FLIP-CHIP TVS DIODES
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
CHFP6KE5.0
thru
CHFP6KE170CA
Patented Flip-Chip Series
FEATURES
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Unidirectional and Bidirectional
Fully glass passivated
600 watt (10/1000 ms)
Eliminates wire bonding
NON Inductive Insertion
No voltage overshoot
MAXIMUM RATINGS
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Max Junction Temperature: 1500C (with conformal coating)
Storage Temperature: -550C to +1500C
Flip-Chip Peak Pulse Power: 600 Watts (10/1000 ms)
Maximum non-repetitive peak power 600 Watts (10/1000 ms)
Total continuous power dissipation 2.5 W (with adequate heat
sink @ 750C)
MECHANICAL
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Weight: 0.01 grams (approximate)
Solderable standoff tabs .040X.040X.010
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Turn-on time (theoretical) unidirectional 1X10-12
Turn-on time (theoretical) bidirectional 1X10-9
PACKAGING
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Waffle package 50 pices or wafer ring 70 pieces
BIDIRECTIONAL ALL DIMENSIONS NOMINAL
inches (mm)
FLIP-CHIP DIMENSIONS
PAD SIZE & CIRCUIT
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL
inches (mm)
FLIP-CHIP DIMENSIONS
PAD SIZE & CIRCUIT
VBR above 30 V
VBR 30V and below
MSC1596.PDF
ISO 9001 CERTIFIED
REV B 3/13/2000
MICROSEMI [ Microsemi ]
