundled withAMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard andGDDR6RAM. The CPU is soldered, and provides 4PCIe 2.0lanes. These are reportedly cut-down variants of the APUs found on thePlayStation 5andXbox Series X and Srepurposed from defective chip stock.[40][41][42]

Branding and model Cores
(threads) 		Clock rate(GHz) L3 cache
(total) 		TDP Core
config[i] 		Release
date 		MSRP
Base Boost
AMD 4800S[40][41] 8 (16) 4.0 8 MB 2 × 4 2022 bundled with desktop kit
4700S[42] 3.6 75 W 2021
Ryzen 5 4500 6 (12) 4.1 65 W 2 × 3 Apr 4, 2022 US $129
Ryzen 3 4100 4 (8) 3.8 4.0 4 MB 1 × 4 US $99
  1. ^Core Complexes (CCX) × cores per CCX

Desktop APUs[edit]

Common features of Ryzen 4000 desktop APUs:

  • Socket:AM4.
  • All the CPUs supportDDR4-3200 indual-channelmode.
  • L1cache:64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24PCIe 3.0lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integratedGCN 5th generationGPU.
  • Fabrication process:TSMC7FF.
Branding and model CPU GPU TDP Release
date 		Release
price
Cores
(threads) 		Clock rate(GHz) L3 cache
(total) 		Core
Config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 4700G[a] 8 (16) 3.6 4.4 8 MB 2 × 4 Radeon
Graphics[b] 		2.1 512:32:16
8 CU 		2150.4 65 W Jul 21, 2020 OEM
4700GE[a] 3.1 4.3 2.0 2048 35 W
Ryzen 5 4600G[a][43] 6 (12) 3.7 4.2 2 × 3 1.9 448:28:14
7 CU 		1702.4 65 W Jul 21, 2020
(OEM) /
Apr 4, 2022
(retail) 		OEM /
US $154
4600GE[a] 3.3 35 W Jul 21, 2020 OEM
Ryzen 3 4300G[a] 4 (8) 3.8 4.0 4 MB 1 × 4 1.7 384:24:12
6 CU 		1305.6 65 W
4300GE[a] 3.5 35 W
  1. ^Core complexes (CCXs) × cores per CCX
  2. ^Unified shaders:Texture mapping units:Render output unitsandCompute units (CU)
  3. ^Single-precisionperformance is calculated from the base (or boost) core clock speed based on aFMAoperation.
  1. ^abcdefModel also available as PRO version as 4350GE,[44]4350G,[45]4650GE,[46]4650G,[47]4750GE,[48]4750G,[49]released on July 21, 2020 for OEM only.[50]
  2. ^All of the iGPUs are branded asAMD Radeon Graphics.

Mobile APUs[edit]

Renoir (4000 series)[edit]

Common features of Ryzen 4000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate(GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics
[a] 		1.75 512:32:8
8 CU 		1792 35–54W Mar 16, 2020
4900HS 3.0 4.3 35W
Ryzen 7 4800H[51] 2.9 4.2 1.6 448:28:8
7 CU 		1433.6 35–54W
4800HS 35W
4980U[b] 2.0 4.4 1.95 512:32:8
8 CU 		1996.8 10–25W Apr 13, 2021
4800U 1.8 4.2 1.75 1792 Mar 16, 2020
4700U[c] 8 (8) 2.0 4.1 1.6 448:28:8
7 CU 		1433.6
Ryzen 5 4600H[52] 6 (12) 3.0 4.0 2 × 3 1.5 384:24:8
6 CU 		1152 35–54W
4600HS[53] 35W
4680U[b] 2.1 448:28:8
7 CU 		1344 10–25W Apr 13, 2021
4600U[c] 384:24:8
6 CU 		1152 Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 4300U[c] 4 (4) 2.7 3.7 4MB 1 × 4 1.4 320:20:8
5 CU 		896
  1. ^Core Complexes (CCX) × cores per CCX
  2. ^Unified shaders:texture mapping units:render output unitsandcompute units(CU)
  3. ^Single precisionperformance is calculated from the base (or boost) core clock speed based on aFMAoperation.
  1. ^All of the iGPUs are branded asAMD Radeon Graphics.
  2. ^abOnly found on theMicrosoft Surface Laptop 4.
  3. ^abcModel also available as PRO version as 4450U,[54]4650U,[55]4750U,[56]released May 7, 2020.

Lucienne (5000 series)[edit]

Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate(GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8MB 2 × 4 Radeon
Graphics
[a] 		1.9 512:32:8
8 CU 		1945.6 10–25W Jan 12, 2021
Ryzen 5 5500U[57] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU 		1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4MB 1 × 4 1.5 384:24:8
6 CU 		1152
  1. ^Core Complexes (CCX) × cores per CCX
  2. ^Unified shaders:texture mapping units:render output unitsandcompute units(CU)
  3. ^Single precisionperformance is calculated from the base (or boost) core clock speed based on aFMAoperation.
  1. ^All of the iGPUs are branded asAMD Radeon Graphics.

Ultra-mobile APUs[edit]

In 2022, AMD announced the Mendocino ultra-mobile APUs.[58]

Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs supportLPDDR5-5500 indual-channelmode.
  • L1cache:64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4PCIe 3.0lanes.
  • Includes integratedRDNA 2GPU.
  • Fabrication process:TSMC6 nmFinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate(GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Processing
power[ii]
(GFLOPS)
Base Boost
Ryzen 5 7520U[iii] 4 (8) 2.8 4.3 4MB 1 × 4 610M
2 CU 		1.9 486.4 15W September 20, 2022[59]
Ryzen 3 7320U[iii] 2.4 4.1
  1. ^Core Complexes (CCX) × cores per CCX
  2. ^Single precisionperformance is calculated from the base (or boost) core clock speed based on aFMAoperation.
  3. ^abModel also available as Chromebook optimized version as 7520C[60]and 7320C[61]released on May 23, 2023


Embedded APUs[edit]

Model Release
date 		Fab CPU GPU Socket PCIe
support 		Memory
support 		TDP
Cores
(threads) 		Clock rate(GHz) Cache Archi-
tecture 		Config[i] Clock
(GHz) 		Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
V2516[62] November 10, 2020[63] TSMC
7FF 		6 (12) 2.1 3.95 32 KBinst.
32 KBdata
per core 		512KB
per core 		8MB GCN 5 384:24:8
6 CU 		1.5 1152 FP6 20
(8+4+4+4)
PCIe 3.0 		DDR4-3200
dual-channel
LPDDR4X-4266
quad-channel 		10–25W
V2546[62] 3.0 3.95 35–54W
V2718[62] 8 (16) 1.7 4.15 448:28:8
7 CU 		1.6 1433.6 10–25W
V2748[62] 2.9 4.25 35–54W
  1. ^Unified Shaders:Texture Mapping Units:Render Output UnitsandCompute Units (CU)
  2. ^Single-precisionperformance is calculated from the base (or boost) core clock speed based on aFMAoperation.

Server CPUs[edit]

Common features of these CPUs:

  • Codenamed "Rome"
  • Zen 2 microarchitecture
  • TSMC 7 nm process
  • SP3 Socket
  • 128 PCIe lanes
  • Memory support:eight-channelDDR4-3200
Model Release
date 		Price
(USD) 		Fab Chiplets Cores
(threads) 		Core
config[i] 		Clock rate (GHz) Cache Socket
&
Scaling 		TDP
Base Boost L1 L2 L3
7232P August7,
2019 		$450 TSMC
7FF 		2 ×CCD
1 ×I/OD 		8 (16) 4 × 2 3.1 3.2 32KBinst.
32KBdata
(percore) 		512KB
(percore) 		32MB
(8MBperCCX) 		SP3
1P 		120W
7302P $825 4 ×CCD
1 ×I/OD 		16 (32) 8 × 2 3 3.3 128MB
(16MBperCCX) 		155W
7402P $1250 24 (48) 8 × 3 2.8 3.35 180W
7502P $2300 32 (64) 8 × 4 2.5 3.35
7702P $4425 8 ×CCD
1 ×I/OD 		64 (128) 16 × 4 2 3.35 256MB
(16MBperCCX) 		200W
7252 $475 2 ×CCD
1 ×I/OD 		8 (16) 4 × 2 3.1 3.2 64MB
(16MBperCCX) 		SP3
(upto)2P 		120W
7262 $575 4 ×CCD
1 ×I/OD 		8 × 1 3.2 3.4 128MB
(16MBperCCX) 		155W
7272 $625 2 ×CCD
1 ×I/OD 		12 (24) 4 × 3 2.9 3.2 64MB
(16MBperCCX) 		120W
7282 $650 16 (32) 4 × 4 2.8 3.2
7302 $978 4 ×CCD
1 ×I/OD 		8 × 2 3 3.3 128MB
(16MBperCCX) 		155W
7352 $1350 24 (48) 8 × 3 2.3 3.2
7402 $1783 8 × 3 2.8 3.35 180W
7452 $2025 32 (64) 8 × 4 2.35 3.35 155W
7502 $2600 8 × 4 2.5 3.35 180W
7532 $3350 8 ×CCD
1 ×I/OD 		16 × 2 2.4 3.3 256MB
(16MBperCCX) 		200W
7542 $3400 4 ×CCD
1 ×I/OD 		8 × 4 2.9 3.4 128MB
(16MBperCCX) 		225W
7552 $4025 6 ×CCD
1 ×I/OD 		48 (96) 12 × 4 2.2 3.3 192MB
(16MBperCCX) 		200W
7642 $4775 8 ×CCD
1 ×I/OD 		16 × 3 2.3 3.3 256MB
(16MBperCCX) 		225W
7662 $6150 64 (128) 16 × 4 2 3.3 225W
7702 $6450 2 3.35 200W
7742 $6950 2.25 3.4 225W
7H12 September18, 2019 2.6 3.3 280W
7F32 April 14, 2020[64] $2100 4 ×CCD
1 ×I/OD 		8 (16) 8 × 1 3.7 3.9 128MB
(16MBperCCX) 		180W
7F52 $3100 8 ×CCD
1 ×I/OD 		16 (32) 16 × 1 3.5 3.9 256MB
(16MBperCCX) 		240W
7F72 $2450 6 ×CCD
1 ×I/OD 		24 (48) 12 × 2 3.2 3.7 192MB
(16MBperCCX) 		240W
  1. ^Core Complexes (CCX) × cores per CCX

Video game consoles and other embedded[edit]

Gallery[edit]

  • AMD Ryzen 7 3700X
    AMD Ryzen 7 3700X
  • Zen 2 I/O Die
    Zen 2 I/O Die
  • Infrared die shot of the I/O Die
    Infrared die shot of the I/O Die
  • EPYC I/O Die
    EPYC I/O Die
  • Zen 2 Core Complex Die (CCD)
    Zen 2 Core Complex Die (CCD)
  • AMD EPYC 7702 server processor.
    AMD EPYC 7702 server processor.
  • A delidded AMD 7702 featuring 8 CCDs and 1 I/O die, with remains of the solder thermal interface material (TIM) on the chiplets.
    AdeliddedAMD 7702 featuring 8 CCDs and 1 I/O die, with remains of the solder thermal interface material (TIM) on the chiplets.

See also[edit]

Wikimedia Commons has media related toZen 2 microarchitecture.

References[edit]

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  3. ^abCutress, Ian (20 June 2017)."AMD EPYC Launch Event Live Blog".AnandTech.Retrieved21 June2017.
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  7. ^online, heise."AMD Ryzen 3000: 12-Kernprozessoren für den Mainstream".c't Magazin.
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  12. ^Curtress, Ian (26 May 2019)."AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7".AnandTech.Retrieved3 July2019.
  13. ^Thomas, Bill (10 June 2019)."AMD announces the Ryzen 9 3950X, a 16-core mainstream processor".TechRadar.Retrieved3 July2019.
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